4LGA 771 Socket Mechanical Design Guide
Figures
3-1 Cross-sectional view of Package / Socket stackup height1.......................................15
3-2 Definition of R...................................................................................................17
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................21
A-1 LGA Socket Assembly Drawing (Sheet 1 of 4)........................................................26
A-2 LGA Socket Assembly Drawing (Sheet 2 of 4)........................................................27
A-3 LGA Socket Assembly Drawing (Sheet 3 of 4)........................................................28
A-4 LGA Socket Assembly Drawing (Sheet 4 of 4)........................................................29
A-5 LGA771 Socket Motherboard Footprint (Sheet 1 of 7).............................................30
A-6 LGA771 Socket Motherboard Footprint (Sheet 2 of 7).............................................31
A-7 LGA771 Socket Motherboard Footprint (Sheet 3 of 7).............................................32
A-8 LGA771 Socket Motherboard Footprint (Sheet 4 of 7...............................................33
A-9 LGA771 Socket Motherboard Footprint (Sheet 5 of 7).............................................34
A-10 LGA771 Socket Motherboard Footprint (Sheet 6 of 7).............................................35
A-11 LGA 771 Socket Motherboard Footprint (Sheet 7 of 7)............................................36
A-12 LGA 771 Socket Footprint (Sheet 1 of 2) ..............................................................37
A-13 LGA 771 Socket Footprint (Sheet 2 of 2) ..............................................................38
Tables
3-1 Intel® Xeon® 5000 Sequence Package and Socket Stackup Height..........................15
3-2 Socket Loading Specifications..............................................................................16
4-1 LGA771 Socket Electrical Requirements................................................................19
5-1 Use Conditions Environment................................................................................22