Q-Logic QLA2300 manual Specifications, Appendix B, Table B-1. QLA23xx Board Operating Environment

Appendix B

Specifications

Table B-1. QLA23xx Board Operating Environment

Environment	Minimum	Maximum
Operating temperature	0° C/32° F	55° C/131° F
Storage temperature	-20 ° C/-4 ° F	70° C/158° F
Relative humidity (noncondensing)	10%	90%
Storage humidity (noncondensing)	5%	95%

	Table B-2. QLA23xx Board Specifications
Type		Specification
Host bus	Conforms to PCI Local Bus Specification, revision 2.2 and the PCI-X
	Addendum, revision 1.0
PCI/PCI-X	3.3 V and 5.0 V buses supported
signaling
environment
PCI/PCI-X	132	MBps maximum burst rate for 32-bit PCI operation at 33 MHz
transfer rate	264	MBps maximum burst rate for 32-bit PCI/PCI-X operation at 66 MHz
	264	MBps maximum burst rate for 64-bit PCI operation at 33 MHz
	528	MBps maximum burst rate for 64-bit PCI/PCI-X operation at 66 MHz
	1GBps maximum burst rate for 64-bit PCI-X operation at 133 MHz
	(QLA2312F/2312FL)
Fibre	Bus type: Copper media, twisted pair (QLA2300/QLA2310)
Channel		Multimode fibre optic media (QLA2300F/QLA2302F/QLA2310F/
specifications		QLA2312F/QAL2312FL)
	Bus transfer rate: 200 MBps maximum at half-duplex
		400 MBps maximum at full-duplex
	Interface chip: ISP2300 (PCI QLA2300/2300F/2302F boards)
		ISP2310 (PCI-X QLA2310/2310F/2310FL boards)
		ISP2312 (PCI-X QLA2312F/2312FL boards)
CPU	Single-chip design that includes a QLogic RISC processor, Fibre Channel
	protocol manager, PCI/PCI-X DMA controller, and integrated
	serializer/deserializer (SERDES) and electrical transceivers that can
	auto-negotiate a data rate of 1 Gbps or 2 Gbps
RAM	256	KB of sync SRAM supporting parity protection
BIOS ROM	128	KB of flash ROM in two 64-KB, software selectable banks. The flash
	is field programmable.

FC2251101-00 D B-1