Functional Architecture

Intel® Server Board SE7501WV2

•The ICH3-S provides a 32-bit/33-MHz PCI bus hereafter called P32-A.

•The P64H2 provides two independent 64-bit, 133-MHz PCI-X buses hereafter called P64-B, and P64-C.

This independent bus structure allows all three PCI buses to operate concurrently.

3.2.1MCH Memory Architecture

The MCH supports a 144-bit wide Memory Sub-system that can support a maximum of 12 GB (using 2 GB DIMMs). This configuration needs external registers for buffering the memory address and control signals. In this configuration the MCH supports six DDR266 compliant registered stacked DIMMs for a maximum of 12 GB. (DDR200 DIMMs are supported when 400MHz processors are used.) The six chip selects are registered inside the MCH and need no external registers for chip selects.

The memory interface runs at 266 MHz. (200 MHz when DDR-200 modules and 400 MHz processors are used.) The memory interface supports a 144-bit wide memory array. It uses fifteen address lines (BA[1:0] and MA[12:0]) and supports 64 Mb, 128 Mb, 256 Mb, 512 Mb DRAM densities. The DDR DIMM interface supports memory scrubbing, single-bit error correction, and multiple bit error detection as well as the Intel® Single Device Data Correction features.

3.2.1.1DDR Configurations

The DDR interface supports up to 12GB of main memory and supports single- and double-density DIMMs.

3.2.2MCH North Bridge

The E7501 MCH North Bridge (MCH) is a 1005 ball FC-BGA device and uses the proven components of previous generations like the Intel® Pentium® 4 bus interface unit, the Hub Interface unit, and the DDR memory interface unit. In addition, the MCH incorporates a Hub Interface (HI). The hub interface enables the MCH to directly interface with the P64H2. The MCH also increases the main memory interface bandwidth and maximum memory configuration with a 144-bit wide memory interface.

The MCH integrates three main functions:

•An integrated high performance main memory subsystem.

•An HI 2.0 bus interface that provides a high-performance data flow path between the host bus and the I/O subsystem.

•A HI 1.5 bus which provides an interface to the ICH3-S (South Bridge).

Other features provided by the MCH include the following:

•Full support of ECC on the memory bus

•Full support of the Intel® Single Device Data Correction features.

•Twelve deep in-order queue

•Full support of registered DDR266 ECC DIMMs (DDR200 DIMMs when 400MHz processors are used)

•Support for 12 GB of DDR memory

•Memory scrubbing

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Intel reference number C25653-001

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Intel SE7501WV2 manual MCH Memory Architecture, MCH North Bridge, DDR Configurations
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SE7501WV2 specifications

The Intel SE7501WV2 is a versatile server motherboard designed to meet the demanding needs of modern computing environments. Engineered with a focus on performance, reliability, and flexibility, this motherboard is tailored for a range of applications, from entry-level servers to high-performance computing tasks.

One of the main features of the SE7501WV2 is its support for Intel's Xeon processors, specifically those based on the Netburst architecture. This compatibility allows for powerful multi-threaded processing capabilities, making it ideal for businesses seeking to optimize their server performance. The motherboard supports dual CPU configurations, enabling up to two processors to work simultaneously, thereby increasing computational power and efficiency.

The motherboard incorporates Intel's advanced server management technologies such as Intel Active Monitoring Technology, which helps in monitoring system health and optimizing power usage. Additionally, it features Intel's I/O Acceleration Technology, which enhances data throughput and reduces latencies, ensuring that applications run smoothly and efficiently.

Another significant characteristic of the SE7501WV2 is the memory capacity it offers. With support for up to 16 GB of ECC (Error-Correcting Code) DDR SDRAM, the motherboard helps in maintaining system stability during high workloads. The ECC memory not only prevents data corruption but also significantly enhances the reliability of mission-critical applications.

For connectivity, the SE7501WV2 comes equipped with multiple PCI-X slots, enabling the addition of various expansion cards for network, storage, and graphic capabilities. This expandability is crucial for enterprises that need to adapt their server architecture to evolving workloads.

Moreover, the SE7501WV2 features integrated high-performance RAID support, improving data redundancy and performance. This feature is essential for organizations that prioritize data security and require robust backup solutions.

In terms of power management, the motherboard supports advanced power features that help reduce operational costs while maximizing performance. The design ensures efficient power consumption, allowing it to run cooler and quieter, which is particularly beneficial for noisy data center environments.

In conclusion, the Intel SE7501WV2 motherboard is designed for those who require robust performance, reliability, and flexibility in server applications. With its support for dual Xeon processors, extensive memory capabilities, advanced management technologies, and expandability, it stands out as a solid solution for many enterprise-level computing needs.
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