12.1, 13.1, 13.2 | Telit Wireless Solutions GE863-PY, GE863-QUAD

			GE863-QUAD
			GE863-PY
12	Camera		1vv0300715 Rev. 1 - 19/09/06
12	Camera		60
12.1		Transchip Camera	60
	12.1.1	Camera Interface Connectors	61
	12.1.2 EVB for Transchip camera support		63
	12.1.3 Block Diagram for supported cameras		64
	12.1.4 Schematic Diagrams for supported camera		65
	12.1.5 Example usage script for camera		66
13	Mounting the GE863-QUAD / PY on the Application Board		67
13.1		General	67
13.2		Module Finishing & Dimensions	67
	13.2.1 Recommended foot print for the application		69
	13.2.2 Debug of the GE863 in Production		70
	13.2.3	Stencil	70
	13.2.4	PCB pad Design	70
	13.2.5	Solder paste	71
	13.2.6 GE863-QUAD / PY Solder Reflow		72
	13.2.7	Packing System	74
	13.2.8	Moisture Sensibility	76
14	Conformity Assessment Issues		77
15	SAFETY RECOMMANDATIONS		78
16	Document Change Log		79

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Telit Wireless Solutions GE863-PY, GE863-QUAD manual 12.1, 13.1, 13.2

Contents

GE863-QUAD GE863-PY Hardware User Guide Contents 10.1 10.210.3 10.4 13.1 12.113.2 This document is relating to the following products Overview GE863 module connections PIN-OUT Pin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Hardware Commands Turning on the GE863-QUAD/PY Turning OFF the GE863-QUAD/PY Turning off of the device can be done in two ways Hardware Unconditional Reboot Hardware shutdown GE863-QUAD 1Power Supply Requirements Power SupplyGE863-QUAD/PY power requirements are 2General Design Rules Electrical design Guidelines 1.2 + 12V input Source Power Supply Design Guidelines An example of linear regulator with 5V input is Battery Source Power Supply Design Guidelines An example of switching regulator with 12V input is Battery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines Antenna GSM Antenna Requirements Serial Ports GSM Antenna installation GuidelinesGSM Antenna PCB line Guidelines Absolute Maximum Ratings -Not Functional Parameter Min Max Level Min Max Signals in the Uart connector on the EVK are Number Pad Number17-28-36 Ground 45-48-50-56 Clear to Send Output from the GE863-QUAD/PY that 2MODEM Serial Port 2 Python Debug It is available on the following pins3RS232 level translation An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS Microphone Paths Characteristic and Requirements Echo canceller type HandsetEcho canceller type Car kit hands-free + 20dB That means You can set GA= +20dB to use standard resistor values TIP environment consideration General Design Rules Other considerations Microphone Biasing Balanced Microphone Biasing Unbalanced Microphone Biasing GE863-QUAD Buffered Balanced Mic Microphone BufferingSample circuit can be Gain = RR604605 = RR607606 Buffer gain is given by the formula Buffered Unbalanced Single Ended Microphone Freq . = 2π * R719* C726 2π * R711* C727 Buffer bandwidth at -3dB shall be 4KHz GE863-QUAD Output Lines Speaker Short description Output Lines Characteristics SW volume level step Number of SW volume steps Noise Filtering Handset Earphone Design Hands-Free Earphone Low Power Design An example of internal Ear amplifier could be Car Kit Speakerphone Design Evaluation Kit for Telit Modules EVK2 Short Description 2 EVK2 Audio Lines Characteristics @ 350mW Data Integrity ESD Schematic SIM Supply Layout Using a Gpio Pad as Output Using a Gpio Pad as InputGeneral Purpose I/O 10.3Using the Alarm Output GPIO6 Using the Buzzer Output GPIO7 DAC and ADC section 11.1DAC ConverterDescription Min Max Units An AT command is available to use the DAC function Command is AT#DAC=enable,valueEnabling DAC Low Pass Filter Example Input Voltage range AD conversion Bits Resolution Using ADC Converter11.2ADC Converter Camera 12.1Transchip CameraType Sensitivity Lux Camera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Example usage script for camera Camera setting shown here are the defaults onesTaking an reading a photo Mounting the GE863-QUAD / PY on the Application Board 13.2Module Finishing & Dimensions13.1General Surface finishing Ni/Au for all test pads Lead-free Alloy Recommended foot print for the application Stencil Debug of the GE863 in ProductionPCB pad Design Solder paste 13.2.6 GE863-QUAD / PY Solder Reflow Following is the recommended solder reflow profile GE863-QUAD Packing System Section A-A Modules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Document Change Log Revision Date Changes21/02/06 19/09/06