Hayes Microcomputer Products manual RCV56HCF PCI/CardBus Modem Designer’s Guide

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RCV56HCF PCI/CardBus Modem Designer’s Guide

1.3.5.2 Serial EEPROM Interface

A serial EEPROM is required to store the Maximum Latency, Minimum Grant, Device ID, Vendor ID, Subsystem ID, and Subsystem Vendor ID parameters for the PCI Configuration Space Header. The serial EEPROM interface connects to an Microchip 93LC66B, Atmel AT93C66, or equivalent 256 x 16 serial EEPROM. The interface signals are: a serial data input line from the EEPROM (SROMIN), a serial data output line to the EEPROM (SROMOUT), Clock to the EEPROM (SROMCLK), and chip select to the EEPROM (SROMCS). The EEPROM is programmable by the PC via the BIF.

1.3.5.3 Audio Interface

One Speaker output (SPKROUT_M) is provided for an optional OEM-supplied speaker circuit. Two microphone inputs are supported: one for Voice Microphone input (MIC_V) and one for Music Microphone input (MIC_M), e.g., music-on-hold.

The MIC_V and SPKROUT_M lines connect to the handset and speaker to support functions such as AudioSpan headset and speakerphone modes, FDSP, telephone emulation, microphone voice record, speaker voice playback, and call progress monitor.

The MIC_M input can accept an external audio signal to support the music-on-hold function and routes it to the telephone line. If music-on-hold function is not required, the microphone signal can be connected to the MIC_M input to support telephone emulation mode.

The Speaker output (SPKROUT_M) carries the normal speakerphone audio or reflects the received analog signals in the modem.

1.3.5.4 Telephone Line/Telephone/Audio Interface

The Telephone Line/Telephone/Audio Signal Interface can support a 3-relay telephone line interface (Figure 1-3). Signal routing for Voice mode is shown in Table 1-2. Relay positions for VoiceView are shown in Table 1-3.

The following signals are supported:

∙A single-ended Receive Analog input (RXA_L1) and a differential Transmit Analog output (TXA1_L1 and TXA2_L1) to the telephone line.

∙Off-hook (OH_L1#), Caller ID (CID_L1#), and Voice (VOICE_L1#) relay control outputs.

∙A Ring Indicate (IRING_L1) input.

∙A Loop Current Sense (LCS) input.

∙An input from the telephone microphone (TELIN_L1) and an output to the telephone speaker (TELOUT_L1 ) are supported in AudioSpan modes. These lines connect voice record/playback and AudioSpan audio to the local handset.

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Contents RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary FeaturesRCV56HCF PCI/CardBus Modem Designer’s Guide Fdsp Modem Models and FunctionsMarketing Model Number1PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Technical Overview General DescriptionOperating Modes Host-Controlled Modem Software Downloadable Modem Data Pump FirmwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S VOICE# CIDL1# Typical Signal Routing Voice ModeRelay Positions VoiceView Mode +VLS=This page is intentionally blank Establishing Data Modem Connections Data ModeFAX Class 1 Operation Error Correction and Data CompressionVOICE/AUDIO Mode MNP 10EC Enhanced Cellular ConnectionHOST-BASED Dsvd Mode FULL-DUPLEX Speakerphone Fdsp ModeVoiceview World Class Country Support DiagnosticsLOW Power Sleep Mode Caller IDHardware Interface Hardware Signal Pins and DefinitionsPIN Tqfp R6776 BUS InterfaceTqfp 11229 RCV56HCF MDPBus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# Bus Interface Pin Signal Definitions SystemPCI BUS Interface Reserved Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent DAA InterfaceMDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin TqfpPllgnd PLL MDP to Siemens PSB2186 S/T Interface MDP Pin Signal DefinitionsOverhead Signals BIF to MDP InterfacePllgnd Connection. Connect to Agnd MDP Signal Definitions ContdModem INTERCONNECT/NO Connect Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Current and Power RequirementsPCI Bus PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling Symbol Parameter Condition Min Max UnitsMDP Digital Electrical Characteristics Parameter Symbol Min Typ Max Units Test Conditions3 MDP TXA1L1 10. Analog Electrical CharacteristicsName Type Characteristic Value TELINL111. Timing Serial Eeprom Interface Interface Timing and WaveformsPCI Bus Timing Serial Eeprom TimingWrite Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing 12. Timing External Device Bus InterfaceISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD713. Timing IOM-2 Interface IOM-2 InterfaceThis page is intentionally blank Component Placement PC Board Layout GuidelinesGeneral Principles Signal Routing MDP VDD, VAA PowerModem Pin Noise Characteristics Device Function Noise Source Neutral Noise SensitiveGround Planes Crystal Circuit7 VCL1 and Vref Circuit Telephone and Local Handset Interface CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Other ConsiderationsMechanical Crystal Specifications Surface MountCharacteristic Value ElectricalCrystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package DimensionsRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Bit Offset 3124 2316 158 Hex PCI Configuration RegistersVendor ID Field Device ID FieldCommand Register Status RegisterBit Description Base Address Register CIS RAM Eeprom Configuration DataSerial Eeprom Interface Eeprom Address Copied toCommand Set Summary Functional Use Sort Command SETData Compression Command Set Summary Functional Use Sort Cont’dVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices
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