Texas Instruments TMS320C6712D warranty GDP S-PBGA-N272, Seating Plane 4204396/A 04/02

Page 100

MECHANICAL DATA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MPBG274 – MAY 2002

GDP (S–PBGA–N272)

 

 

 

 

 

 

 

 

 

PLASTIC BALL GRID ARRAY

 

27,20 SQ

 

 

 

 

 

 

24,13 TYP

 

 

 

 

 

 

 

 

26,80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24,20

 

 

 

 

 

1,27

 

 

 

 

 

 

 

 

 

 

 

23,80 SQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0,635

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Y

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

U

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P

 

 

 

 

 

 

 

 

 

 

 

 

 

1,27

 

 

 

N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

M

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

 

 

 

0,635

 

 

 

H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A1 Corner

 

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

3

 

5

7

9

11

13

15

17

19

 

 

 

 

2

4

6

8

10

12

14

16

18

20

1,22

 

 

2,57 MAX

 

 

 

 

Bottom View

 

 

 

 

 

 

1,12

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Seating Plane

 

 

 

 

 

 

 

 

 

 

0,65

0,90

0,10

0,70

 

 

0,15

 

 

 

 

 

 

 

 

 

 

0,60

 

 

 

 

 

 

 

 

 

 

 

 

0,57

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0,50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4204396/A 04/02

NOTES: A. All linear dimensions are in millimeters.

B.This drawing is subject to change without notice.

C.Falls within JEDEC MO-151

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Page 99 Page 101
Image 100
Page 99 Page 101
Contents SPRS293A − October 2005 − Revised November Table of Contents Revision History Pages ADDITIONS/CHANGES/DELETIONSMultichannel Buffered Serial Port Timing GDP and ZDP 272-PIN Ball Grid Array BGA Package GDP and ZDP BGA package bottom viewBottom View Description Device characteristics Characteristics of the C6712D ProcessorHardware Features Internal Clock C6712DDevice compatibility Functional block and CPU DSP core diagram Digital Signal ProcessorCPU DSP core description ST1 DA1DA2 ST2Memory Map Summary Memory map summaryMemory Block Description Block Size Bytes HEX Address Range Peripheral register descriptions Emif RegistersL2 Cache Registers HEX Address Range Acronym Register NameInterrupt Selector Registers Device RegistersEdma Parameter RAM† HEX Address Range Acronym Register Name CommentsEdma Registers Quick DMA Qdma and Pseudo Registers†PLL Controller Registers Gpio RegistersHEX Address Range Acronym Register Name Comments Timer McBSP0 and McBSP1 RegistersSignal groups description Clkin CLKOUT3 CLKOUT2† CLKMODE0 Pllhv TMS TDO TDI TCK TrstJtag BIG/LITTLE EndianTOUT1 TINP1 CLKR1CLKS1† GpioDevice Configurations Device configurations at device resetConfiguration GDP/ZDP Functional Description PIN BOOTMODE10Emifbe LendianEksrc Devcfg register descriptionBIT # Name Description Terminal Functions Terminal Functions PIN SignalIPD Description Name GDP IPU‡ ZDP Bootmode BOOTMODE1 C19 BOOTMODE0 C20 IPDEMU1B9 EMU0D9 IPU LITTLE/BIG Endian FormatIPD Description Name GDP IPU‡ ZDP Resets and Interrupts Only one asserted during any external data accessEdge-driven Decoded from the two lowest bits of the internal addressEmif − Address # Emif − Data #TIMER1 TIMER0IPD Description Name GDP IPU‡ ZDP Emif − Data # Multichannel Buffered Serial Port 1 McBSP1GENERAL-PURPOSE INPUT/OUTPUT Gpio Module Multichannel Buffered Serial Port 0 McBSP0Reserved for Test IPD Description Name GDP IPU ZDP RSV IPURSV IPD Additional Reserved for TestSPRS293A − October 2005 − Revised November Name GDP ZDP Supply Voltage Pins See the power-supply decoupling portion of this data sheetDvdd CvddDescription Name GDP ZDP Supply Voltage Pins Ground PinsVSS GNDSignal Name PIN GDP ZDP TYPE† VSS GNDDescription GDP Name ZDP Ground Pins VSSSoftware Development Tools Development supportHardware Development Tools Device and development-support tool nomenclature Device supportFully qualified production device Temperature Range Default 0C to 90C PrefixDevice Family TechnologyDocumentation support CPU CSR register description Revision IDPwrd PCC DCC Pgie GIECPU ID CPU CSR Register Bit Field DescriptionPCC Ccfg Register Bit Field Description Cache configuration Ccfg register descriptionL2MODE DSP Interrupt Default Selector Module Control Interrupt sources and interrupt selectorDSP Interrupts Interrupt Selector EventEdma Channels Edma module and Edma selectorEdma Selector ESEL1 Register 0x01A0 FF04 ESEL3 Register 0x01A0 FF0CPLL and PLL controller PLL Lock and Reset Times Clkout Signals, Default Settings, and ControlEnabled or Disabled MIN TYP MAX UnitPLL Clock Frequency Ranges†‡ Clock SignalGDP 150and ZDP Pllcsr Register 0x01B7 C100 PLL Control/Status Register PllcsrPllm Register 0x01B7 C110 PLL Multiplier Control Register PllmDxEN Oscillator Divider 1 Register OSCDIV1 OSCDIV1 Register 0x01B7 C124OD1EN GP7 GP6 GP5 GP4 GP2 General-purpose input/output GpioDIR Power-down mode logic Pwrd Field of the CSR Register PD3 PD2 PD1Power-supply sequencing Characteristics of the Power-Down ModesPower-supply design considerations System-level design considerationsPower-supply decoupling Supply Schottky Diode Core SupplyGND Dvdd C6000Ieee 1149.1 Jtag compatibility statement Emif device speed Example Boards and Maximum Emif SpeedEmif big endian mode correctness BootmodeReset Emif Data Lines Pins Where Data PresentMIN NOM MAX Unit Recommended operating conditionsIOH Parameter Test Conditions MIN TYP MAX Unit IOZSignal transition levels Parameter Measurement Information42 Ω Vref = 1.5AC transient rise/fall time specifications = 0.3 tcmax† VIL max VUS max GroundTiming parameters and board routing analysis Board-Level Timings Example see Figure Control Signals † Output from DSPOutput from DSP Timing requirements for CLKIN†‡§ Input and Output ClocksSee Figure Timing requirements for ECLKIN§ see Figure Clkin CLKOUT3MIN Eclkin EclkoutAsynchronous Memory Timing Timing requirements for asynchronous memory cycles†‡See −Figure AreSetup = Strobe = Not Ready Hold = CE30 BE10 EA212ED150 Read Data AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† ArdyED310 CEx BE30 EA212AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE † Ardy SYNCHRONOUS-BURST Memory Timing Unit MIN MAXCE30 BE10 BE1 BE2 BE3 BE4EA212 ED150 ARE/SDCAS/SSADS † AOE/SDRAS/SSOE † AWE/SDWE/SSWE†Timing requirements for synchronous Dram cycles† see Figure Synchronous Dram Timing150 EA2113 Bank EA112 Column EA12 ED150 Read EclkoutAOE/SDRAS/SSOE † ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Write Eclkout EA2113EA12 ED150 AOE/SDRAS/SSOE † ARE/SDCAS/SSADS † AWE/SDWE/SSWE †Actv Eclkout CE30 BE10 EA2113 Bank Activate EA112 Row Address EA12 ED150AOE/SDRAS/SSOE† ARE/SDCAS/SSADS† AWE/SDWE/SSWE† Dcab EclkoutDeac Eclkout CE30 BE10 EA2113EA112 EA12 ED150 Refr EclkoutMRS Eclkout CE30 BE10 EA212 MRS value ED150HOLD/HOLDA Timing Timing requirements for the HOLD/HOLDA cycles† see FigureHold Hold HoldaBusreq Timing Eclkout BusreqTiming requirements for reset†‡ see Figure Reset TimingCLKMODE0 = Phase Emif Z Group † Emif Low Group † Boot and DeviceTiming requirements for external interrupts† see Figure External Interrupt TimingEXTINT, NMI Multichannel Buffered Serial Port Timing Timing requirements for McBSP†‡ see FigureParameter Clks Clkr FSR intBitn-1 ClkxTiming requirements for FSR when Gsync = 1 see Figure ClksFSR external CLKR/X no need to resync CLKR/X needs resync Master Slave Unit MIN MAXClkx FSX Parameter MASTER§ Slave Unit MIN MAXBit Bitn-1 McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = Multichannel Buffered Serial Port Timing McBSP Timing as SPI Master or Slave Clkstp = 10b, Clkxp = McBSP Timing as SPI Master or Slave Clkstp = 11b, Clkxp = Timing requirements for timer inputs† Timer TimingTINPx TOUTx Timing requirements for Gpio inputs†‡ GENERAL-PURPOSE INPUT/OUTPUT Gpio Port TimingGPIx GPOx Timing requirements for Jtag test port see Figure Jtag TEST-PORT TimingUnit MIN MAX TCK TDO TDI/TMS/TRST Package thermal resistance characteristics Thermal resistance characteristics S-PBGA package for GDPThermal resistance characteristics S-PBGA package for ZDP Mechanical DataOrderable Device Status Package Pins Package Eco Plan Packaging InformationMSL Peak Temp QtyGDP S-PBGA-N272 Seating Plane 4204396/A 04/02ZDP S-PBGA-N272 Seating Plane 4204398/A 04/02Important Notice

TMS320C6712D specifications

The Texas Instruments TMS320C6712D is a high-performance, fixed-point digital signal processor (DSP) that belongs to the TMS320C6000 family, well known for its advanced processing capabilities tailored for demanding signal processing applications. Launched in the early 2000s, the C6712D combines high computational power with a rich set of features, making it suitable for a variety of applications such as telecommunications, audio processing, and industrial control systems.

One of the standout characteristics of the TMS320C6712D is its architecture, which is based on a highly efficient VLIW (Very Long Instruction Word) design. This architecture allows the processor to execute multiple instructions in a single clock cycle, significantly increasing performance. The device operates at clock speeds of up to 150 MHz, providing substantial computational throughput that can handle complex algorithms and real-time processing tasks.

Another key feature of the TMS320C6712D is its 32-bit fixed-point processing capabilities, which allows it to perform difficult mathematical computations efficiently. With an instruction set optimized for DSP applications, the processor includes specialized instructions for multiplying and accumulating operations, as well as support for advanced filtering and generation of audio signals.

The C6712D offers an extensive memory architecture, supporting up to 128 MB of external memory via a 32-bit data bus. It features on-chip SRAM, which provides fast access to data and program storage, enhancing the system's overall performance. Additionally, the device includes a powerful set of peripherals, such as dual asynchronous serial ports (UART), I2C interfaces, and DSP-specific interfaces that facilitate connectivity with other components and systems.

Power consumption is another vital aspect of the TMS320C6712D. It incorporates technologies allowing for low-power operation, which is essential for portable and battery-operated devices. The capability to operate in various power modes helps optimize performance while minimizing energy usage.

In conclusion, the Texas Instruments TMS320C6712D is a versatile and powerful DSP that excels in high-performance applications. Its VLIW architecture, fixed-point processing capabilities, extensive memory options, and low power consumption make it an ideal choice for engineers looking to implement complex signal processing tasks efficiently. Whether used in telecommunications, audio processing, or industrial applications, the C6712D remains a reliable and capable solution in the digital signal processing landscape.
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