Audio Section Overview | Telit Wireless Solutions GE863-PY manual

GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

7 Audio Section Overview

The Base Band Chip of the GE863-QUAD / PY Telit Module provides two different audio blocks; both in transmit (Uplink) and in receive (Downlink) direction:

“MT lines” should be used for handset function,

“HF lines” is suited for hands -free function (car kit).

These two blocks can be active only one at a time, selectable by AXE hardware line or by AT command.

The audio characteristics are equivalent in transmit blocks, but are different in the receive ones and this should be kept in mind when designing.

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Telit Wireless Solutions GE863-PY, GE863-QUAD manual Audio Section Overview

Contents

GE863-QUAD GE863-PY Hardware User Guide Contents 10.3 10.110.2 10.4 12.1 13.113.2 This document is relating to the following products Overview GE863 module connections PIN-OUT Pin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Hardware Commands Turning on the GE863-QUAD/PY Turning OFF the GE863-QUAD/PY Turning off of the device can be done in two ways Hardware Unconditional Reboot Hardware shutdown GE863-QUAD Power Supply 1Power Supply RequirementsGE863-QUAD/PY power requirements are 2General Design Rules Electrical design Guidelines 1.2 + 12V input Source Power Supply Design Guidelines An example of linear regulator with 5V input is Battery Source Power Supply Design Guidelines An example of switching regulator with 12V input is Battery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines Antenna GSM Antenna Requirements GSM Antenna installation Guidelines Serial PortsGSM Antenna PCB line Guidelines Absolute Maximum Ratings -Not Functional Parameter Min Max Level Min Max 17-28-36 Ground 45-48-50-56 Signals in the Uart connector on the EVK areNumber Pad Number Clear to Send Output from the GE863-QUAD/PY that It is available on the following pins 2MODEM Serial Port 2 Python Debug3RS232 level translation An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS Echo canceller type Car kit hands-free Microphone Paths Characteristic and RequirementsEcho canceller type Handset + 20dB That means You can set GA= +20dB to use standard resistor values TIP environment consideration General Design Rules Other considerations Microphone Biasing Balanced Microphone Biasing Unbalanced Microphone Biasing GE863-QUAD Microphone Buffering Buffered Balanced MicSample circuit can be Gain = RR604605 = RR607606 Buffer gain is given by the formula Buffered Unbalanced Single Ended Microphone Freq . = 2π * R719* C726 2π * R711* C727 Buffer bandwidth at -3dB shall be 4KHz GE863-QUAD Output Lines Speaker Short description Output Lines Characteristics SW volume level step Number of SW volume steps Noise Filtering Handset Earphone Design Hands-Free Earphone Low Power Design An example of internal Ear amplifier could be Car Kit Speakerphone Design Evaluation Kit for Telit Modules EVK2 Short Description 2 EVK2 Audio Lines Characteristics @ 350mW Data Integrity ESD Schematic SIM Supply Layout Using a Gpio Pad as Input Using a Gpio Pad as OutputGeneral Purpose I/O 10.3Using the Alarm Output GPIO6 Using the Buzzer Output GPIO7 Description DAC and ADC section11.1DAC Converter Min Max Units Enabling DAC An AT command is available to use the DAC functionCommand is AT#DAC=enable,value Low Pass Filter Example Using ADC Converter Input Voltage range AD conversion Bits Resolution11.2ADC Converter Type Camera12.1Transchip Camera Sensitivity Lux Camera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Camera setting shown here are the defaults ones Example usage script for cameraTaking an reading a photo 13.2Module Finishing & Dimensions Mounting the GE863-QUAD / PY on the Application Board13.1General Surface finishing Ni/Au for all test pads Lead-free Alloy Recommended foot print for the application Debug of the GE863 in Production StencilPCB pad Design Solder paste 13.2.6 GE863-QUAD / PY Solder Reflow Following is the recommended solder reflow profile GE863-QUAD Packing System Section A-A Modules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations 21/02/06 Document Change LogRevision Date Changes 19/09/06