Cypress CY7C1320BV18 manual Features, Configurations, Functional Description, Selection Guide

CY7C1316BV18, CY7C1916BV18 CY7C1318BV18, CY7C1320BV18

18-Mbit DDR-II SRAM 2-Word Burst Architecture

Features

■18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)

■300 MHz clock for high bandwidth

■2-word burst for reducing address bus frequency

■Double Data Rate (DDR) interfaces

(data transferred at 600 MHz) at 300 MHz

■Two input clocks (K and K) for precise DDR timing ❐ SRAM uses rising edges only

■Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

■Echo clocks (CQ and CQ) simplify data capture in high-speed systems

■Synchronous internally self-timed writes

■1.8V core power supply with HSTL inputs and outputs

■Variable drive HSTL output buffers

■Expanded HSTL output voltage (1.4V–VDD)

■Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)

■Offered in both Pb-free and non Pb-free packages

■JTAG 1149.1 compatible test access port

■Delay Lock Loop (DLL) for accurate data placement

Configurations

CY7C1316BV18 – 2M x 8

CY7C1916BV18 – 2M x 9

CY7C1318BV18 – 1M x 18

CY7C1320BV18 – 512K x 36

Functional Description

The CY7C1316BV18, CY7C1916BV18, CY7C1318BV18, and CY7C1320BV18 are 1.8V Synchronous Pipelined SRAMs equipped with DDR-II architecture. The DDR-II consists of an SRAM core with advanced synchronous peripheral circuitry and a one-bit burst counter. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1316BV18 and two 9-bit words in the case of CY7C1916BV18 that burst sequentially into or out of the device. The burst counter always starts with a ‘0’ internally in the case of CY7C1316BV18 and CY7C1916BV18. For CY7C1318BV18 and CY7C1320BV18, the burst counter takes in the least significant bit of the external address and bursts two 18-bit words (in the case of CY7C1318BV18) of two 36-bit words (in the case of CY7C1320BV18) sequentially into or out of the device.

Asynchronous inputs include an output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs, D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need to capture data separately from each individual DDR SRAM in the system design. Output data clocks (C/C) enable maximum system clocking and data synchronization flexibility.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Selection Guide

Description		300 MHz	278 MHz	250 MHz	200 MHz	167 MHz	Unit
Maximum Operating Frequency		300	278	250	200	167	MHz
Maximum Operating Current	x8	815	775	705	575	490	mA
	x9	820	780	710	580	490	mA
	x18	855	805	730	600	510	mA
	x36	930	855	775	635	540	mA

Cypress Semiconductor Corporation • 198 Champion Court	•	San Jose, CA 95134-1709	•	408-943-2600
Document Number: 38-05621 Rev. *D			Revised June 2, 2008

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