Telit Wireless Solutions GE863-QUAD, GE863-PY manual Solder paste

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GE863-QUAD

GE863-PY

1vv0300715 Rev. 1 - 19/09/06

Recommendations for PCB pad dimensions

	Ball pitch [mm]		2
	Solder resist opening diameter A [mm]		1,150
	Metal pad diameter B [mm]		1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish	Layer thickness [µm]	Properties
Electro-less Ni /	3 –7 /	good solder ability protection, high
Immersion Au	0.05 – 0.15	shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

13.2.5Solder paste

	Lead free

Solder paste	Sn/Ag/Cu

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Contents GE863-QUAD GE863-PY Hardware User Guide Contents 10.4 10.110.2 10.313.2 12.113.1 This document is relating to the following products Overview PIN-OUT GE863 module connectionsPin Signal Function Internal Type Pull up Pin Signal Function Internal Type Pins Layout Turning on the GE863-QUAD/PY Hardware CommandsTurning off of the device can be done in two ways Turning OFF the GE863-QUAD/PYHardware shutdown Hardware Unconditional RebootGE863-QUAD GE863-QUAD/PY power requirements are Power Supply1Power Supply Requirements Electrical design Guidelines 2General Design RulesAn example of linear regulator with 5V input is 1.2 + 12V input Source Power Supply Design GuidelinesAn example of switching regulator with 12V input is Battery Source Power Supply Design GuidelinesBattery Charge control Circuitry Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines GSM Antenna Requirements AntennaGSM Antenna PCB line Guidelines GSM Antenna installation GuidelinesSerial Ports Level Min Max Absolute Maximum Ratings -Not Functional Parameter Min MaxClear to Send Output from the GE863-QUAD/PY that Signals in the Uart connector on the EVK areNumber Pad Number 17-28-36 Ground 45-48-50-563RS232 level translation It is available on the following pins2MODEM Serial Port 2 Python Debug An example of level translation circuitry of this kind is 5V Uart level translation GE863-QUAD Audio Section Overview GM863-GPS + 20dB Microphone Paths Characteristic and RequirementsEcho canceller type Handset Echo canceller type Car kit hands-freeYou can set GA= +20dB to use standard resistor values That meansTIP environment consideration Other considerations General Design RulesBalanced Microphone Biasing Microphone BiasingUnbalanced Microphone Biasing GE863-QUAD Sample circuit can be Microphone BufferingBuffered Balanced Mic Buffer gain is given by the formula Gain = RR604605 = RR607606Buffered Unbalanced Single Ended Microphone Buffer bandwidth at -3dB shall be 4KHz Freq . = 2π * R719* C726 2π * R711* C727GE863-QUAD Short description Output Lines SpeakerSW volume level step Number of SW volume steps Output Lines CharacteristicsNoise Filtering Handset Earphone Design An example of internal Ear amplifier could be Hands-Free Earphone Low Power DesignCar Kit Speakerphone Design Short Description Evaluation Kit for Telit Modules EVK2@ 350mW 2 EVK2 Audio Lines CharacteristicsESD Data IntegritySIM Supply SchematicLayout General Purpose I/O Using a Gpio Pad as InputUsing a Gpio Pad as Output Using the Buzzer Output GPIO7 10.3Using the Alarm Output GPIO6Min Max Units DAC and ADC section11.1DAC Converter DescriptionLow Pass Filter Example An AT command is available to use the DAC functionCommand is AT#DAC=enable,value Enabling DAC11.2ADC Converter Using ADC ConverterInput Voltage range AD conversion Bits Resolution Sensitivity Lux Camera12.1Transchip Camera TypeCamera Interface Connectors Camera Physical Detail & Connector Camera Socket Connector Camera Board Module Main Block Diagram for supported cameras Schematic Diagrams for supported camera Taking an reading a photo Camera setting shown here are the defaults onesExample usage script for camera 13.1General 13.2Module Finishing & DimensionsMounting the GE863-QUAD / PY on the Application Board Lead-free Alloy Surface finishing Ni/Au for all test padsRecommended foot print for the application PCB pad Design Debug of the GE863 in ProductionStencil Solder paste Following is the recommended solder reflow profile 13.2.6 GE863-QUAD / PY Solder ReflowGE863-QUAD Section A-A Packing SystemModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations 19/09/06 Document Change LogRevision Date Changes 21/02/06