
U S E R RESPONSIBLE F O R V E R I F Y I N G VERSION A N D COMPLETENESS
O E M F U N C T I O N A L S P E C I F I C A T I O N U L T R A S T A R X P ( D F H C ) SSA M O D E L S 1.12/2.25 G B - 1.0" H I G H
Table 15. Maximum and Reliability Operating Temperature Limits
| Maximum | Reliability | ||
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Disk Enclosure T o p | 158˚ F | (70˚ C) | 131˚ F | (55˚ C) |
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Disk Enclosure Bottom | 158˚ F | (70˚ C) | 131˚ F | (55˚ C) |
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P R D F Prime Module | 203˚ F | (95˚ C) | 176˚ F | (80˚ C) |
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W D 61C40 Module | 185˚ F | (85˚ C) | 167˚ F | (75˚ c) |
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SIC Module | 203˚ F | (95˚ C) | 176˚ F | (80˚ C) |
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Microprocessor Module | 194˚ F | (90˚ C) | 167˚ F | (75˚ C) |
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V C M F E T | 194˚ F | (90˚ C) | 167˚ F | (75˚ C) |
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D C / D C Converter (CxB only) | 185˚ F | (85˚ C) | 167˚ F | (75˚ C) |
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S M P F E T | 194˚ F | (90˚ C) | 167˚ F | (75˚ C) |
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Note 1: Module temperature measurements should be taken from the top surface of the module.
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli- meters.
notes: 1) dimensions are in millimeters.
Figure 22. Temperature Measurement Points for All Models (top view of DE)
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