Intel MGM45WU Restriction of Hazardous Substances RoHS, Lead-Free Second Level Interconnect Marks

Regulatory Compliance

Table 16. Lead-Free Second Level Interconnect Marks

Description	Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the board substrate
and the solder connections
from the board to the		or
components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
		or

Restriction of Hazardous Substances (RoHS)

EU RoHS

EU RoHS Directive 2002/95/EC restricts the use of the following six materials in various types of electronic and electrical equipment:

•Lead

•Mercury

•Cadmium

•Hexavalent chromium

•Polybrominated biphenyls (PBB)

•Polybrominated diphenyl ether (PBDE)

The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material.

Intel Mobile Board MGM45WU complies with these restrictions.

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