GREEK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ΤΕΧΝΙΚΈΣ ΠΡΟΔΙΑΓΡΑΦΈΣ

 

 

 

 

ΣΗΜΕΙΏΣΕΙΣ

 

 

ΗSAMSUNG προσπαθεί συνεχώς να βελτιώνει τα προϊόντα της. Επομένως, οι προδιαγραφές σχεδιασμού και αυτές οι οδηγίες χρήσης ενδέχεται να τροποποιηθούν χωρίς προειδοποίηση.

Μοντέλο

GS89F/GS89F-SP

 

 

Πηγή ρεύματος

230 V ~ 50 Hz

 

 

Κατανάλωση ισχύος

 

Μικροκύματα

1200 W

Γκριλ

1100 W

Συνδυασμένη λειτουργία

2300 W

 

 

Ισχύς εξόδου

100 W / 800 W (IEC-705)

 

 

Συχνότητα λειτουργίας

2450 MHz

 

 

Μάγνητρο

OM75P(31)

 

 

Μέθοδος ψύξης

Μοτέρ με ανεμιστήρα ψύξης

 

 

Διαστάσεις (Π x Υ x Β)

 

Εξωτερικά

489 x 275 x 390 mm

Κοιλότητα φούρνου

330 x 211 x 324 mm

 

 

Όγκος

23 λίτρα

 

 

Βάρος

 

Καθαρό

13,5 kg περίπου

 

 

34

GS89F-1S_ELE_DE68-03817W_EL.indd 34

2012-06-08 �� 5:56:54

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Samsung GS89F-1S/ELE manual Τεχνικέσ Προδιαγραφέσ Σημειώσεισ, Μοντέλο

GS89F-1S/ELE specifications

The Samsung GS89F-1S/ELE is a sophisticated system-on-chip (SoC) that showcases the latest advancements in semiconductor technology. Designed for various applications ranging from mobile devices to embedded systems, this chip combines high performance, energy efficiency, and cutting-edge features.

At the heart of the GS89F-1S/ELE is its powerful processor architecture, which typically incorporates multiple cores. This multi-core configuration allows for efficient multitasking and improved performance in computationally intensive applications. The chip leverages advanced manufacturing processes to achieve higher clock speeds while maintaining lower power consumption, which is essential for battery-operated devices.

One of the standout features of the GS89F-1S/ELE is its integrated graphics processing unit (GPU), which enhances the multimedia capabilities of devices. With support for high-definition video playback and advanced graphical rendering, users can enjoy a rich visual experience. This feature is particularly beneficial for gaming applications and high-resolution media consumption.

Moreover, the GS89F-1S/ELE includes built-in artificial intelligence (AI) capabilities. These AI processing units allow for on-device machine learning, enabling functionalities such as voice recognition, image processing, and smart camera features. The inclusion of AI technology enhances user interactions, as devices can adapt and respond to user needs more effectively.

Connectivity is another key attribute of the GS89F-1S/ELE. It typically supports a wide range of wireless communication standards, including 5G, Wi-Fi 6, and Bluetooth. This versatility ensures fast and reliable connections for seamless data transfer and communication between devices.

Security features are integral to the design of the GS89F-1S/ELE as well. The chip often includes hardware-based security mechanisms such as trusted execution environments (TEE) and encryption modules. These features help protect sensitive data and ensure secure transactions, which is particularly important in today's digital landscape.

In summary, the Samsung GS89F-1S/ELE represents a significant leap in SoC technology. With its robust processing power, advanced graphics capabilities, integrated AI functions, and enhanced connectivity, it is well-suited for a variety of applications. Its emphasis on energy efficiency and security further solidifies its status as a top choice for manufacturers looking to deliver cutting-edge devices in an increasingly competitive market.