Hayes Microcomputer Products RCV56HCF manual Typical Audio Signal Interface U.S

Page 16

 

RCV56HCF PCI/CardBus Modem Designer’s Guide

 

 

LCS_L1#

 

 

 

 

 

 

IRING_L1#

 

 

 

 

 

 

VOICE#

 

 

 

 

 

 

OH_L1#

 

 

 

 

 

 

CID_L1#

 

 

 

 

 

 

VC_L1

 

 

 

 

 

 

TXA1_L1

 

 

 

 

 

 

TXA2_L1

HYBRD

SSI

 

 

 

 

RXA_L1

&

SURG

 

 

 

&

 

TEL LINE

 

XFRMR

 

 

 

PROT

 

 

 

 

BRDGE

 

 

 

 

 

 

 

 

 

 

CALLID

OH

 

 

 

 

 

RELAY

RELAY

CUR

 

 

 

 

 

 

 

 

 

TELOUT_L1

 

 

SRC

 

 

 

 

 

 

 

 

RCV56HCF

TELIN_L1

 

HANDSET

 

 

 

 

HYBRID

 

 

 

MODEM

 

 

 

 

RNG

TEL HANDSET

DEVICE

 

 

 

VOICE

DET

 

 

 

 

 

RELAY

 

LCS

 

 

TELEPHONE LINE/TELEPHONE HANDSET

 

 

 

INTERFACE CIRCUIT

 

 

 

MIC_M

 

 

 

 

 

 

MIC_V

 

 

BIAS

 

MICROPHONE

 

 

 

 

 

 

SPKROUT_M

 

 

AMP/

 

HEADPHONE

 

 

 

SOUNDUCER

 

 

 

 

 

 

 

 

 

 

(OPTIONAL)

 

 

 

 

 

AUDIO/HEADPHONE

 

 

 

 

 

INTERFACE CIRCUIT

 

 

 

 

 

 

 

 

1123F1-3 AIF 3R-US

Figure 1-3. Typical Audio Signal Interface (U.S.)

1-10

ROCKWELL PROPRIETARY INFORMATION

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Contents RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features SummaryRCV56HCF PCI/CardBus Modem Designer’s Guide Modem Models and Functions MarketingModel Number1 FdspPC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS General Description Technical OverviewOperating Modes Downloadable Modem Data Pump Firmware Host-Controlled Modem SoftwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S Typical Signal Routing Voice Mode Relay Positions VoiceView Mode+VLS= VOICE# CIDL1#This page is intentionally blank Data Mode Establishing Data Modem ConnectionsError Correction and Data Compression VOICE/AUDIO ModeMNP 10EC Enhanced Cellular Connection FAX Class 1 OperationFULL-DUPLEX Speakerphone Fdsp Mode HOST-BASED Dsvd ModeVoiceview Diagnostics LOW Power Sleep ModeCaller ID World Class Country SupportHardware Signal Pins and Definitions Hardware InterfaceBUS Interface Tqfp 11229RCV56HCF MDP PIN Tqfp R6776Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# System Bus Interface Pin Signal DefinitionsPCI BUS Interface Bus Interface Pin Signal Definitions Cont’d Serial Eeprom Interface NMC93C56 or EquivalentDAA Interface ReservedMDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1Pllgnd PLL MDP Pin Signal Definitions Overhead SignalsBIF to MDP Interface MDP to Siemens PSB2186 S/T InterfaceMDP Signal Definitions Contd Pllgnd Connection. Connect to AgndModem INTERCONNECT/NO Connect ELECTRICAL,SWITCHING,AND Environmental Characteristics Power and Maximum RatingsCurrent and Power Requirements Maximum RatingsPCI Bus DC Specifications for 3.3V Signaling PCI Bus AC Specifications for 3.3V SignalingSymbol Parameter Condition Min Max Units PCI BusParameter Symbol Min Typ Max Units Test Conditions MDP Digital Electrical Characteristics3 MDP 10. Analog Electrical Characteristics Name Type Characteristic ValueTELINL1 TXA1L1Interface Timing and Waveforms PCI Bus TimingSerial Eeprom Timing 11. Timing Serial Eeprom InterfaceSymbol Description Min Typ Max Units Test Conditions Read External Device Bus Timing12. Timing External Device Bus Interface WriteISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7IOM-2 Interface 13. Timing IOM-2 InterfaceThis page is intentionally blank PC Board Layout Guidelines Component PlacementGeneral Principles Signal Routing Power Modem Pin Noise CharacteristicsDevice Function Noise Source Neutral Noise Sensitive MDP VDD, VAACrystal Circuit Ground Planes7 VCL1 and Vref Circuit CRYSTAL/OSCILLATOR Specifications Optional ConfigurationsOther Considerations Telephone and Local Handset InterfaceCrystal Specifications Surface Mount Characteristic ValueElectrical MechanicalCrystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin TqfpRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank PCI Configuration Registers Vendor ID FieldDevice ID Field Bit Offset 3124 2316 158 HexStatus Register Command RegisterBit Description Base Address Register Eeprom Configuration Data Serial Eeprom InterfaceEeprom Address Copied to CIS RAMCommand SET Command Set Summary Functional Use SortCommand Set Summary Functional Use Sort Cont’d Data CompressionVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices