Intel LGA 771 manual Package/Socket Stackup Height, Socket Loading Specifications

Mechanical Requirements

3.5Package/Socket Stackup Height

Table 3-1provides the stackup height of the processor package and LGA771 socket.

Table 3-1. Intel® Xeon® 5000 Sequence Package and Socket Stackup Height

Processor	Integrated Stackup Height 1 (mm)
	From Top of Board to Top of IHS
Dual-Core Intel® Xeon® Processor 5000 Series	7.628 - 8.120
Dual-Core Intel® Xeon® Processor 5100 Series	7.693 - 8.155
Quad-Core Intel® Xeon® Processor 5300 Series	7.604 - 8.124

Notes:

1.Preliminary Guidance. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in the LGA771 Socket Mechanical Design Guide with its tolerances; (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet.

Figure 3-1. Cross-sectional view of Package / Socket stackup height1

Notes:

1. Not to scale. Shown for illustrative purposes only.

3.6Socket Loading Specifications

Table 3-2provides dynamic and static load specifications for the LGA771 socket. These mechanical load limits should not be exceeded during heatsink assembly, mechanical stress testing or standard drop and shipping conditions. The heatsink attach solutions must not include continuous stress onto the socket with the exception of a uniform load to maintain the heatsink-to-processor thermal interface. Also, any mechanical system or component testing should not exceed these limits. The socket body should not be used as a mechanical reference or load-bearing surface for thermal or mechanical solutions.

LGA 771 Socket Mechanical Design Guide 15