Telit Wireless Solutions GE863-QUAD, GE863-PY manual

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GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

Profile Feature

 

Pb-Free Assembly

 

 

 

 

 

Average ramp-up rate (TL to TP)

 

3°C/second max

 

 

 

 

 

Preheat:

 

150°C

 

– Temperature Min (Tsmin)

 

 

– Temperature Max (Tsmax)

 

200°C

 

– Time (min to max) (ts)

 

60-180 seconds

 

 

 

 

 

Tsmax to TL:

 

3°C/second max

 

Ramp-up Rate

 

 

 

 

 

 

Time maintained above:

 

217°C

 

– Temperature (TL)

 

 

– Time (tL)

 

60-150 seconds

 

 

 

 

 

Peak Temperature (Tp):

 

245 +0/-5°C

 

 

 

 

 

Time within 5°C of actual Peak

 

10-30 seconds

 

Temperature (tp)

 

 

 

 

 

 

 

Ramp-down Rate

 

6°C/second max.

 

 

 

 

 

Time 25°C to Peak Temperature

 

8 minutes max.

 

 

 

 

 

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE863-QUAD / PY module can accept only one reflow process

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Contents GE863-QUAD GE863-PY Hardware User Guide Contents 10.2 10.110.3 10.413.1 12.113.2 This document is relating to the following products Overview PIN-OUT GE863 module connectionsPin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Turning on the GE863-QUAD/PY Hardware CommandsTurning off of the device can be done in two ways Turning OFF the GE863-QUAD/PYHardware shutdown Hardware Unconditional RebootGE863-QUAD 1Power Supply Requirements Power SupplyGE863-QUAD/PY power requirements are Electrical design Guidelines 2General Design RulesAn example of linear regulator with 5V input is 1.2 + 12V input Source Power Supply Design GuidelinesAn example of switching regulator with 12V input is Battery Source Power Supply Design GuidelinesBattery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines GSM Antenna Requirements AntennaSerial Ports GSM Antenna installation GuidelinesGSM Antenna PCB line Guidelines Level Min Max Absolute Maximum Ratings -Not Functional Parameter Min MaxNumber Pad Number Signals in the Uart connector on the EVK are17-28-36 Ground 45-48-50-56 Clear to Send Output from the GE863-QUAD/PY that2MODEM Serial Port 2 Python Debug It is available on the following pins3RS232 level translation An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS Echo canceller type Handset Microphone Paths Characteristic and RequirementsEcho canceller type Car kit hands-free + 20dBYou can set GA= +20dB to use standard resistor values That meansTIP environment consideration Other considerations General Design RulesBalanced Microphone Biasing Microphone BiasingUnbalanced Microphone Biasing GE863-QUAD Buffered Balanced Mic Microphone BufferingSample circuit can be Buffer gain is given by the formula Gain = RR604605 = RR607606Buffered Unbalanced Single Ended Microphone Buffer bandwidth at -3dB shall be 4KHz Freq . = 2π * R719* C726 2π * R711* C727GE863-QUAD Short description Output Lines SpeakerSW volume level step Number of SW volume steps Output Lines CharacteristicsNoise Filtering Handset Earphone Design An example of internal Ear amplifier could be Hands-Free Earphone Low Power DesignCar Kit Speakerphone Design Short Description Evaluation Kit for Telit Modules EVK2@ 350mW 2 EVK2 Audio Lines CharacteristicsESD Data IntegritySIM Supply SchematicLayout Using a Gpio Pad as Output Using a Gpio Pad as InputGeneral Purpose I/O Using the Buzzer Output GPIO7 10.3Using the Alarm Output GPIO611.1DAC Converter DAC and ADC sectionDescription Min Max UnitsCommand is AT#DAC=enable,value An AT command is available to use the DAC functionEnabling DAC Low Pass Filter ExampleInput Voltage range AD conversion Bits Resolution Using ADC Converter11.2ADC Converter 12.1Transchip Camera CameraType Sensitivity LuxCamera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Example usage script for camera Camera setting shown here are the defaults onesTaking an reading a photo Mounting the GE863-QUAD / PY on the Application Board 13.2Module Finishing & Dimensions13.1General Lead-free Alloy Surface finishing Ni/Au for all test padsRecommended foot print for the application Stencil Debug of the GE863 in ProductionPCB pad Design Solder paste Following is the recommended solder reflow profile 13.2.6 GE863-QUAD / PY Solder ReflowGE863-QUAD Section A-A Packing SystemModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Revision Date Changes Document Change Log21/02/06 19/09/06