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12 | Camera | 1vv0300715 Rev. 1 - 19/09/06 | |
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12.1 | Transchip Camera | 60 | |
| 12.1.1 | Camera Interface Connectors | 61 |
| 12.1.2 EVB for Transchip camera support | 63 | |
| 12.1.3 Block Diagram for supported cameras | 64 | |
| 12.1.4 Schematic Diagrams for supported camera | 65 | |
| 12.1.5 Example usage script for camera | 66 | |
13 | Mounting the | 67 | |
13.1 | General | 67 | |
13.2 | Module Finishing & Dimensions | 67 | |
| 13.2.1 Recommended foot print for the application | 69 | |
| 13.2.2 Debug of the GE863 in Production | 70 | |
| 13.2.3 | Stencil | 70 |
| 13.2.4 | PCB pad Design | 70 |
| 13.2.5 | Solder paste | 71 |
| 13.2.6 | 72 | |
| 13.2.7 | Packing System | 74 |
| 13.2.8 | Moisture Sensibility | 76 |
14 | Conformity Assessment Issues | 77 | |
15 | SAFETY RECOMMANDATIONS | 78 | |
16 | Document Change Log | 79 |
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Right reserved | page 4 of 79 |