Cypress CY7C1305BV25 manual Ordering Information, Package Diagram, CY7C1307BV25-167BZXI

Page 20

CY7C1305BV25

CY7C1307BV25

Ordering Information

“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit www.cypress.com for actual products offered”.

Speed

Ordering Code

Package

Package Type

Operating

(MHz)

Diagram

Range

 

 

 

 

 

167

CY7C1305BV25-167BZC

51-85180

165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)

Commercial

 

 

 

 

 

 

CY7C1307BV25-167BZC

 

 

 

 

 

 

 

 

 

CY7C1305BV25-167BZXC

 

165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free

 

 

 

 

 

 

 

CY7C1307BV25-167BZXC

 

 

 

 

 

 

 

 

 

CY7C1305BV25-167BZI

 

165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)

Industrial

 

 

 

 

 

 

CY7C1307BV25-167BZI

 

 

 

 

 

 

 

 

 

CY7C1305BV25-167BZXI

 

165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free

 

 

 

 

 

 

 

CY7C1307BV25-167BZXI

 

 

 

 

 

 

 

 

Package Diagram

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D 165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)

15.00±0.10

15.00±0.10

TOP VIEW

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

1

2

3

4

5

6

7

8

9

10

11

 

 

A

 

1

 

2

3

4

5

6

7

8

9

10

11

B

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CB

DC

ED

FE

GF

HG

JH

KJ

LK

ML

NM

PN

RP R

15.00±0.10

15.00±0.10

 

14.00

1.00

1.00

14.00

 

7.00

7.00

 

 

 

BOTTOM VIEW

 

 

 

 

 

 

 

 

 

 

 

 

BOTTOM VIEWPIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

Ø0.25 M C A B

 

 

 

 

 

 

 

 

 

 

Ø0.50

-0Ø0.06

.25 M C A B

 

 

 

 

 

 

 

(165X)

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

-0.06

 

 

 

11

10

9

8

7

6

5

Ø0.50

(165X)

 

4

3

2

1

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

 

 

 

 

 

11

10

9

8

7

6

5

4

3

2

1A

BA

CB

DC

ED

FE

GF

HG

JH

KJ

LK

ML

NM

PN

RP

R

A

0.25 C

A

0.3600.25.3±0C .05

 

 

 

 

A

 

5.00

1.00

 

 

 

 

A

 

1.00

 

 

 

 

 

 

 

 

 

 

 

 

 

5.00

 

 

 

 

 

 

 

10.00

 

 

 

 

 

 

 

10.00

B

13.00±0.10

 

 

 

B

13.00±0.10

B

13.00±0.10

 

 

 

B

 

13.00±0.10

 

 

 

 

 

0.15(4X)

 

 

 

1.40 MAX.

 

 

 

0.15(4X)

 

 

 

 

1.40MAX.

 

NOTES :

 

 

0.53±0.05

0.15 C

0.15C

SOLDERNOTESPAD TYPE:

: NON-SOLDER MASK DEFINED (NSMD)

PACKAGESOLDERW IGHTPAD: 0TYPE.475g: NON-SOLDER MASK DEFINED (NSMD)

 

 

 

 

 

 

 

 

 

 

JEDEC REFERENCEPACKAGE WEIGHT: MO-216: 0./475gDESIGN 4.6C

PACKAGEJEDECODEREFERENCE: BB0AC : MO-216 / DESIGN 4.6C

 

 

SEATING PLANE

 

 

PACKAGE CODE : BB0AC

 

 

 

 

 

C

 

SEATING PLANE

 

 

51-85180-*A

0.36

 

 

C

0.35±0.06

0.35±0.06

 

 

 

 

51-85180-*A

Quad Data Rate SRAM and QDR SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.

Document #: 38-05630 Rev. *A

Page 20 of 21

© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Contents Features ConfigurationsFunctional Description CY7C1305BV25 1M x CY7C1307BV25 512K xLogic Block Diagram CY7C1305BV25 Logic Block Diagram CY7C1307BV25Selection Guide CY7C1305BV25-167 UnitPin\Configuration Ball Fbga 13 x 15 x 1.4 mm Pinout CY7C1307BV25 512K xPin Definitions Introduction Application Example1 Write Cycle Descriptions CY7C1305BV25 2 OperationWrite Cycle Read CycleWrite Cycle Descriptions CY7C1307BV25 2 Are written into the deviceOperation Operation Document # 38-05630 Rev. *AIeee 1149.1 Serial Boundary Scan Jtag Sample Z TAP Controller State Diagram11 EXIT2-IR UPDATE-DR UPDATE-IRTAP Controller Block Diagram Parameter Description Test Conditions Min Max UnitParameter Description Min Max Unit Set-up TimesTAP Timing and Test Conditions14 Identification Register DefinitionsParameter Description Min Max Unit Output Times TCK Clock LOW to TDO ValidScan Register Sizes Instruction CodesRegister Name Bit Size Instruction Code DescriptionBoundary Scan Order Bit # Bump IDThermal Resistance22 Maximum RatingsOperating Range Capacitance22 AC Test Loads and WaveformsParameter Description Test Conditions Max Unit Input Capacitance TA = 25C, f = 1 MHz VDD =Switching Characteristics Over the Operating Range23 Cycle TimeSwitching Waveforms27, 28 NOP Read WritePackage Diagram Ordering InformationCY7C1307BV25-167BZC CY7C1305BV25-167BZXC CY7C1307BV25-167BZI CY7C1305BV25-167BZXIIssue Date Orig. Description of Change Document HistorySYT NXR

CY7C1307BV25, CY7C1305BV25 specifications

Cypress Semiconductor, a leader in embedded memory solutions, includes the CY7C1305BV25 and CY7C1307BV25 in its family of high-performance synchronous dynamic random-access memory (SDRAM) devices. These memory chips are designed for applications that require high-speed data processing and low power consumption, making them ideal for communication systems, networking devices, and other consumer electronics.

The CY7C1305BV25 is a 512K x 16-bit synchronous SRAM, while the CY7C1307BV25 offers a larger capacity of 1M x 16-bit. Both chips operate at a maximum clock frequency of 166 MHz, ensuring rapid data transfer rates and efficient memory operation. This high-speed performance is crucial in applications where quick data retrieval and storage are imperative.

One of the standout features of these devices is their ability to support a wide range of operating voltages, typically from 2.5V to 3.3V. This versatility allows them to be integrated into systems with varying power requirements, enhancing their adaptability for different designs. Additionally, the chips offer a low standby power consumption level, contributing to energy efficiency in battery-operated devices.

Both the CY7C1305BV25 and CY7C1307BV25 utilize a synchronous interface, allowing for coordinated data transfer with the system clock. This synchronization minimizes latency and improves overall system performance. The use of advanced pipelining techniques enables these devices to process multiple read and write commands concurrently, further boosting throughput.

In terms of reliability and durability, Cypress ensures that these memory chips comply with stringent industry standards. They are designed to withstand a wide temperature range, making them suitable for operation in diverse environments. The robust design includes features that mitigate the risk of data corruption and enhance data integrity, which is a vital consideration in mission-critical applications.

Overall, the CY7C1305BV25 and CY7C1307BV25 represent Cypress Semiconductor's commitment to delivering high-quality, high-performance memory solutions that meet the demanding requirements of modern electronics. Their impressive features, combined with a focus on low power consumption and reliability, make them a preferred choice for engineers and developers aiming to create the next generation of innovative products.