Hayes Microcomputer Products
RCV56HCF
manual
Inside Back Cover
Name Type Characteristic Value
MDP 144-Pin Tqfp Pin Signals
Dimension
Optional Configurations
Diagnostics
Command Register
Component Placement
Power and Maximum Ratings
Features
Relay Positions VoiceView Mode
Page 69
NOTES
(Inside Back Cover)
Page 68
Page 70
Image 69
Page 68
Page 70
Contents
RCV56HCF
RCV56HCF PCI/CardBus Modem Designer’s Guide
Table of Contents
Command SET Rockwell Proprietary Information
List of Figures
List of Tables
Summary
Features
RCV56HCF PCI/CardBus Modem Designer’s Guide
Marketing
Modem Models and Functions
Model Number1
Fdsp
PC Software
RCV56HCF Hardware Configuration Block Diagram
Data Pump BUS
Technical Overview
General Description
Operating Modes
Host-Controlled Modem Software
Downloadable Modem Data Pump Firmware
Hardware Interfaces
RCV56HCF PCI/CardBus Modem Designer’s Guide
Typical Audio Signal Interface U.S
Relay Positions VoiceView Mode
Typical Signal Routing Voice Mode
+VLS=
VOICE# CIDL1#
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Establishing Data Modem Connections
Data Mode
VOICE/AUDIO Mode
Error Correction and Data Compression
MNP 10EC Enhanced Cellular Connection
FAX Class 1 Operation
HOST-BASED Dsvd Mode
FULL-DUPLEX Speakerphone Fdsp Mode
Voiceview
LOW Power Sleep Mode
Diagnostics
Caller ID
World Class Country Support
Hardware Interface
Hardware Signal Pins and Definitions
Tqfp 11229
BUS Interface
RCV56HCF MDP
PIN Tqfp R6776
Bus Interface 176-Pin Tqfp Hardware Interface Signals
Bus Interface 176-Pin Tqfp Pin Signals
Pin Signal Label Type1 Interface
DEVSEL#
Bus Interface Pin Signal Definitions
System
PCI BUS Interface
Serial Eeprom Interface NMC93C56 or Equivalent
Bus Interface Pin Signal Definitions Cont’d
DAA Interface
Reserved
MDP Interface
Isdn Interface Isdn Models
Isdn Interface NON-ISDN Models
MDP 144-Pin Tqfp Hardware Interface Signals
MDP 144-Pin Tqfp Pin Signals
Pin Signal Label Interface3 Type1
MDP Pin Signals 144-Pin Tqfp
Pllgnd PLL
Overhead Signals
MDP Pin Signal Definitions
BIF to MDP Interface
MDP to Siemens PSB2186 S/T Interface
Pllgnd Connection. Connect to Agnd
MDP Signal Definitions Contd
Modem INTERCONNECT/NO Connect
Power and Maximum Ratings
ELECTRICAL,SWITCHING,AND Environmental Characteristics
Current and Power Requirements
Maximum Ratings
PCI Bus AC Specifications for 3.3V Signaling
PCI Bus DC Specifications for 3.3V Signaling
Symbol Parameter Condition Min Max Units
PCI Bus
MDP Digital Electrical Characteristics
Parameter Symbol Min Typ Max Units Test Conditions
3 MDP
Name Type Characteristic Value
10. Analog Electrical Characteristics
TELINL1
TXA1L1
PCI Bus Timing
Interface Timing and Waveforms
Serial Eeprom Timing
11. Timing Serial Eeprom Interface
External Device Bus Timing
Symbol Description Min Typ Max Units Test Conditions Read
12. Timing External Device Bus Interface
Write
ISDNCS# DWR# DD0-DD7
ISDNCS# DRD# DD0-DD7
13. Timing IOM-2 Interface
IOM-2 Interface
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Component Placement
PC Board Layout Guidelines
General Principles
Signal Routing
Modem Pin Noise Characteristics
Power
Device Function Noise Source Neutral Noise Sensitive
MDP VDD, VAA
Ground Planes
Crystal Circuit
7 VCL1 and Vref Circuit
Optional Configurations
CRYSTAL/OSCILLATOR Specifications
Other Considerations
Telephone and Local Handset Interface
Characteristic Value
Crystal Specifications Surface Mount
Electrical
Mechanical
Crystal Specifications Through Hole
Package Dimensions 144-Pin Tqfp
Package Dimensions
RCV56HCF PCI/CardBus Modem Designer’s Guide
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Vendor ID Field
PCI Configuration Registers
Device ID Field
Bit Offset 3124 2316 158 Hex
Command Register
Status Register
Bit Description
Base Address Register
Serial Eeprom Interface
Eeprom Configuration Data
Eeprom Address Copied to
CIS RAM
Command Set Summary Functional Use Sort
Command SET
Data Compression
Command Set Summary Functional Use Sort Cont’d
Voice Commands
Command Set Summary Alphanumeric Sort
Command Set Summary Alphanumeric Sort Cont’d
RCV56HCF PCI/CardBus Modem Designer’s Guide
Inside Back Cover
Regional Sales Offices
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