￿ ￿ ￿ ￿ ￿ ￿

￿￿￿￿￿￿￿￿￿￿￿ ￿￿￿ ￿￿￿￿￿

￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿

￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿ ￿

￿

￿ ￿ ￿ ￿ ￿

PCI Bus – supports Rev 2.2 spec and 4/ 6 (optional) master devices

Dual UltraDMA33/ 66 (optional) IDE controller

Dual USB controller (12Mbps or 1.5Mbps)

AC’97 link for audio/ telephony CODEC’s

SMbus controller (motherboard management)

Interrupt Controller – integrated I/O APIC capability

GPIO functions – TTL, Open-Drain, Inversion

Enhanced DMA controller

Real-time clock – 256 byte battery-backed CMOS RAM

￿ACPI power management logic

Low Pin Count (LPC) interface (Super I/O connection)

￿￿￿￿￿￿￿￿￿￿￿

The second level cache is contained within the processor module. There is no provision for a third level cache. Cache size is determined by the type of CPU fitted, refer to your CPU manufacturer for this information.

￿!￿￿￿￿￿

There are two DIMM sockets on the motherboards that accept 168-pin un-buffered SDRAM modules to the Intel PC SDRAM un-buffered memory module specification. PC100 modules are required. All modules must support SPD (serial presence detect) to allow the BIOS to determine the memory configuration and set up the chipset optimally. These modules contain a small EEPROM that describes the module capabilities in detail - including speed, capacity and organisation. EDO and registered DIMM modules are not supported.

64-bit or 72-bit ECC modules.

2 or 4 bank organisation

￿Asymmetric or symmetric memory addressing. Single or double-sided modules.

MITSUBISHI ELECTRIC MOTHERBOARD DIVISION

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Mitsubishi Electronics FC810 manual Mitsubishi Electric Motherboard Division