Intel 8080 manual Silicon Gate MOS, PIN Configuration Logic Symbol Block Diagram

Page 133

Silicon Gate MOS 8101-2

1024 BIT (256 x 4) STATIC MOS RAM

WITH SEPARATE 1/0

256 x 4 Organization to Meet Needs for Small System Memories

Access Time - 850 nsec Max.

Single + 5V Supply Voltage

Directly TTL Compatible - All Inputs and Output

Static MOS - No Clocks or Refreshing Required

Simple Memory Expansion - Chip Enable Input

®

Inputs Protected - All Inputs Have Protection Against Static Charge

Low Cost Packaging - 22 Pin Plastic Dual-In-Line Configuration

Low Power - Typically 150 mW

Three-State Output - OR-Tie Capability

Output Disable Provided for Ease of Use in Common Data Bus Systems

The Intel 8101-2 is a 256 word by 4 bit static random access memory element using normally off N-channel MOS devices integrated on a monolithic array. It uses fully DC stable (static) circuitry and therefore requires no clocks or refreshing to operate. The data is read out nondestructively and has the same polarity as the input data.

The 8101-2 is designed for memory applications where high performance, low cost, large bit storage, and sim- ple interfacing are important design objectives.

It is directly TTL compatible in all respects: inputs, outputs, and a single +5V supply. Two chip-enables allow easy selection of an individual package when outputs are OR-tied. An output disable is provided so that data inputs and outputs can be tied for common I/O systems. Output disable is then used to eliminate any bidirectional logic.

®

The Intel 8101-2 is fabricated with N-channel silicon gate technology. This technology allows the design and_ production of high performance, easy-to-use MOS circuits and provides a higher functional density on a mon- olithic chip than either conventional MOS technology or P-channel silicon gate technology.

Intel'ssilicon gate technology also provides excellent protection against contamination. This permits the use of low cost silicone packaging.

PIN CONFIGURATION

 

LOGIC SYMBOL

BLOCK DIAGRAM

A3

 

22

Vee

 

Ao

01,

 

 

 

 

 

 

 

 

 

A2

 

21

A4

 

A,

DO,

AO

@

A,

 

20

RIW

 

A2

01 2

 

--- 0 Vee

Ao

4

19

CEl

 

A3

002

 

~GND

 

A4

01 3

ROW

CELL ARRAY

 

 

 

 

32 ROWS

As

5

18

00

 

As

003

SELECT

32 COLUMNS

 

 

 

8101-2

 

 

A 8101-2 01

 

 

A6

6

17

CE2

 

6

4

 

 

A7

 

16

 

 

A7

0°4

 

 

 

0°4

 

 

 

 

 

GNo

8

15

014

 

 

 

R/W

 

 

 

00

 

 

 

 

 

 

 

 

 

 

01,

9

14

0°3

 

 

 

 

 

DO,

10

13

01 3

 

 

 

 

 

01 2

11

12

0°2

 

RIW CE2

CEl

 

 

 

 

 

 

 

 

 

 

 

 

PIN NAMES

 

 

m~-.~

 

 

 

 

 

 

CE2~---I

o = PIN NUMBERS

 

 

 

 

 

 

 

 

DIN

DATA INPUT

 

00

OUTPUT DISABLE

00 ::> -- 4 >o-~

 

Ao-A.,

ADDRESS INPUTS

DOUT

DATA OUTPUT

 

 

 

 

RIW

READIWRITE INPUT

Vee

POWER (+5V)

 

 

 

 

m,CE2

CHIP ENABLE-

 

 

 

 

 

5-67

Image 133
Contents Page System Controller for 8080A Clock Generator for 8080AProgrammable Communication Interface Programmable Peripheral InterfaceContents Peri pherals 127Chapter Packaging Information Page Microcomputer Design Aids Advantages of Designing With MicrocomputersConventional System Programmed Logic Iii Applications Example1IIII~Iff1 Peripheral Devices Encountered ApplicationArchitecture of a CPU Typical Computer SystemAccumulator Instruction Register and Decoder Program Counter Jumps, Subroutines and the StackAddress Registers Control CircuitryArithmetic/Logic Unit ALU Computer OperationsMemory Read Instruction FetchMemory Write Wait memory synchronizationPage Page 8080 Photomicrograph With Pin Designations INTE~Registers Architecture of the 8080 CPUInstruction Register and Control Arithmetic and Logic Unit ALUData Bus Buffer Processor CycleMachine Cycle Identification Halt State Transition SequenceStatus Bit Definitions Status Word ChartStatus Information Definition ?~~ CPU State Transition DiagramRr\ ONE ,----- ~ ~2. State Definitions State Associated ActivitiesInterrupt Sequences RLrL- rL rL rL-rL- rLrL¢2 -+--sLJJlL-..rrL~LJLLJTLJJ\.lJL Halt Sequences Hold SequencesSTART-UP of the 8080 CPU 11. Halt Timing ~~~~t==p 001 STATUS6 Xram ~iA~~ll,12 ~iA~~~11~A~~~ll ~iA~~~11111 000 001 010 011 100 101 ValueBasic System Operation Typical Computer System Block Diagram8080 CPU CPU Module DesignClock Generator and High Level Driver Clock Generator Design~50ns ClK 0.......-..-.-----.. tf1A TTLHigh Level Driver Design Ststb !1 Page ROM Interface Interfacing the 8080 CPU to Memory and I/O DevicesRAM Interface Ill General Theory InterfaceIsolated I/O Memory Mapped I/OInterface Example AddressingMemr to 15 Format 13 Format8080 Instruction SET Instruction and Data FormatsByte Two Byte OneByte Three I D7 Addressing ModesSymbols Meaning Symbols and AbbreviationsDescription Format AllData Transfer Group Content of register r2 is moved to register r1MOV r1, r2 Move Register Reg. indirect0 I R 0 I R pArithmetic Group 0 I1 I 0 I 0 o0 I D I D R 0 ILogical Group I IOCR M Decrement memory Cycles States Addressing reg. indirect Flags Z,S,P ,CY,ACI 1 I 1 o I 1 I 1 I I 0 I 1 I 1 I~11~ 1 1 10 I 0 1 I 0 I 1 I0 I 0 I Cycles States Flags none000 Branch GroupCcondition addr I c c I c I 0 I 0 ISP ~ SP + I 1 o Stack, I/O, and Machine Control GroupPush rp 1 I R~ SP + Exchange stack top with Hand L~ data Cycles States Flags NoneInstruction SET Programmable Peripheral Interface 8224 8080A-1 8228 8080A-2 8080A M8080-A Page PIN Names Schottky BipolarGeneral Functional DescriptionOscillator Clock GeneratorStstb Status Strobe Power-On Reset and Ready Flip-FlopsCrystal Requirements Characteristics8pF InputExample Characteristics For tCY = 488.28 nsT42 T01 T02 T03 Toss TORS tORH tOR FMAXDbin PIN Configuration Block DiagramBlock GeneralInta None Control SignalsTE~r Characteristics TA = Oc to 70C Vee = 5V ±5%Waveforms Hlda to Read Status OutputsStstb GoUTVTH VCC=5VGND ---. r ·-c?oo .H Intel Silicon Gate MOS 8080 aVss Vee8080A Functional PIN Definition Absolute Maximum RATINGS· CharacteristicsCapacitance IOl = 1.9mA on all outputs~I~~~ =..... -r-DATAINTiming Waveforms ~~1 t CYTypical ~ Output Delay VS. a Capacitance CharacteristicsTypical Instructions Instruction SETSummary of Processor Instructions Silicon Gate MOS 8080.AInfel Silicon Gate MOS 8080A-1 Max Symbol Parameter TypUnit ~tOF.I Fft~l~-t TYPICAL!J. Output Delay VS. ~ Capacitance Infel Silicon Gate MOS 8080 A-2 Cout +10J1A VAOOR/OATA = VSS + O.45VUnit Test Condition Symbol Parameter MinMin. Max. Unit Test Condition Typical ~ Output Delay VS. ~ CapacitancePage Intel . Silicon Gate MOS M8080A Register to regist~r, memory refer Immediate mode or I/O instructionsEnce, arithmetic or logical, rotate Interrupt instructionsLlf17 Summary of Processor InstructionsM8080A Functional PIN Definition Silicon Gate MOS M8080AIOL = 1.9mA on all outputs Absolute Maximum RatingsOperation Symbol Parameter Min. Max Unit Test Condition ~I~ Silicon Gate MOS M8080APage ROMs 8702A 8704 8708 8316A Page Silicon Gate MOS 8702A PIN Connections Operating CharacteristicsVoo 1N= Vee Switching Characteristics~10% = V ceCs=o.~ \ \Symbol Test Operating Characteristics for Programming OperationCharacteristics for Programming Operation SYMBOLTESTMIN. TYP. MAX. Unit ConditionsCS = OV Switching Characteristics for Programming OperationProgramming Operation of the 8702A Program OperationII. Programming of the 8702A Using Intel Microcomputers Operation of the 8702A in Program ModeIII a Erasing Procedure Programming Instructions for the 8702APage PIN Names PIN Configurations Block DiagramIII CommentIBB VOH1Test Conditions Symbol Parameter Typ. Max. Unit ConditionsWaveforms Max UnitTpF Program Pulse Fall Time Parameter MinProgramming Current RnA Program Pulse Amplitude CS/WE = +12V Read/Program/Read Transitions+-------1 PEEEf!1EJEZPlEzz$m=2!·m·· Icc 150 rSilicon Gate MOS MAX Unit CommentCS=O.O Outa100 ns 7001 JJ.s ~~~H --4!~--~N-~-TA-AL-~-DU-T--~\200ns 500ns 300 ns Cs .. o.~ ~r Typical CharacteristicsSilicon Gate MOS Ilpc IlclIlkc ILOCoUT Conditions of Test for CharacteristicsCIN ~ ~ ~ Marking Mask Option SpecificationsPppp Customer Number OateTitle Card ~ r ------ + -- t --- . L . ------ rJBlank 79-80Intel Silicon Gate MOS ROM 8316A PIN Configuration Block DiagramConditions of Test for 400CAPACITANCE2 TA = 25C, f = 1 MHz Waveforms OU~TVALIDILICO.N Gate MOS ROM 8316A Typical D.C. CharacteristicsNumber Oate CustomerSTO Mask Option Speci FicationsCOM~ANY Name Title CardRAMs Page Silicon Gate MOS PIN Configuration Logic Symbol Block Diagram= OC ~E~~=~utP~-t-·7~igh-~\/oltage-~------ ---- --i2-+---=~== ~=10H = -150 p.A +----+00 ~ Conditions of TestPage Silicon Gate MOS PIN Configuration Logic Symbol Block DiagramIII Symbol Parameter Min. Typ.rICC1 ICC2550 200 Write 1~-tAW--.I-----IInput Pulse Rise and Fall Times 20nsec Timing Measurement Reference Level VoltPage Silicon Gate MOS 5V to +7V Power Dissipation WattComment TA = OOC to +70C, Vee = 5V ±5% unless otherwise specified+--~~~TL~~~EEt~~~P-.± 85o-·-···TCapacitance T a = 25C, f = 1MHz Conditions of Test~~~b~.J Typical A.C. CharacteristicsSilicon Gate MOS 8102A-4 TA = OC to +70 o e, Vcc = 5V ±5% unless otherwise specified 230 450300 Access Time VS Ambient Temperature VIN Limits VS. TemperatureAccess Time VS LOAD·CAPACITANCE Output Source Current VSPIN Configuration Logic Symbol Block Diagram Fully Decoded Random Access BIT Dynamic MemoryIOOAV2 Silicon Gate MOS 81078·4IMP~ri~~CE II.~4000 Read CycleRef = Write CycleTypical Characteristics RWc 590 CD Symbol Parameter Min MaxNumbers in parentheses are for minimum cycle timing in ns Standby Power Power DissipationRefresh System Interfaces and FilteringTypical System BIT 256 x 4 Static Cmos RAM VIH VOL VOH ICC2VOR IcccrTiming Measurement Reference Level Volt Input Pulse Rise and Fall Times 20nsec~I----- t CW2 ------ . t Schottky Bipolar PIN Configuration Logic SymbolVoo- --- ---T Conditions of TestAll driver outputs are in the state indicated Power Supply Current Drain and Power DissipationTypical System Dynamic Memory Refresh Controller Page 8212 8255 8251 Page EIGHT-BIT INPUT/OUTPUT Port PIN Configuration Logic DiagramOS2 Functional DescriptionII. Gated Buffer 3·STATE Basic Schematic SymbolsAre 3-state Gated BufferIV. Interrupting Input Port III. Bi-Directional Bus DriverInterrupt Instruction Port BI-DIRECTIONAL BUS DriverVII Status Latch VI. Output Port With Hand-Shaking8080 4 OvJ \.. -4~OUT Viii SystemVee SystemIX System 1G~D L-~ DalN-t?!NrJAbsolute Maximum Ratings· Characteristics052 ~ Typical CharacteristicsTpw OUTTA = OC to + 75C Vee = +5V ± 5% Switching Characteristics12 pF ~~~lEI~S 1-- +SV Programmable Peripheral InterfaceData Bus Buffer GeneralRead/Write and Control Logic Basic Functional DescriptionPIN Configuration ResetGroup a and Group B Controls Ports A, B, and CSingle Bit Set/Reset Feature Mode SelectionDetailed Operational Description PA 7 ·pAoMode 0 Timing Operating Modes Mode 0 Basic Input/OutputInterrupt Control Functions Mode 0 Configurations Mode 0 Port Definition Chart119 · / ,4 Operating Modes Mode 1 Strobed Input/OutputIBF Input Buffer Full F/F Input Control Signal DefinitionIntr Interrupt Request Inte aIntea Output Control Signal DefinitionBi-Directional Bus I/O Control Signal Definition Combinations of ModeOperating Modes Output OperationsMode 2 Bi-directional Timing Mode 2 Control WordMode 2 and Mode 0 Output Mode 2 CombinationsMode Definition Summary Table Special Mode Combination ConsiderationsSource Current Capability on Port B and Port C Reading Port C StatusPrinter Interface ApplicationsKeyboard and Display Interface Keyboard and Terminal Address Interface~.LEFT/RIGHT PCOSilicon Gate MOS Vil Input Low Voltage Characteristics TA = oc to 70C Vee = +5V ±5% vss = OVInput High Voltage Val Output Low Voltage IOl = 1.6mA Time From STB = 0 To IBFMode 0 Basic Input Mode 1 Strobed Input Mode 2 Bi-directional Page Programmable Communication Interface General Reset ResetReadlWrite Control logic ClK ClockDSR Data Set Ready Modem ControlTxE Transmitter Empty DTR Data Termin·al ReadyReceiver Control Receiver BufferRxRDY Receiver Ready RxC Receiver ClockCommand Instruction Mode InstructionDetailed Operation Description ProgrammingAsynchronous Mode Transmission Mode Instruction DefinitionAsynchronous Mode Receive Data C~~RACTERSynchronous Mode Receive Synchronous Mode TransmissionMode Instruction Format, Synchronous Mode Synchronous Mode, Transmission FormatCommand Instruction Format Command Instruction DefinitionStatus Read Definition Status Read FormatAsynchronous Interface to Telephone Lines Asynchronous Serial Interface to CRT Terminal, DC-9600 BaudSynchronous Interface to Terminal or Peripheral Device Synchronous Interface to Telephone LinesIcc CapacitanceIOL Typ TA = oc to 70C VCC = 5.0V ±5% Vss = OV Symbol ParameterSRX ~4IlI RxD~AST BIT ,----1 RXD~Peripherals Page High Speed 1 OUT of 8 Binary Decoder Decoder Enable GateSystem Port Decoder Using a very similar circuit to the I/O port decoder, an arChip Select Decoder 24K Memory Interface\lJ Logic Element ExampleJJ,.--+-I----.....1 IllTypical Characteristics Characteristics TA = OOC to +75C, Vee = 5.0V ±5%Symbol VOL VOH 8205Address or Enable to Output Delay VS. Load Capacitance Switching Characteristics Conditions of Test Test LoadAddress or Enable to Output Delay VS. Ambient Temperature Test Waveforms~ R PIN Configuration~ ~ Polled Method Interrupts in Microcomputer SystemsInterrupt Method Current Status Register Priority EncoderINTE, elK Control SignalsElR, ETlG, ENGl AO, A1, A2Basic Operation Level ControllerLevel Controller I ICascading Symbol Parameter Limits Unit Conditions Min Typ.£1 Operating CharacteristicsLos Absolute Maximum RatingsCharacteristics and Waveforms TA = oc to +70C, vcc = +5V ±5% Schottky Bipolar 8216 8226 +-......---- n csControl Gating OlEN, CS Bi-Directional DriverMemory and 1/0 Interface to a Bi-directional Bus Applications of 8216/8226Large microcomputer systems it is often necessary to pro Input Load Current OlEN, CS VF =0.45 IcC Power Supply Current 120Input Load Current All Other Inputs VF =0.45 Input Leakage Current OlEN, CS VR =5.25VOUT WaveformsPage 8253 8257 8259 Page It uses nMOS technology ~Jmodesof operation are Programmable Interval TimerPreliminary Functional Description Block DiagramSystem Interface System InterfaceProgrammable DMA Controller Dack 2 System InterfaceSystem Application CS-------It LJJ ROMs RAMs CPU GroupPeripheral Coming Soon Intel735~ ~~~1It-j ·34o~ \.--.J.. ~~~lLead Plastic Dual IN-LINE Package P Lead CerDIP Dual IN-LINE Package DSales and Marketing Offices Distributors Page Page Page Page Page Page Instruction SET Summary of Processor Instructions By Alphabetical Order Instruction SETMicrocomputer System Users Registration Card Microcomputer Systems Bowers Avenue Santa Clara, CA Intel CorporationInter
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8080 specifications

The Intel 8085 and 8080 microprocessors were groundbreaking innovations in the world of computing, paving the way for future microprocessor development and personal computing.

The Intel 8080, introduced in 1974, was an 8-bit microprocessor that played a fundamental role in the early days of personal computing. With a 16-bit address bus, it had the capability to address 64 KB of memory. Running at clock speeds of 2 MHz, the 8080 was notable for its instruction set, which included 78 instructions and 246 opcodes. It supported a range of addressing modes including direct, indirect, and register addressing. The 8080 was compatible with a variety of peripherals and played a crucial role in the development of many early computers.

The microprocessor's architecture was based on a simple and efficient design, making it accessible for hobbyists and engineers alike. It included an 8-bit accumulator, which allowed for data manipulation and storage during processing. Additionally, the 8080 featured registers like the program counter and stack pointer, which facilitated program flow control and data management. Its ability to handle interrupts also made it suitable for multitasking applications.

The Intel 8085, introduced in 1976, was an enhancement of the 8080 microprocessor. It maintained a similar architecture but included several key improvements. Notably, the 8085 had a built-in clock oscillator, simplifying system design by eliminating the need for external clock circuitry. It also featured a 5-bit control signal for status line management, which allowed for more flexible interfacing with peripheral devices. The 8085 was capable of running at speeds of up to 3 MHz and had an extended instruction set with 74 instructions.

One of the standout features of the 8085 was its support for 5 extra instructions for stack manipulation and I/O operations, which optimized the programming process. Additionally, it supported serial communication, making it suitable for interfacing with external devices. Its 16-bit address bus retained the 64 KB memory addressing capability of its predecessor.

Both the 8080 and 8085 microprocessors laid the groundwork for more advanced microprocessors in the years that followed. They demonstrated the potential of integrated circuits in computing and influenced the design and architecture of subsequent Intel microprocessors. Their legacy endures in the way they revolutionized computing, making technology accessible to a broader audience, and their influence is still felt in the design and architecture of modern microprocessors today.