Cypress CY7C1307BV25, CY7C1305BV25 manual Introduction

Page 5

 

 

 

 

 

CY7C1305BV25

 

 

 

 

 

CY7C1307BV25

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

Name

 

I/O

Description

NC/36M

 

N/A

Address expansion for 36M. This is not connected to the die. Can be connected to any

 

 

 

 

 

voltage level on CY7C1305BV25/CY7C1307BV25.

GND/72M

 

Input

Address expansion for 72M. This should be tied LOW on the CY7C1305BV25.

NC/72M

 

N/A

Address expansion for 72M. This can be connected to any voltage level on

 

 

 

 

 

CY7C1307BV25.

GND/144M

 

Input

Address expansion for 144M. This should be tied LOW on

 

 

 

 

 

CY7C1305BV25/CY7C1307BV25.

GND/288M

 

Input

Address expansion for 144M. This should be tied LOW on CY7C1307BV25.

VREF

 

Input-

Reference Voltage Input. Static input used to set the reference level for HSTL inputs

 

 

Reference

and Outputs as well as AC measurement points.

VDD

Power Supply

Power supply inputs to the core of the device

VSS

 

Ground

Ground for the device

VDDQ

Power Supply

Power supply inputs for the outputs of the device

NC

 

N/A

Not connected to the die. Can be tied to any voltage level.

Introduction

Functional Overview

The CY7C1305BV25/CY7C1307BV25 are synchronous pipelined Burst SRAMs equipped with both a Read port and a Write port. The Read port is dedicated to Read operations and the Write Port is dedicated to Write operations. Data flows into the SRAM through the Write port and out through the Read port. These devices multiplex the address inputs in order to minimize the number of address pins required. By having separate Read and Write ports, the device completely elimi- nates the need to “turn-around” the data bus and avoids any possible data contention, thereby simplifying system design. Each access consists of four 18-bit data transfers in the case of CY7C1305BV25 and four 36-bit data transfers in the case of CY7C1307BV25, in two clock cycles.

Accesses for both ports are initiated on the rising edge of the positive input clock (K). All synchronous input timing is refer- enced from the rising edge of the input clocks (K and K) and all output timing is referenced to the rising edge of output clocks (C and C, or K and K when in single clock mode).

All synchronous data inputs (D[x:0]) pass through input registers controlled by the rising edge of input clocks (K and K). All synchronous data outputs (Q[x:0]) pass through output registers controlled by the rising edge of the output clocks (C and C, or K and K when in single clock mode).

All synchronous control (RPS, WPS, BWS[0:x]) inputs pass through input registers controlled by the rising edge of input clocks (K and K).

CY7C1305BV25 is described in the following sections. The same basic descriptions apply to CY7C1307BV25.

Read Operations

The CY7C1305BV25 is organized internally as 4 arrays of 256K x 18. Accesses are completed in a burst of four sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the Positive Input Clock (K). The address presented to Address inputs are stored in the Read address register. Following the next K clock rise the corresponding lowest order 18-bit word of data is driven onto the Q[17:0] using C as the output timing reference. On the

Document #: 38-05630 Rev. *A

subsequent rising edge of C the next 18-bit data word is driven onto the Q[17:0]. This process continues until all four 18-bit data words have been driven out onto Q[17:0]. The requested data will be valid 2.5 ns from the rising edge of the output clock (C and C, or K and K when in single clock mode, 250-MHz device). In order to maintain the internal logic, each Read access must be allowed to complete. Each Read access consists of four 18-bit data words and takes 2 clock cycles to complete. Therefore, Read accesses to the device can not be initiated on two consecutive K clock rises. The internal logic of the device will ignore the second Read request. Read accesses can be initiated on every other K clock rise. Doing so will pipeline the data flow such that data is transferred out of the device on every rising edge of the output clocks (C and C, or K and K when in single clock mode).

When the read port is deselected, the CY7C1305BV25 will first complete the pending read transactions. Synchronous internal circuitry will automatically three-state the outputs following the next rising edge of the positive output clock (C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory.

Write Operations

Write operations are initiated by asserting WPS active at the rising edge of the positive input clock (K). On the following K clock rise the data presented to D[17:0] is latched and stored into the lower 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the negative input clock (K) the information presented to D[17:0] is also stored into the Write Data Register provided BWS[1:0] are both asserted active. This process continues for one more cycle until four 18-bit words (a total of 72 bits) of data are stored in the SRAM. The 72 bits of data are then written into the memory array at the specified location. Therefore, Write accesses to the device can not be initiated on two consecutive K clock rises. The internal logic of the device will ignore the second Write request. Write accesses can be initiated on every other rising edge of the positive clock (K). Doing so will pipeline the data flow such that 18-bits of data can be trans- ferred into the device on every rising edge of the input clocks (K and K).

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Contents Configurations FeaturesFunctional Description CY7C1305BV25 1M x CY7C1307BV25 512K xLogic Block Diagram CY7C1307BV25 Logic Block Diagram CY7C1305BV25Selection Guide CY7C1305BV25-167 UnitCY7C1307BV25 512K x Pin\Configuration Ball Fbga 13 x 15 x 1.4 mm PinoutPin Definitions Introduction Application Example1 Operation Write Cycle Descriptions CY7C1305BV25 2Write Cycle Read CycleAre written into the device Write Cycle Descriptions CY7C1307BV25 2Operation Operation Document # 38-05630 Rev. *AIeee 1149.1 Serial Boundary Scan Jtag Sample Z EXIT2-IR UPDATE-DR UPDATE-IR TAP Controller State Diagram11Parameter Description Test Conditions Min Max Unit TAP Controller Block DiagramParameter Description Min Max Unit Set-up TimesIdentification Register Definitions TAP Timing and Test Conditions14Parameter Description Min Max Unit Output Times TCK Clock LOW to TDO ValidInstruction Codes Scan Register SizesRegister Name Bit Size Instruction Code DescriptionBit # Bump ID Boundary Scan OrderThermal Resistance22 Maximum RatingsOperating Range AC Test Loads and Waveforms Capacitance22Parameter Description Test Conditions Max Unit Input Capacitance TA = 25C, f = 1 MHz VDD =Cycle Time Switching Characteristics Over the Operating Range23NOP Read Write Switching Waveforms27, 28Ordering Information Package DiagramCY7C1307BV25-167BZC CY7C1305BV25-167BZXC CY7C1307BV25-167BZI CY7C1305BV25-167BZXIDocument History Issue Date Orig. Description of ChangeSYT NXR

CY7C1307BV25, CY7C1305BV25 specifications

Cypress Semiconductor, a leader in embedded memory solutions, includes the CY7C1305BV25 and CY7C1307BV25 in its family of high-performance synchronous dynamic random-access memory (SDRAM) devices. These memory chips are designed for applications that require high-speed data processing and low power consumption, making them ideal for communication systems, networking devices, and other consumer electronics.

The CY7C1305BV25 is a 512K x 16-bit synchronous SRAM, while the CY7C1307BV25 offers a larger capacity of 1M x 16-bit. Both chips operate at a maximum clock frequency of 166 MHz, ensuring rapid data transfer rates and efficient memory operation. This high-speed performance is crucial in applications where quick data retrieval and storage are imperative.

One of the standout features of these devices is their ability to support a wide range of operating voltages, typically from 2.5V to 3.3V. This versatility allows them to be integrated into systems with varying power requirements, enhancing their adaptability for different designs. Additionally, the chips offer a low standby power consumption level, contributing to energy efficiency in battery-operated devices.

Both the CY7C1305BV25 and CY7C1307BV25 utilize a synchronous interface, allowing for coordinated data transfer with the system clock. This synchronization minimizes latency and improves overall system performance. The use of advanced pipelining techniques enables these devices to process multiple read and write commands concurrently, further boosting throughput.

In terms of reliability and durability, Cypress ensures that these memory chips comply with stringent industry standards. They are designed to withstand a wide temperature range, making them suitable for operation in diverse environments. The robust design includes features that mitigate the risk of data corruption and enhance data integrity, which is a vital consideration in mission-critical applications.

Overall, the CY7C1305BV25 and CY7C1307BV25 represent Cypress Semiconductor's commitment to delivering high-quality, high-performance memory solutions that meet the demanding requirements of modern electronics. Their impressive features, combined with a focus on low power consumption and reliability, make them a preferred choice for engineers and developers aiming to create the next generation of innovative products.