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Telit Wireless Solutions GE863-QUAD, GE863-PY manual Camera Board Module Main

Models: GE863-QUAD GE863-PY

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GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

12.1.2EVB for Transchip camera support

In order to interface the Telit GE863-QUAD / PY with a CMOS camera, Telit has developed an evaluation board. The EVK allows the connector of all Telit modules through 2 connectors of 40 pins each.

The I2CBUS DUAL CAMERA board is plugged in the 2 connectors of 30 pins each on the module board.

CAMERA

BOARD

MODULE

BOARD

MAIN

BOARD

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved

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Telit Wireless Solutions GE863-QUAD, GE863-PY manual Camera Board Module Main

Contents

GE863-QUAD GE863-PY Hardware User Guide Contents 10.4 10.110.2 10.312.1 13.113.2 This document is relating to the following products Overview PIN-OUT GE863 module connectionsPin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Turning on the GE863-QUAD/PY Hardware CommandsTurning off of the device can be done in two ways Turning OFF the GE863-QUAD/PYHardware shutdown Hardware Unconditional RebootGE863-QUAD Power Supply 1Power Supply RequirementsGE863-QUAD/PY power requirements are Electrical design Guidelines 2General Design RulesAn example of linear regulator with 5V input is 1.2 + 12V input Source Power Supply Design GuidelinesAn example of switching regulator with 12V input is Battery Source Power Supply Design GuidelinesBattery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines GSM Antenna Requirements AntennaGSM Antenna installation Guidelines Serial PortsGSM Antenna PCB line Guidelines Level Min Max Absolute Maximum Ratings -Not Functional Parameter Min MaxClear to Send Output from the GE863-QUAD/PY that Signals in the Uart connector on the EVK areNumber Pad Number 17-28-36 Ground 45-48-50-56It is available on the following pins 2MODEM Serial Port 2 Python Debug3RS232 level translation An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS + 20dB Microphone Paths Characteristic and RequirementsEcho canceller type Handset Echo canceller type Car kit hands-freeYou can set GA= +20dB to use standard resistor values That meansTIP environment consideration Other considerations General Design RulesBalanced Microphone Biasing Microphone BiasingUnbalanced Microphone Biasing GE863-QUAD Microphone Buffering Buffered Balanced MicSample circuit can be Buffer gain is given by the formula Gain = RR604605 = RR607606Buffered Unbalanced Single Ended Microphone Buffer bandwidth at -3dB shall be 4KHz Freq . = 2π * R719* C726 2π * R711* C727GE863-QUAD Short description Output Lines SpeakerSW volume level step Number of SW volume steps Output Lines CharacteristicsNoise Filtering Handset Earphone Design An example of internal Ear amplifier could be Hands-Free Earphone Low Power DesignCar Kit Speakerphone Design Short Description Evaluation Kit for Telit Modules EVK2@ 350mW 2 EVK2 Audio Lines CharacteristicsESD Data IntegritySIM Supply SchematicLayout Using a Gpio Pad as Input Using a Gpio Pad as OutputGeneral Purpose I/O Using the Buzzer Output GPIO7 10.3Using the Alarm Output GPIO6Min Max Units DAC and ADC section11.1DAC Converter DescriptionLow Pass Filter Example An AT command is available to use the DAC functionCommand is AT#DAC=enable,value Enabling DACUsing ADC Converter Input Voltage range AD conversion Bits Resolution11.2ADC Converter Sensitivity Lux Camera12.1Transchip Camera TypeCamera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Camera setting shown here are the defaults ones Example usage script for cameraTaking an reading a photo 13.2Module Finishing & Dimensions Mounting the GE863-QUAD / PY on the Application Board13.1General Lead-free Alloy Surface finishing Ni/Au for all test padsRecommended foot print for the application Debug of the GE863 in Production StencilPCB pad Design Solder paste Following is the recommended solder reflow profile 13.2.6 GE863-QUAD / PY Solder ReflowGE863-QUAD Section A-A Packing SystemModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations 19/09/06 Document Change LogRevision Date Changes 21/02/06