GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

Surface finishing Ni/Au for all test pads

Lead-free Alloy:

Surface finishing Sn/Ag/Cu for all solder pads

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Telit Wireless Solutions GE863-PY, GE863-QUAD manual Surface finishing Ni/Au for all test pads, Lead-free Alloy