Cypress CY7C1383FV25, CY7C1383DV25, CY7C1381FV25 Soldernotespad Type NON-SOLDER Mask Defined Nsmd

Page 27

CY7C1381DV25, CY7C1381FV25

CY7C1383DV25, CY7C1383FV25

Package Diagrams (continued)

Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

TOP VIEW

 

 

 

 

 

 

TOP VIEW

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

1

2

3

4

5

6

7

8

9

10

11

BOTTOM VIEW

BOTTOM VIEWPIN 1 CORNER

PIN 1 CORNER

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

Ø0.25 M C A B

 

 

 

 

 

 

 

Ø0.50

-0Ø0.06

.25 M C A B

 

 

 

 

 

(165X)

 

 

 

 

 

 

 

 

 

+0.14

-0.06

 

11

10

9

8

7

6

5

Ø0.50

(165X)

4

3

2

1

 

 

 

 

 

 

 

 

 

+0.14

 

15.00±0.10

15.00±0.10

A

1

2

3

4

5

6

7

8

9

10

11

B

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CB

DC

ED

FE

GF

H

G

15.00±0.10

 

 

 

J

H

 

K

J

 

 

 

LK

ML

NM

PN

RP R

14.00 15.00±0.10

1.00

7.0014.00

1.00

7.00

11

10

9

8

7

6

5

4

3

2

1A

BA

CB

DC

ED

FE

GF

HG

JH

KJ

LK

ML

NM

PN

RP

R

A

0.25 C

A

0.3600.25.3±0C .05

A

B

13.00±0.10

 

 

B

13.00±0.10

 

 

0.53±0.05

1.40 MAX.

0.15 C 1.40 MAX.

0.15 C

C

SEATING PLANE

 

 

SEATING PLANE

 

 

 

 

 

0.36

C

 

 

0.35±0.06

0.35±0.06

 

 

1.00

A

5.00

1.00

 

5.00

 

10.00

 

10.00

B

13.00±0.10

B

13.00±0.10

0.15(4X)

 

0.15(4X)

 

NOTES :

 

SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)

PACKAGESOLDERW IGHTPAD: 0TYPE.475g: NON-SOLDER MASK DEFINED (NSMD)

JEDEC REFERENCEPACKAGE WEIGHT: MO-216: 0./475gDESIGN 4.6C

PACKAGEJEDECODEREFERENCE: BB0AC : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

51-85180-*A

Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.

Document #: 38-05547 Rev. *E

Page 27 of 28

© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Contents Cypress Semiconductor Corporation FeaturesSelection Guide Functional Description 133 MHz 100 MHz UnitLogic Block Diagram CY7C1383DV25/CY7C1383FV25 3 1M x Logic Block Diagram CY7C1381DV25/CY7C1381FV25 3 512K xPin Configurations Pin Tqfp Pinout 3 Chip Enable CY7C1381DV25 512K xCY7C1383DV25 Mbit x Pin Configurations Ball BGA Pinout Pin Configurations Ball Fbga Pinout3 Chip Enable Pin Definitions Name DescriptionByte write select inputs, active LOW. Qualified with Functional Overview = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics AddressUsed Address Cycle DescriptionDQPC, Dqpa Truth Table for Read/Write 4Function CY7C1381DV25/CY7C1381FV25 DQPB, DqpaTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterTAP Timing TAP AC Switching CharacteristicsScan Register Sizes 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsBit # Ball ID Identification CodesBall BGA Boundary Scan Order 13 Instruction Code DescriptionA11 Range Electrical CharacteristicsMaximum Ratings Operating RangePackage CapacitanceThermal Resistance AC Test Loads and WaveformsSwitching Characteristics Parameter Description 133 MHz 100 MHz Unit MinMin Max Read Cycle Timing Timing DiagramsAdsc Write Cycle Timing 25ADV Read/Write Cycle Timing 25, 27DON’T Care ZZ Mode Timing 29Ordering Information Pin Thin Plastic Quad Flat pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change

CY7C1383DV25, CY7C1381FV25, CY7C1381DV25, CY7C1383FV25 specifications

Cypress Semiconductor's family of static random-access memory (SRAM) chips, including the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25, are designed for high-performance applications that require fast access times and low power consumption. These devices are often found in applications such as networking, telecommunications, and industrial control systems, where speed and reliability are paramount.

The CY7C1381FV25 and CY7C1381DV25 are single-port SRAMs, while the CY7C1383FV25 and CY7C1383DV25 are dual-port versions that allow for simultaneous read and write operations from two different controllers. This feature significantly enhances data throughput, making these devices ideal for high-bandwidth applications. The devices support asynchronous read and write operations, ensuring immediate data accessibility with minimal latency.

One of the key features of these SRAM chips is their fast access times, with read and write cycles as short as 10 nanoseconds. This speed makes them suitable for cache memory applications, where performance is critical. Furthermore, the devices are built on Cypress's advanced process technology, which enables them to achieve high density and low power consumption, ideal for battery-operated devices and systems where energy efficiency is crucial.

The power consumption characteristics also highlight their effectiveness in various applications. The active power consumption can be as low as 80mA, depending on the operation conditions, and the devices offer low standby power, further enhancing their suitability for low-power applications. Additionally, these chips incorporate power-saving features like sleep mode, allowing designers to minimize energy consumption in idle states.

In terms of reliability, Cypress employs rigorous quality control measures, ensuring that the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25 meet stringent industry standards. They also feature an extended temperature range, which is vital for industrial applications that may experience harsh environmental conditions.

Overall, the CY7C1381FV25, CY7C1383DV25, CY7C1381DV25, and CY7C1383FV25 SRAM chips are versatile, high-performance memory solutions. Their combination of fast access times, low power consumption, and reliability makes them an excellent choice for engineers and developers looking to implement high-speed memory in a variety of applications. Whether for a communication device or a sophisticated industrial control system, these Cypress SRAMs stand out in the market for their performance and efficiency.
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