Hayes Microcomputer Products manual RCV56HCF PCI/CardBus Modem Designer’s Guide

Page 8

RCV56HCF PCI/CardBus Modem Designer’s Guide

∙AudioSpan (simultaneous audio/voice and data)*

−ITU-T V.61 modulation (4.8 kbps data plus audio)

−Handset, headset, or half-duplex speakerphone

∙ITU-T V.70 DSVD (option)

−ITU-T G.729 Annex A with interoperable G.729 Annex B

−SIG (special interest group) DigiTalk DSVD

−Voice/silence detection and handset echo cancellation

−Handset, headset, or half-duplex speakerphone

∙Full-duplex speakerphone (FDSP) mode

−Over PSTN or ISDN B channel (option)

−Switching to/from data, fax, DSVD and VoiceView

−Microphone gain and muting

−Speaker volume control and muting

−Adaptive line and acoustic echo cancellation

−Loop gain control, transmit and receive path AGC

−Acoustic echo cancellation concurrent with DSVD

−Noise suppression

−Room monitor

∙V.80 and Rockwell Video Ready synchronous access modes support host-controlled communication protocols

−H.324 interface support

∙V.8/V.8bis and supporting AT commands (V.25 ter with Annex A)

∙Data/Fax/VoiceView/Voice call discrimination

∙Voice, telephony, audio, VoiceView

−Voice (8-bit μ-Law compression/decompression)

−TIA-695 command set

−VoiceView alternating voice and data (option)

−8-bit linear and 8-bit μ-Law record/playback

−8.0 kHz, 11.025 kHz, 22.050 kHz and 44.1 kHz (down sampled to 11.025)

−Handset, acoustic, line echo cancellation

−Music on hold from host or analog hardware input

−TAM support with concurrent DTMF detect, ring detect and caller ID

∙World-class operation (option)

−Call progress, blacklisting, multiple country support

∙Integrated internal hybrid

∙Caller ID and distinctive ring detect

∙Modem and audio paths concurrent across PCI bus

∙Single profile stored in host

∙System compatibilities

−Windows 95 and Windows NT operating systems

−Microsoft's PC 97 Design Initiative compliant

−Unimodem/V compliant

∙32-bit PCI Local Bus interface

−Conforms to the PCI Local Bus Specification, Production Version, Revision 2.1

−PCI Bus Mastering interface to the MDP

−CardBus support with 512-byte RAM for CIS

−33 MHz PCI clock support

∙Device packages:

−Bus Interface in 176-pin TQFP

−MDP in 144-pin TQFP

∙+3.3V operation

* See Note 6 in Table 1-1.

1-2

ROCKWELL PROPRIETARY INFORMATION

1129

Image 8

Contents RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features SummaryRCV56HCF PCI/CardBus Modem Designer’s Guide Modem Models and Functions MarketingModel Number1 FdspPC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Operating Modes Technical OverviewGeneral Description Hardware Interfaces Host-Controlled Modem SoftwareDownloadable Modem Data Pump Firmware RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S Typical Signal Routing Voice Mode Relay Positions VoiceView Mode+VLS= VOICE# CIDL1#This page is intentionally blank Data Mode Establishing Data Modem ConnectionsError Correction and Data Compression VOICE/AUDIO ModeMNP 10EC Enhanced Cellular Connection FAX Class 1 OperationVoiceview HOST-BASED Dsvd ModeFULL-DUPLEX Speakerphone Fdsp Mode Diagnostics LOW Power Sleep ModeCaller ID World Class Country SupportHardware Signal Pins and Definitions Hardware InterfaceBUS Interface Tqfp 11229RCV56HCF MDP PIN Tqfp R6776Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# PCI BUS Interface Bus Interface Pin Signal DefinitionsSystem Bus Interface Pin Signal Definitions Cont’d Serial Eeprom Interface NMC93C56 or EquivalentDAA Interface ReservedMDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1Pllgnd PLL MDP Pin Signal Definitions Overhead SignalsBIF to MDP Interface MDP to Siemens PSB2186 S/T InterfaceMDP Signal Definitions Contd Pllgnd Connection. Connect to AgndModem INTERCONNECT/NO Connect ELECTRICAL,SWITCHING,AND Environmental Characteristics Power and Maximum RatingsCurrent and Power Requirements Maximum RatingsPCI Bus DC Specifications for 3.3V Signaling PCI Bus AC Specifications for 3.3V SignalingSymbol Parameter Condition Min Max Units PCI Bus3 MDP MDP Digital Electrical CharacteristicsParameter Symbol Min Typ Max Units Test Conditions 10. Analog Electrical Characteristics Name Type Characteristic ValueTELINL1 TXA1L1Interface Timing and Waveforms PCI Bus TimingSerial Eeprom Timing 11. Timing Serial Eeprom InterfaceSymbol Description Min Typ Max Units Test Conditions Read External Device Bus Timing12. Timing External Device Bus Interface WriteISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7IOM-2 Interface 13. Timing IOM-2 InterfaceThis page is intentionally blank General Principles Component PlacementPC Board Layout Guidelines Signal Routing Power Modem Pin Noise CharacteristicsDevice Function Noise Source Neutral Noise Sensitive MDP VDD, VAA7 VCL1 and Vref Circuit Ground PlanesCrystal Circuit CRYSTAL/OSCILLATOR Specifications Optional ConfigurationsOther Considerations Telephone and Local Handset InterfaceCrystal Specifications Surface Mount Characteristic ValueElectrical MechanicalCrystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin TqfpRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank PCI Configuration Registers Vendor ID FieldDevice ID Field Bit Offset 3124 2316 158 HexBit Description Command RegisterStatus Register Base Address Register Eeprom Configuration Data Serial Eeprom InterfaceEeprom Address Copied to CIS RAMCommand SET Command Set Summary Functional Use SortCommand Set Summary Functional Use Sort Cont’d Data CompressionVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices