Telit Wireless Solutions GE863-PY, GE863-QUAD manual Thermal Design Guidelines

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GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

As you can see, the charging process is not a trivial task to be done; moreover all these operations should start only if battery temperature is inside a charging range, usually 5°C - 45°C.

The GE863-QUAD/PY measures the temperature of its internal component, in order to satisfy this last requirement, it's not exactly the same as the battery temperature but in common application the two temperature should not differ too much and the charging temperature range should be guaranteed.

NOTE: For all the threshold voltages, inside the GE863-QUAD/PY all threshold are fixed in order to maximize Li-Ion battery performances and do not need to be changed.

NOTE: In this application the battery charger input current must be limited to less than 400mA. This can be done by using a current limited wall adapter as the power source.

4.2.2Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

Average current consumption during transmission @PWR level max (rms):

500mA

Average current consumption during transmission @ PWR level min (rms):

100mA

Average current during Power Saving:

4mA

Average current during idle (Power Saving disabled)

19mA

NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls.

If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 500mA maximum RMS current, or even could be the simple chip package (no heat sink).

Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 500mA, being usually around 150mA.

For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the GE863-QUAD/PY, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload.

This generated heat will be mostly conducted to the ground plane under the GE863-QUAD/PY; you must ensure that your application can dissipate it.

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Contents GE863-QUAD GE863-PY Hardware User Guide Contents 10.1 10.210.3 10.413.2 12.113.1 This document is relating to the following products Overview GE863 module connections PIN-OUTPin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Hardware Commands Turning on the GE863-QUAD/PYTurning OFF the GE863-QUAD/PY Turning off of the device can be done in two waysHardware Unconditional Reboot Hardware shutdownGE863-QUAD GE863-QUAD/PY power requirements are Power Supply1Power Supply Requirements 2General Design Rules Electrical design Guidelines1.2 + 12V input Source Power Supply Design Guidelines An example of linear regulator with 5V input isBattery Source Power Supply Design Guidelines An example of switching regulator with 12V input isBattery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines Antenna GSM Antenna RequirementsGSM Antenna PCB line Guidelines GSM Antenna installation GuidelinesSerial Ports Absolute Maximum Ratings -Not Functional Parameter Min Max Level Min MaxSignals in the Uart connector on the EVK are Number Pad Number17-28-36 Ground 45-48-50-56 Clear to Send Output from the GE863-QUAD/PY that3RS232 level translation It is available on the following pins2MODEM Serial Port 2 Python Debug An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS Microphone Paths Characteristic and Requirements Echo canceller type HandsetEcho canceller type Car kit hands-free + 20dBThat means You can set GA= +20dB to use standard resistor valuesTIP environment consideration General Design Rules Other considerationsMicrophone Biasing Balanced Microphone BiasingUnbalanced Microphone Biasing GE863-QUAD Sample circuit can be Microphone BufferingBuffered Balanced Mic Gain = RR604605 = RR607606 Buffer gain is given by the formulaBuffered Unbalanced Single Ended Microphone Freq . = 2π * R719* C726 2π * R711* C727 Buffer bandwidth at -3dB shall be 4KHzGE863-QUAD Output Lines Speaker Short descriptionOutput Lines Characteristics SW volume level step Number of SW volume stepsNoise Filtering Handset Earphone Design Hands-Free Earphone Low Power Design An example of internal Ear amplifier could beCar Kit Speakerphone Design Evaluation Kit for Telit Modules EVK2 Short Description2 EVK2 Audio Lines Characteristics @ 350mWData Integrity ESDSchematic SIM SupplyLayout General Purpose I/O Using a Gpio Pad as InputUsing a Gpio Pad as Output 10.3Using the Alarm Output GPIO6 Using the Buzzer Output GPIO7DAC and ADC section 11.1DAC ConverterDescription Min Max UnitsAn AT command is available to use the DAC function Command is AT#DAC=enable,valueEnabling DAC Low Pass Filter Example11.2ADC Converter Using ADC ConverterInput Voltage range AD conversion Bits Resolution Camera 12.1Transchip CameraType Sensitivity LuxCamera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Taking an reading a photo Camera setting shown here are the defaults onesExample usage script for camera 13.1General 13.2Module Finishing & DimensionsMounting the GE863-QUAD / PY on the Application Board Surface finishing Ni/Au for all test pads Lead-free AlloyRecommended foot print for the application PCB pad Design Debug of the GE863 in ProductionStencil Solder paste 13.2.6 GE863-QUAD / PY Solder Reflow Following is the recommended solder reflow profileGE863-QUAD Packing System Section A-AModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Document Change Log Revision Date Changes21/02/06 19/09/06