Unbuffered SODIMM

datasheet

Rev. 1.0

DDR3 SDRAM

[ Table 17 ] Timing Parameters by Speed Bin (Cont.)

Speed

 

DDR3-800

DDR3-1066

DDR3-1333

DDR3-1600

Units

NOTE

Parameter

Symbol

MIN

MAX

MIN

MAX

MIN

 

MAX

MIN

 

MAX

 

 

 

 

Command and Address Timing

 

 

 

 

 

 

 

 

 

 

 

 

 

DLL locking time

tDLLK

512

-

512

-

512

 

-

512

 

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

internal READ Command to PRECHARGE Command

 

max

 

max

 

max

 

 

max

 

 

 

 

tRTP

(4nCK,7.5ns

-

-

 

-

 

-

 

e

delay

(4nCK,7.5ns)

(4nCK,7.5ns)

 

(4nCK,7.5ns)

 

 

 

)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Delay from start of internal write transaction to internal

 

max

 

max

 

max

 

 

max

 

 

 

 

tWTR

(4nCK,7.5ns

-

-

 

-

 

-

 

e,18

read command

(4nCK,7.5ns)

(4nCK,7.5ns)

 

(4nCK,7.5ns)

 

 

 

)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WRITE recovery time

tWR

15

-

15

-

15

 

-

15

 

-

ns

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mode Register Set command cycle time

tMRD

4

-

4

-

4

 

-

4

 

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mode Register Set command update delay

tMOD

max

-

max

-

max

 

-

max

 

-

 

 

(12nCK,15n

(12nCK,15ns

(12nCK,15ns

 

 

 

 

 

(12nCK,15ns)

 

 

 

 

 

 

 

 

 

s)

 

)

 

)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAS# to CAS# command delay

tCCD

4

-

4

-

4

 

-

4

 

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Auto precharge write recovery + precharge time

tDAL(min)

 

 

WR + roundup (tRP / tCK(AVG))

 

 

 

 

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Multi-Purpose Register Recovery Time

tMPRR

1

-

1

-

1

 

-

1

 

-

nCK

22

 

 

 

 

 

 

 

 

 

 

 

 

 

ACTIVE to PRECHARGE command period

tRAS

See “Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin” on page 42

 

ns

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ACTIVE to ACTIVE command period for 1KB page size

tRRD

max

-

max

-

max

 

-

max

 

-

 

e

(4nCK,10ns)

(4nCK,7.5ns)

(4nCK,6ns)

 

(4nCK,6ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ACTIVE to ACTIVE command period for 2KB page size

tRRD

max

-

max

-

max

 

-

max

 

-

 

e

(4nCK,10ns)

(4nCK,10ns)

(4nCK,7.5ns)

 

(4nCK,7.5ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Four activate window for 1KB page size

tFAW

40

-

37.5

-

30

 

-

30

 

-

ns

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Four activate window for 2KB page size

tFAW

50

-

50

-

45

 

-

40

 

-

ns

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tIS(base)

200

-

125

-

65

 

-

45

 

-

ps

b,16

 

 

 

 

 

AC175

 

 

Command and Address setup time to CK, CK referenced

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to VIH(AC) / VIL(AC) levels

tIS(base)

200 + 150

-

125 + 150

-

65+125

 

-

45+125

 

-

ps

b,16,27

 

 

 

 

 

AC150

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Command and Address hold time from CK,

 

 

refer-

tIH(base)

 

 

 

 

 

 

 

 

 

 

 

 

CK

275

-

200

-

140

 

-

120

 

-

ps

b,16

enced to VIH(AC) / VIL(AC) levels

DC100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Control & Address Input pulse width for each input

tIPW

900

-

780

-

620

 

-

560

 

-

ps

28

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Calibration Timing

 

 

 

 

 

 

 

 

 

 

 

 

 

Power-up and RESET calibration time

tZQinitI

512

-

512

-

512

 

-

512

 

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Normal operation Full calibration time

tZQoper

256

-

256

-

256

 

-

256

 

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Normal operation short calibration time

tZQCS

64

-

64

-

64

 

-

64

 

-

nCK

23

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Reset Timing

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Exit Reset from CKE HIGH to a valid command

tXPR

max(5nCK,

tRFC + 10ns)

-

max(5nCK,

tRFC + 10ns)

-

max(5nCK,

tRFC + 10ns)

-

max(5nCK,

tRFC + 10ns)

-

Self Refresh Timing

Exit Self Refresh to commands not requiring a locked

tXS

max(5nCK,t

-

max(5nCK,tR

-

max(5nCK,tR

-

max(5nCK,tR

-

 

 

DLL

RFC + 10ns)

FC + 10ns)

FC + 10ns)

FC + 10ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Exit Self Refresh to commands requiring a locked DLL

tXSDLL

tDLLK(min)

-

tDLLK(min)

-

tDLLK(min)

-

tDLLK(min)

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

Minimum CKE low width for Self refresh entry to exit tim-

tCKESR

tCKE(min) +

-

tCKE(min) +

-

tCKE(min) +

-

tCKE(min) +

-

 

 

ing

1tCK

1tCK

1tCK

1tCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Valid Clock Requirement after Self Refresh Entry (SRE)

tCKSRE

max(5nCK,

-

max(5nCK,

-

max(5nCK,

-

max(5nCK,

-

 

 

or Power-Down Entry (PDE)

10ns)

10ns)

10ns)

10ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Valid Clock Requirement before Self Refresh Exit (SRX)

tCKSRX

max(5nCK,

-

max(5nCK,

-

max(5nCK,

-

max(5nCK,

-

 

 

or Power-Down Exit (PDX) or Reset Exit

10ns)

10ns)

10ns)

10ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

- 27 -

Page 27
Image 27
Samsung M471B1G73AH0 specifications Reset Timing

M471B1G73AH0 specifications

The Samsung M471B1G73AH0 is a high-performance DDR4 SO-DIMM memory module designed for laptops and compact systems. This specific RAM chip showcases a balance of speed, efficiency, and reliability, making it an ideal choice for both everyday users and professionals seeking enhanced system performance.

One of the main features of the M471B1G73AH0 is its capacity. With 8GB of memory, it provides ample space for multitasking, allowing users to run multiple applications simultaneously without experiencing slowdowns. This is particularly beneficial for users who require a robust performance for tasks such as video editing, gaming, or running virtual machines.

The module operates at a frequency of 2400 MHz, tapping into the capabilities of DDR4 technology. This frequency ensures that data can be transferred quickly, enhancing overall system responsiveness. The DDR4 specification also brings improvements in power efficiency compared to its predecessor, DDR3, resulting in lower energy consumption and prolonged battery life in portable devices.

Another notable aspect of the M471B1G73AH0 is its latency. With a CAS latency of CL17, this module strikes a good balance between speed and response time, ensuring that data retrieval and execution are efficient, which is crucial for both applications and system processes.

Samsung’s advanced manufacturing technology is evident in this module, which employs 20nm process technology to produce high-density chips. This not only contributes to lower power consumption but also results in a smaller physical footprint, allowing for increased memory density in compact devices.

In terms of compatibility, the M471B1G73AH0 is designed to support a wide range of platforms. It adheres to the standard SO-DIMM form factor, making it compatible with most laptops and all-in-one systems. This versatility allows users to easily upgrade their existing systems for enhanced performance.

Additionally, the module includes features such as ECC (Error-Correcting Code) capabilities for certain variants, which helps in identifying and correcting memory errors, thereby increasing system reliability—an essential aspect for critical applications.

In conclusion, the Samsung M471B1G73AH0 is a robust DDR4 memory solution that delivers solid performance and reliability. With its 8GB capacity, 2400 MHz frequency, and energy-efficient design, it is suitable for a wide range of computing needs, making it a popular choice among users looking to upgrade their systems for improved efficiency and responsiveness.