Hayes Microcomputer Products RCV56HCF manual MDP Signal Definitions Contd

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RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 3-4. MDP Signal Definitions (Cont'd)

Label	I/O Type	Signal Name/Description
	TELEPHONE LINE/TELEPHONE/AUDIO INTERFACE SIGNALS AND REFERENCE VOLTAGE
TXA1_L1	O(DF)	Transmit Analog 1 and 2. The TXA1_L1 and TXA2_L1 outputs are differential outputs 180 degrees out of
TXA2_L1		phase with each other. Each output can drive a 300 Ω load.
RXA_L1	I(DA)	Receive Analog. RXA_L1 is a single-ended receive data input from the telephone line interface or an optional
		external hybrid circuit. The input impedance is > 70k Ω.
TELOUT_L1	O(DF)	Telephone Handset Analog Output. TELOUT_L1 is a single-ended analog output to the telephone handset
		speaker interface circuit. TELOUT_L1 can drive a 300 Ω load.
TELIN_L1	I(DA)	Telephone Handset Analog Input. TELIN_L1 is a single-ended analog input from the telephone handset
		microphone interface circuit. The input impedance is > 70k Ω.

MIC_M	I(DA)	Modem Microphone Input. MIC_M is a single-ended microphone input. The input impedance is > 70k Ω.
MIC_V	I(DA)	Voice Microphone Input. MIC_V is a single-ended microphone input. The input impedance is > 70k Ω.
SPKROUT_M	O(DF)	Modem Speaker Analog Output. The SPKROUT_M analog output reflects the received analog input signal.
		The SPKROUT_M on/off and three levels of attenuation are controlled by bits in DSP RAM. When the speaker
		is turned off, the SPKROUT_M output is clamped to the voltage at the VC_L1 pin. The SPKROUT_M output
		can drive an impedance as low as 300 ohms. In a typical application, the SPKROUT_M output is an input to
		an external LM386 audio power amplifier.
VREF	REF	High Voltage Reference. Connect to VC_L1 through 10 µF (polarized, + terminal to VREF) and 0.1 µF
		(ceramic) in parallel.
VC_L1	REF	Low Voltage Reference. Connect to analog ground through 10 µF (polarized, + terminal to VC_L1) and
		0.1 µF (ceramic) in parallel.

PLLVDD	PLL	PLLVDD Connection. Connect to VAA and to AGND through 0.1 μF.
PLLGND	PLL	PLLGND Connection. Connect to AGND.
MK4, MK5	IA	PLL Circuit Strap Option. Connect MK4 to digital ground and leave MK5 open in order to enable the internal
		PLL circuit.
SPKMD	OA	Modem Speaker Digital Output. The SPKMD digital output reflects the received analog input signal digitized
		to TTL high or low level by an internal comparator to create a PC Card (PCMCIA)-compatible signal.

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ROCKWELL PROPRIETARY INFORMATION

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Contents RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features SummaryRCV56HCF PCI/CardBus Modem Designer’s Guide Model Number1 Modem Models and FunctionsMarketing FdspPC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Operating Modes Technical OverviewGeneral Description Hardware Interfaces Host-Controlled Modem SoftwareDownloadable Modem Data Pump Firmware RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S +VLS= Typical Signal Routing Voice ModeRelay Positions VoiceView Mode VOICE# CIDL1#This page is intentionally blank Data Mode Establishing Data Modem ConnectionsMNP 10EC Enhanced Cellular Connection Error Correction and Data CompressionVOICE/AUDIO Mode FAX Class 1 OperationVoiceview HOST-BASED Dsvd ModeFULL-DUPLEX Speakerphone Fdsp Mode Caller ID DiagnosticsLOW Power Sleep Mode World Class Country SupportHardware Signal Pins and Definitions Hardware InterfaceRCV56HCF MDP BUS InterfaceTqfp 11229 PIN Tqfp R6776Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# PCI BUS Interface Bus Interface Pin Signal DefinitionsSystem DAA Interface Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent ReservedMDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1Pllgnd PLL BIF to MDP Interface MDP Pin Signal DefinitionsOverhead Signals MDP to Siemens PSB2186 S/T InterfaceMDP Signal Definitions Contd Pllgnd Connection. Connect to AgndModem INTERCONNECT/NO Connect Current and Power Requirements ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Maximum RatingsSymbol Parameter Condition Min Max Units PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling PCI Bus3 MDP MDP Digital Electrical CharacteristicsParameter Symbol Min Typ Max Units Test Conditions TELINL1 10. Analog Electrical CharacteristicsName Type Characteristic Value TXA1L1Serial Eeprom Timing Interface Timing and WaveformsPCI Bus Timing 11. Timing Serial Eeprom Interface12. Timing External Device Bus Interface Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing WriteISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7IOM-2 Interface 13. Timing IOM-2 InterfaceThis page is intentionally blank General Principles Component PlacementPC Board Layout Guidelines Signal Routing Device Function Noise Source Neutral Noise Sensitive PowerModem Pin Noise Characteristics MDP VDD, VAA7 VCL1 and Vref Circuit Ground PlanesCrystal Circuit Other Considerations CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Telephone and Local Handset InterfaceElectrical Crystal Specifications Surface MountCharacteristic Value MechanicalCrystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin TqfpRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Device ID Field PCI Configuration RegistersVendor ID Field Bit Offset 3124 2316 158 HexBit Description Command RegisterStatus Register Base Address Register Eeprom Address Copied to Eeprom Configuration DataSerial Eeprom Interface CIS RAMCommand SET Command Set Summary Functional Use SortCommand Set Summary Functional Use Sort Cont’d Data CompressionVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices