Cypress CY7C1383DV25, CY7C1381FV25, CY7C1381DV25, CY7C1383FV25 manual Ordering Information

Page 24

CY7C1381DV25, CY7C1381FV25

CY7C1383DV25, CY7C1383FV25

Ordering Information

Not all of the speed, package, and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered.

Speed

 

Package

Part and Package Type

 

Operating

(MHz)

Ordering Code

Diagram

 

Range

 

 

 

 

 

 

 

 

133

CY7C1381DV25-133AXC

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

Commercial

 

 

 

 

 

 

 

CY7C1383DV25-133AXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-133BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383FV25-133BGC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-133BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383FV25-133BGXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-133BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383DV25-133BZC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-133BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383DV25-133BZXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-133AXI

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

lndustrial

 

 

 

 

 

 

 

CY7C1383DV25-133AXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-133BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383FV25-133BGI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-133BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383FV25-133BGXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-133BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383DV25-133BZI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-133BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383DV25-133BZXI

 

 

 

 

 

 

 

 

 

 

100

CY7C1381DV25-100AXC

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

Commercial

 

 

 

 

 

 

 

CY7C1383DV25-100AXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-100BGC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383FV25-100BGC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-100BGXC

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383FV25-100BGXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-100BZC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383DV25-100BZC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-100BZXC

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383DV25-100BZXC

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-100AXI

51-85050

100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-Free

 

lndustrial

 

 

 

 

 

 

 

CY7C1383DV25-100AXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-100BGI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383FV25-100BGI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381FV25-100BGXI

51-85115

119-ball Ball Grid Array (14 x 22 x 2.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383FV25-100BGXI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-100BZI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

 

 

 

 

 

 

 

 

 

CY7C1383DV25-100BZI

 

 

 

 

 

 

 

 

 

 

 

CY7C1381DV25-100BZXI

51-85180

165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free

 

 

 

 

 

 

 

 

 

CY7C1383DV25-100BZXI

 

 

 

 

 

 

 

 

 

 

Document #: 38-05547 Rev. *E

 

 

Page 24 of 28

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Image 24
Contents Features Selection Guide Functional Description133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1381DV25/CY7C1381FV25 3 512K x Logic Block Diagram CY7C1383DV25/CY7C1383FV25 3 1M xPin Configurations Pin Tqfp Pinout 3 Chip Enable CY7C1381DV25 512K xCY7C1383DV25 Mbit x Pin Configurations Ball BGA Pinout Pin Configurations Ball Fbga Pinout3 Chip Enable Pin Definitions Name DescriptionByte write select inputs, active LOW. Qualified with Functional Overview Interleaved Burst Address Table Mode = Floating or VDD ZZ Mode Electrical CharacteristicsAddress = GNDAddress Cycle Description UsedTruth Table for Read/Write 4 Function CY7C1381DV25/CY7C1381FV25DQPB, Dqpa DQPC, DqpaTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetTAP AC Switching Characteristics TAP Timing5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentIdentification Register Definitions Scan Register SizesIdentification Codes Ball BGA Boundary Scan Order 13Instruction Code Description Bit # Ball IDA11 Electrical Characteristics Maximum RatingsOperating Range RangeCapacitance Thermal ResistanceAC Test Loads and Waveforms PackageSwitching Characteristics Parameter Description 133 MHz 100 MHz Unit MinMin Max Timing Diagrams Read Cycle TimingWrite Cycle Timing 25 AdscRead/Write Cycle Timing 25, 27 ADVZZ Mode Timing 29 DON’T CareOrdering Information Package Diagrams Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History

CY7C1383DV25, CY7C1381FV25, CY7C1381DV25, CY7C1383FV25 specifications

Cypress Semiconductor's family of static random-access memory (SRAM) chips, including the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25, are designed for high-performance applications that require fast access times and low power consumption. These devices are often found in applications such as networking, telecommunications, and industrial control systems, where speed and reliability are paramount.

The CY7C1381FV25 and CY7C1381DV25 are single-port SRAMs, while the CY7C1383FV25 and CY7C1383DV25 are dual-port versions that allow for simultaneous read and write operations from two different controllers. This feature significantly enhances data throughput, making these devices ideal for high-bandwidth applications. The devices support asynchronous read and write operations, ensuring immediate data accessibility with minimal latency.

One of the key features of these SRAM chips is their fast access times, with read and write cycles as short as 10 nanoseconds. This speed makes them suitable for cache memory applications, where performance is critical. Furthermore, the devices are built on Cypress's advanced process technology, which enables them to achieve high density and low power consumption, ideal for battery-operated devices and systems where energy efficiency is crucial.

The power consumption characteristics also highlight their effectiveness in various applications. The active power consumption can be as low as 80mA, depending on the operation conditions, and the devices offer low standby power, further enhancing their suitability for low-power applications. Additionally, these chips incorporate power-saving features like sleep mode, allowing designers to minimize energy consumption in idle states.

In terms of reliability, Cypress employs rigorous quality control measures, ensuring that the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25 meet stringent industry standards. They also feature an extended temperature range, which is vital for industrial applications that may experience harsh environmental conditions.

Overall, the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25 SRAM chips are versatile, high-performance memory solutions. Their combination of fast access times, low power consumption, and reliability makes them an excellent choice for engineers and developers looking to implement high-speed memory in a variety of applications. Whether for a communication device or a sophisticated industrial control system, these Cypress SRAMs stand out in the market for their performance and efficiency.