around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)
3.The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.
| Hot-air |
| Flat Pack-IC |
| Desoldering |
CBA | Machine |
|
Masking | Flat Pack-IC |
Tape | |
Tweezers | |
| Fig. S-1-2 |
With Soldering Iron:
1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
Flat Pack-IC | Desoldering Braid |
|
Soldering Iron
Fig. S-1-3
2.Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip 
Soldering Iron
Fig. S-1-4
3.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)
4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
