Hayes Microcomputer Products RCV56HCF CRYSTAL/OSCILLATOR Specifications, Other Considerations

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RCV56HCF PCI/CardBus Modem Designer’s Guide

4.1.8 Telephone and Local Handset Interface

1.Place common mode chokes in series with Tip and Ring for each connector.

2.Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines, however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design aid is to place footprints for these components and populate as necessary during performance/EMI testing and certification.

3.Place high voltage filter capacitors (.001 µF @1KV) from Tip and Ring to digital ground.

4.1.9 Optional Configurations

Because fixed requirements of a design may alter EMI performance, guidelines that work in one case may deliver little or no performance enhancement in another. Initial board design should, therefore, include flexibility to allow evaluation of optional configurations. These optional configurations may include:

1.Chokes in Tip and Ring lines replaced with jumper wires as a cost reduction if the design has sufficient EMI margin.

2.Various grounding areas connected by tie points (these tie points can be short jumper wires, solder bridges between close traces, etc.).

3.Develop two designs in parallel; one based on a 2-layer board and the other based on a 4-layer board. During the evaluation phase, better performance of one design over another may result in quicker time to market.

4.1.10 MDP Specific

1.Locate the MDP device and all supporting analog circuitry, including the data access arrangement, on the same area of the PCB.

2.Locate the analog components close to and on the side of board containing the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and SPKROUT_M signals.

3.Avoid placing noisy components and traces near the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and SPKROUT_M lines.

4.Route MDP modem interconnect signals by the shortest possible route avoiding all analog components.

5.Provide an RC network on the AVAA supply in the immediate proximity of the AVAA pin to filter out high frequency noise above 115 kHz. A tantalum capacitor is recommended (especially in a 2-layer board design) for improved noise immunity with a current limiting series resistor or inductor to the VCC supply which meets the RC filter frequency requirements.

6.Provide a 0.1 µF ceramic decoupling capacitor to ground between the high frequency filter and the VAA pin.

7.Provide a 0.1 µF ceramic decoupling capacitor to ground between the VCC supply and the AVDD pin.

4.2CRYSTAL/OSCILLATOR SPECIFICATIONS

Recommended surface-mount crystal specifications are listed in Table 4-2.

Recommended through-hole crystal specifications are listed in Table 4-3.

4.3 OTHER CONSIDERATIONS

The DAA design described in this designer's guide is a wet DAA, i.e., it requires line current to be present to pass the signal. Therefore, if the modem is to be connected back-to-back by cable directly to another modem, the modems will not be able to connect. The DAAs must be modified to operate dry, i.e., without line current, when used in this environment.

A complete schematic is available for the RCV56HCF Data/Fax Modem PCI Half Card Reference Design (TR04-D380).

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ROCKWELL PROPRIETARY INFORMATION

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Contents RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary FeaturesRCV56HCF PCI/CardBus Modem Designer’s Guide Marketing Modem Models and FunctionsModel Number1 FdspPC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Operating Modes Technical OverviewGeneral Description Hardware Interfaces Host-Controlled Modem SoftwareDownloadable Modem Data Pump Firmware RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S Relay Positions VoiceView Mode Typical Signal Routing Voice Mode+VLS= VOICE# CIDL1#This page is intentionally blank Establishing Data Modem Connections Data ModeVOICE/AUDIO Mode Error Correction and Data CompressionMNP 10EC Enhanced Cellular Connection FAX Class 1 OperationVoiceview HOST-BASED Dsvd ModeFULL-DUPLEX Speakerphone Fdsp Mode LOW Power Sleep Mode DiagnosticsCaller ID World Class Country SupportHardware Interface Hardware Signal Pins and DefinitionsTqfp 11229 BUS InterfaceRCV56HCF MDP PIN Tqfp R6776Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# PCI BUS Interface Bus Interface Pin Signal DefinitionsSystem Serial Eeprom Interface NMC93C56 or Equivalent Bus Interface Pin Signal Definitions Cont’dDAA Interface ReservedMDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin TqfpPllgnd PLL Overhead Signals MDP Pin Signal DefinitionsBIF to MDP Interface MDP to Siemens PSB2186 S/T InterfacePllgnd Connection. Connect to Agnd MDP Signal Definitions ContdModem INTERCONNECT/NO Connect Power and Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsCurrent and Power Requirements Maximum RatingsPCI Bus AC Specifications for 3.3V Signaling PCI Bus DC Specifications for 3.3V SignalingSymbol Parameter Condition Min Max Units PCI Bus3 MDP MDP Digital Electrical CharacteristicsParameter Symbol Min Typ Max Units Test Conditions Name Type Characteristic Value 10. Analog Electrical CharacteristicsTELINL1 TXA1L1PCI Bus Timing Interface Timing and WaveformsSerial Eeprom Timing 11. Timing Serial Eeprom InterfaceExternal Device Bus Timing Symbol Description Min Typ Max Units Test Conditions Read12. Timing External Device Bus Interface WriteISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD713. Timing IOM-2 Interface IOM-2 InterfaceThis page is intentionally blank General Principles Component PlacementPC Board Layout Guidelines Signal Routing Modem Pin Noise Characteristics PowerDevice Function Noise Source Neutral Noise Sensitive MDP VDD, VAA7 VCL1 and Vref Circuit Ground PlanesCrystal Circuit Optional Configurations CRYSTAL/OSCILLATOR SpecificationsOther Considerations Telephone and Local Handset InterfaceCharacteristic Value Crystal Specifications Surface MountElectrical MechanicalCrystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package DimensionsRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Vendor ID Field PCI Configuration RegistersDevice ID Field Bit Offset 3124 2316 158 HexBit Description Command RegisterStatus Register Base Address Register Serial Eeprom Interface Eeprom Configuration DataEeprom Address Copied to CIS RAMCommand Set Summary Functional Use Sort Command SETData Compression Command Set Summary Functional Use Sort Cont’dVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices
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