IBM C1C 1.12 3.5-inch Small FF 38-pin Unitized Drive Mounting Guidelines, Output Vibration Limits

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O E M F U N C T I O N A L S P E C I F I C A T I O N U L T R A S T A R X P ( D F H C ) SSA M O D E L S 1.12/2.25 G B - 1.0" H I G H

7.2.1 Drive Mounting Guidelines

The following guidelines may be helpful as drive mounting systems are being designed.

1.M o u n t the drive to its carrier/rack using the four extreme side holes to ensure that the drive's center of gravity is as close as possible to the center of stiffness of the mounting.

2.D o not permit any metal-to-metal impacts or chattering between the carrier/rack and the drive or between the carrier/rack and anything else. Metal-to-metal impacts create complex shock waveforms with short periods; such waveforms can excite high frequency modes of the components inside the drive.

3.The carrier/rack should not allow the drive to rotate in the plane of the disk and the carrier/rack itself should be mounted so that it does not rotate in the plane of the disk when the drive is running. Even though the drive uses a balanced rotatory actuator, its position can still be influenced by rotational accel- eration.

4.Keep the rigid body resonances of the drive away from harmonics of the spindle speed. Consider not only the drive as mounted on its carrier but also when the drive is mounted to a carrier and then the carrier is mounted in a rack, the resonances of the drive in the entire system must be considered.

7200 R P M Harmonics: 120 hz, 240 hz, 360 hz, 480 hz, .....

5.When the entire system/rack is vibration tested, the vibration amplitude of the drive as measured in all axis should decrease significantly for frequencies above 300 hz.

6.Consider the use of plastics or rubber in the rack/carrier design. Unlike metal, these materials can dampen vibration energy from other drives or fans located elsewhere in the rack.

7.Rather that creating a weak carrier/rack that flexes to fit the drive/carrier, hold the mounting gap to tighter tolerances. A flexible carrier/rack may contain resonances that cause operational vibration and/or shock problems.

7.2.2 Output Vibration Limits

spindle imbalance

1.0 gram-millimeters maximum for C1x, C2x models

1.5gram-millimeters maximum for C4x model

7.2.3Operating Vibration

The vibration is applied in each of the three mutually perpendicular axis, one axis at a time. Referring to Figure 24 on page 81, the x-axis is defined as a line normal to the front/rear faces, the y-axis is defined as a line normal to the left side/right side faces, and the z-axis is normal to the x-y plane.

WARNING: The Ultrastar X P SSA drives are sensitive to rotary vibration. Mounting within using systems should minimize the rotational input to the drive mounting points due to external vibration. IBM will provide technical support to assist users to overcome problems due to vibration.

Random Vibration

For excitation in the x-direction and the y-direction, the drive meets the required throughput specifications when subjected to vibration levels not exceeding the V4 vibration level defined below.

For excitation in the z-direction, the drive meets the required throughput specifications when subjected to vibration levels not exceeding the V4S vibration level defined below.

Note: The R M S value in the table below is obtained by taking the square root of the area defined by the g² /hz spectrum from 5 to 500 hz.

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I B M Corporation

Source filename=OPLIMITS

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Contents Form Factor Disk Drive Version BM Corporation Preface Source filename=STSSHEXT When Reliability Operating LimitsContaminants Acoustic Levels Source filename=STSSHEXT Features General FeaturesInterface Controller Features DescriptionReliability Features ModelsSpecifications GeneralUser bytes/sector ub/sct Sectors/logical block sct/lbaUser bytes/logical block ub/lba Sectors/track sct/trkCapacity Equations For Each NotchFor Entire Drive Power Requirements by Model 1 C1x ModelsInput Voltage + 5 Volts Supply + 1 2 Volts SupplyExample 1. Calculate the mean 12 volt average current Power Calculation ExamplesExample 3. Power Calculation Things to check when measuring 12 V supply current Example 4. Calculate the 12 volt peak currentVolt current during read/write operations C1x Models Typical 12 volt current C1x Models Typical 12 volt spin-up current C1x Models 2 C2x Models Power Calculation Examples Example 4. Calculate the 12 volt peak current Volt current during read/write operations C2x Models Typical 12 volt current C2x Models Typical 12 volt spin-up current C2x Models 3 C4x Models Power Calculation Examples Example 4. Calculate the 12 volt peak current Volt current during read/write operations C4x Models Typical 12 volt current C4x Models Typical 12 volt spin-up current C4x Models 4.2 DC/DC Converter Power supply methodsCxB Models Grounding Requirements of the Disk Enclosure Hot plug/unplug supportM Corporation Bring-up Sequence and Stop Times Event Nominal MaximumBring-up Sequence Times and Stop Time for C2x Models Source filename=PERFORM Performance Environment DefinitionWorkload Definition # of segments Ub/lba +Command Execution Time SequentialRandom Basic Component DescriptionsData Transfer to/from Disk Comments Data Transfer to/from SSA LinkApproximating Performance for Different Environments Theoretical Data Sector Transfer RateWhen Read Caching is Enabled When Write Caching is EnabledWhen Adaptive Caching is Enabled When Read-ahead is EnabledWhen No Seek is Required For Queued CommandsReordered Commands Back-To-Back CommandsTrack to Track Skew SkewCylinder to Cylinder Skew Idle Time Functions Servo Run Out Measurements Servo Bias MeasurementsPredictive Failure Analysis Channel CalibrationDisk Sweep Command Timeout LimitsSave Logs and Pointers M Corporation Weight and Dimensions MechanicalSmall Form Factor Models CxC ClearancesDimensions are in millimeters Location of Side Mounting Holes of C4C Models Source filename=MECHANIC Unitized Connector Locations Source filename=MECHANIC Carrier Models CxB Dimensions CxB Models M Corporation Handle Docking and Ejection System Auto-docking Assembly Side Rails Side Rail Positioning Electrical Connector and Indicator Locations E D Locations front view CxB Models M CorporationSSA Unitized Connector Electrical InterfaceCarrier Connector PinRow SSA Link Cable SSA Link Electrical CharacteristicsOption Pins and Indicators Device Activity Pin/Indicator Option Port Pin Device Fault Pin/Indicator Option Port PinWrite Protect Option Port Pin Ground long Option Port PinFront Jumper Connector Early Power Off Warning or Power Fail Power Port Pin12 12V Charge and 5V Charge Power Port pin 1 Programmable pin 1 Option Port PinSpindle Synchronization Over Sync Hard-wire M Corporation Source filename=RELIABLE Error Detection Seek Error RatePower On Hours Examples ReliabilityPower on/off cycles Useful LifeMaximum on/off cycles Product LifeInstall Defect Free Mean Time Between Failure *MTBFSpql Shipped product quality level Sample Failure Rate ProjectionsPeriodic Maintenance Connector Insertion CyclesInstall Defect Free percentage Percent ESD ProtectionTemperature Measurement Points Operating LimitsMaximum Reliability P F E TTemperature Measurement Points for all Models bottom view Vibration and ShockOperating Vibration Drive Mounting GuidelinesOutput Vibration Limits Nonoperating Vibration V4SNonoperating Shock ContaminantsOperating Shock Upper Limit Sound Power Requirements Bels for C4x Models Acoustic LevelsSource filename=STANDARD Electromagnetic Compatibility EMC SafetyStandards M Corporation Bibliography Serial Storage Architecture S S a P H Transport