Intel® Server Board SE7501WV2 TPS

Functional Architecture

double-bit error is detected during POST, the BIOS sends a Set DIMM State command to the BMC indicating that the DIMM LED is lit.

3.1.2.5Intel® Single Device Data Correction feature

The SE7501WV2 server board supports Intel’s Single Device Data Correction correct memory architecture, which gives the memory sub-system the ability to withstand a multi-bit failure within a DRAM device, including a failure that causes incorrect data on all data bits of the device.

3.2Intel® E7501 Chipset

The SE7501WV2 server board is designed around the Intel® E7501 chipset. The chipset provides an integrated I/O bridge and memory controller, and a flexible I/O subsystem core (PCI-X). This is targeted for multiprocessor systems and standard high-volume servers. The Intel E7501 chipset consists of three components:

•MCH: Memory Controller Hub North Bridge. The MCH North Bridge accepts access requests from the host (processor) bus and directs those accesses to memory or to one of the PCI buses. The MCH monitors the host bus, examining addresses for each request. Accesses may be directed to a memory request queue for subsequent forwarding to the memory subsystem, or to an outbound request queue for subsequent forwarding to one of the PCI buses. The MCH also accepts inbound requests from the P64H2 and the ICH3-S. The MCH is responsible for generating the appropriate controls to control data transfer to and from memory.

•P64H2: PCI-X 64bit Hub 2.0 I/O Bridge. The P64H2 provides the interface for two 64- bit, 133MHz Rev. 1.0 compliant PCI-X buses. The P64H2 is both master and target on both PCI-X buses.

•ICH3-S: South Bridge. The ICH3-S controller has several components. It provides the interface for a 32-bit, 33-MHz Rev. 2.2-compliant PCI bus. The ICH3-S can be both a master and a target on that PCI bus. The ICH3-S also includes a USB controller and an IDE controller. The ICH3-S is also responsible for much of the power management functions, with ACPI control registers built in. The ICH3-S also provides a number of GPIO pins and has the LPC bus to support low speed legacy I/O.

The MCH, P64H2, and ICH3-S chips provide the pathway between processor and I/O systems. The MCH is responsible for accepting access requests from the host (processor) bus, and directing all I/O accesses to one of the PCI buses or legacy I/O locations. If the cycle is directed to one of the 64-bit PCI segments, the MCH communicates with the P64H2 through a private interface called the HI (Hub Interface). If the cycle is directed to the ICH3-S, the cycle is output on the MCH’s 8bit HI 1.5 bus. The P64H2 translates the HI 2.0 bus operation to a 64-bit PCI-X Rev. 1.0-compliant signaling environment operating from 100MHz to 133 MHz. The ICH3-S translates the HI 1.5 bus operation to a 32-bit PCI Rev. 2.2-compliant signaling environment operating at 33MHz.

The HI 2.0 bus is 16 bits wide and operates at 66 MHz with 512MT/s, providing over 1 GB per second of bandwidth.

All I/O for the SE7501WV2 server board, including PCI and PC-compatible I/O, is directed through the MCH and then through either the P64H2 or the ICH3-S provided PCI buses.

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Intel reference number C25653-001

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Intel SE7501WV2 manual Intel E7501 Chipset, Intel Single Device Data Correction feature
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SE7501WV2 specifications

The Intel SE7501WV2 is a versatile server motherboard designed to meet the demanding needs of modern computing environments. Engineered with a focus on performance, reliability, and flexibility, this motherboard is tailored for a range of applications, from entry-level servers to high-performance computing tasks.

One of the main features of the SE7501WV2 is its support for Intel's Xeon processors, specifically those based on the Netburst architecture. This compatibility allows for powerful multi-threaded processing capabilities, making it ideal for businesses seeking to optimize their server performance. The motherboard supports dual CPU configurations, enabling up to two processors to work simultaneously, thereby increasing computational power and efficiency.

The motherboard incorporates Intel's advanced server management technologies such as Intel Active Monitoring Technology, which helps in monitoring system health and optimizing power usage. Additionally, it features Intel's I/O Acceleration Technology, which enhances data throughput and reduces latencies, ensuring that applications run smoothly and efficiently.

Another significant characteristic of the SE7501WV2 is the memory capacity it offers. With support for up to 16 GB of ECC (Error-Correcting Code) DDR SDRAM, the motherboard helps in maintaining system stability during high workloads. The ECC memory not only prevents data corruption but also significantly enhances the reliability of mission-critical applications.

For connectivity, the SE7501WV2 comes equipped with multiple PCI-X slots, enabling the addition of various expansion cards for network, storage, and graphic capabilities. This expandability is crucial for enterprises that need to adapt their server architecture to evolving workloads.

Moreover, the SE7501WV2 features integrated high-performance RAID support, improving data redundancy and performance. This feature is essential for organizations that prioritize data security and require robust backup solutions.

In terms of power management, the motherboard supports advanced power features that help reduce operational costs while maximizing performance. The design ensures efficient power consumption, allowing it to run cooler and quieter, which is particularly beneficial for noisy data center environments.

In conclusion, the Intel SE7501WV2 motherboard is designed for those who require robust performance, reliability, and flexibility in server applications. With its support for dual Xeon processors, extensive memory capabilities, advanced management technologies, and expandability, it stands out as a solid solution for many enterprise-level computing needs.
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