Telit Wireless Solutions GE863-QUAD, GE863-PY manual Solder paste

GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

Recommendations for PCB pad dimensions
	Ball pitch [mm]	2
	Solder resist opening diameter A [mm]	1,150
	Metal pad diameter B [mm]	1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish	Layer thickness [µm]	Properties
Electro-less Ni /	3 –7 /	good solder ability protection, high
Immersion Au	0.05 – 0.15	shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

13.2.5Solder paste

	Lead free
Solder paste	Sn/Ag/Cu

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