Samsung M471B1G73AH0 specifications Min Max

Page 28

Unbuffered SODIMM

datasheet

Rev. 1.0

DDR3 SDRAM

[ Table 17 ] Timing Parameters by Speed Bin (Cont.)

 

 

Speed

 

DDR3-800

DDR3-1066

DDR3-1333

DDR3-1600

Units

NOTE

 

 

Parameter

Symbol

MIN

MAX

MIN

MAX

MIN

MAX

MIN

MAX

 

 

 

 

Power Down Timing

 

 

 

 

 

 

 

 

 

 

 

Exit Power Down with DLL on to any valid com-

 

max

 

max

 

max

 

max

 

 

 

mand;Exit Precharge Power Down with DLL

tXP

(3nCK,

-

(3nCK,

-

-

-

 

 

(3nCK,6ns)

(3nCK,6ns)

 

 

frozen to commands not requiring a locked DLL

 

7.5ns)

 

7.5ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Exit Precharge Power Down with DLL frozen to com-

 

max

 

max

 

max

 

max

 

 

 

tXPDLL

(10nCK,

-

(10nCK,

-

(10nCK,

-

(10nCK,

-

 

2

mands requiring a locked DLL

 

 

24ns)

 

24ns)

 

24ns)

 

24ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CKE minimum pulse width

tCKE

max

-

max

-

max

-

max

-

 

 

(3nCK,

(3nCK,

(3nCK,

 

 

(3nCK,5ns)

 

 

 

 

 

 

 

 

 

 

7.5ns)

 

5.625ns)

 

5.625ns)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Command pass disable delay

tCPDED

1

-

1

-

1

-

1

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

Power Down Entry to Exit Timing

tPD

tCKE(min)

9*tREFI

tCKE(min)

9*tREFI

tCKE(min)

9*tREFI

tCKE(min)

9*tREFI

tCK

15

 

 

 

 

 

 

 

 

 

 

 

 

Timing of ACT command to Power Down entry

tACTPDEN

1

-

1

-

1

-

1

-

nCK

20

 

 

 

 

 

 

 

 

 

 

 

 

Timing of PRE command to Power Down entry

tPRPDEN

1

-

1

-

1

-

1

-

nCK

20

 

 

 

 

 

 

 

 

 

 

 

 

Timing of RD/RDA command to Power Down entry

tRDPDEN

RL + 4 +1

-

RL + 4 +1

-

RL + 4 +1

-

RL + 4 +1

-

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timing of WR command to Power Down entry

 

WL + 4

 

WL + 4

 

WL + 4

 

WL + 4

 

 

 

tWRPDEN

+(tWR/

-

+(tWR/

-

+(tWR/

-

+(tWR/

-

nCK

9

(BL8OTF, BL8MRS, BC4OTF)

 

tCK(avg))

 

tCK(avg))

 

tCK(avg))

 

tCK(avg))

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timing of WRA command to Power Down entry

tWRAPDEN

WL + 4

-

WL + 4

-

WL + 4 +WR

-

WL + 4 +WR

-

nCK

10

(BL8OTF, BL8MRS, BC4OTF)

+WR +1

+WR +1

+1

+1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timing of WR command to Power Down entry

 

WL + 2

 

WL + 2

 

WL + 2

 

WL + 2

 

 

 

tWRPDEN

+(tWR/

-

+(tWR/

-

+(tWR/

-

+(tWR/

-

nCK

9

(BC4MRS)

 

tCK(avg))

 

tCK(avg))

 

tCK(avg))

 

tCK(avg))

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timing of WRA command to Power Down entry

tWRAPDEN

WL +2 +WR

-

WL +2 +WR

-

WL +2 +WR

-

WL +2 +WR

-

nCK

10

(BC4MRS)

+1

+1

+1

+1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Timing of REF command to Power Down entry

tREFPDEN

1

-

1

-

1

-

1

-

 

20,21

 

 

 

 

 

 

 

 

 

 

 

 

Timing of MRS command to Power Down entry

tMRSPDEN

tMOD(min)

-

tMOD(min)

-

tMOD(min)

-

tMOD(min)

-

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ODT Timing

 

 

 

 

 

 

 

 

 

 

 

ODT high time without write command or with write

ODTH4

4

-

4

-

4

-

4

-

nCK

 

command and BC4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ODT high time with Write command and BL8

ODTH8

6

-

6

-

6

-

6

-

nCK

 

 

 

 

 

 

 

 

 

 

 

 

 

Asynchronous RTT turn-on delay (Power-Down with

tAONPD

2

8.5

2

8.5

2

8.5

2

8.5

ns

 

DLL frozen)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Asynchronous RTT turn-off delay (Power-Down with

tAOFPD

2

8.5

2

8.5

2

8.5

2

8.5

ns

 

DLL frozen)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RTT turn-on

tAON

-400

400

-300

300

-250

250

-225

225

ps

7,f

 

 

 

 

 

 

 

 

 

 

 

 

RTT_NOM and RTT_WR turn-off time from ODTLoff

tAOF

0.3

0.7

0.3

0.7

0.3

0.7

0.3

0.7

tCK(avg

8,f

reference

)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RTT dynamic change skew

tADC

0.3

0.7

0.3

0.7

0.3

0.7

0.3

0.7

tCK(avg

f

)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Write Leveling Timing

 

 

 

 

 

 

 

 

 

 

 

First DQS pulse rising edge after tDQSS margining

tWLMRD

40

-

40

-

40

-

40

-

tCK

3

mode is programmed

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DQS/DQS delay after tDQS margining mode is pro-

tWLDQSEN

25

-

25

-

25

-

25

-

tCK

3

grammed

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Write leveling setup time from rising CK,

 

 

crossing to

 

 

 

 

 

 

 

 

 

 

 

CK

tWLS

325

-

245

-

195

-

165

-

ps

 

rising DQS, DQS crossing

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Write leveling hold time from rising DQS,

 

 

crossing

 

 

 

 

 

 

 

 

 

 

 

DQS

tWLH

325

-

245

-

195

-

165

-

ps

 

 

 

 

 

 

 

 

 

to rising CK, CK crossing

 

 

 

 

 

 

 

 

 

 

 

 

Write leveling output delay

tWLO

0

9

0

9

0

9

0

7.5

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

Write leveling output error

tWLOE

0

2

0

2

0

2

0

2

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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Image 28
Contents Datasheet History RevFirst Release Jul Kim Table Of Contents Address Configuration Key FeaturesDDR3 Unbuffered Sodimm Ordering Information X64 Dimm Pin Configurations Front side/Back Side Pin Front BackPin Description Pin Name Description NumberSymbol Type Function Input/Output Functional DescriptionFunction Block Diagram 8GB, 1Gx64 Module Populated as 2 ranks of x8 DDR3 SDRAMsDram Component Operating Temperature Range Absolute Maximum RatingsAC & DC Operating Conditions Absolute Maximum DC Ratings10.1 AC & DC Logic Input Levels for Single-ended Signals AC & DC Input Measurement LevelsVref Tolerances Illustration of Vrefdc tolerance and Vref ac-noise limitsAC and DC Logic Input Levels for Differential Signals Differential Signals DefinitionSymbol Parameter DDR3-800/1066/1333/1600 Unit +0.2Single-ended Requirements for Differential Signals TimeSlew Rate Definition for Single Ended Input Signals Slew rate definition for Differential Input SignalsDifferential Input Cross Point Voltage Parameter DDR3-800/1066/1333/1600 Unit Min MaxAC & DC Output Measurement Levels Single Ended AC and DC Output LevelsDifferential AC and DC Output Levels Single-ended Output Slew RateDifferential Output Slew Rate Differential output slew rate for rising edgeDelta TRdiff Differential output slew rate for falling edge Delta TFdiffDimm IDD specification definition Symbol DescriptionDatasheet IDD Spec Table M471B1G73AH0 8GB 1Gx64 ModuleInput/Output Capacitance 14.1 2Rx8 2GB SodimmM471B1G73AH0 Parameter DDR3-1066 DDR3-1333Electrical Characteristics and AC timing Refresh Parameters by Device DensityDDR3-1066 Speed Bins CL-nRCD-nRP DDR3-1333 Speed Bins DDR3-1333 CL-nRCD-nRPDDR3-1600 Speed Bins CL-nRCD-nRP Absolute Specification Toper Vddq = VDD = 1.5V +/- 0.075 Speed Bin Table NotesTiming Parameters by Speed Grade Timing Parameters by Speed BinReset Timing MIN MAX Jitter Notes ZQCorrection TSens x Tdriftrate + VSens x Vdriftrate Timing Parameter NotesX 1 + 0.15 x 15 = 0.133 ~~ 128ms Physical Dimensions 17.1 512Mx8 based 1Gx64 Module 2 Ranks M471B1G73AH0

M471B1G73AH0 specifications

The Samsung M471B1G73AH0 is a high-performance DDR4 SO-DIMM memory module designed for laptops and compact systems. This specific RAM chip showcases a balance of speed, efficiency, and reliability, making it an ideal choice for both everyday users and professionals seeking enhanced system performance.

One of the main features of the M471B1G73AH0 is its capacity. With 8GB of memory, it provides ample space for multitasking, allowing users to run multiple applications simultaneously without experiencing slowdowns. This is particularly beneficial for users who require a robust performance for tasks such as video editing, gaming, or running virtual machines.

The module operates at a frequency of 2400 MHz, tapping into the capabilities of DDR4 technology. This frequency ensures that data can be transferred quickly, enhancing overall system responsiveness. The DDR4 specification also brings improvements in power efficiency compared to its predecessor, DDR3, resulting in lower energy consumption and prolonged battery life in portable devices.

Another notable aspect of the M471B1G73AH0 is its latency. With a CAS latency of CL17, this module strikes a good balance between speed and response time, ensuring that data retrieval and execution are efficient, which is crucial for both applications and system processes.

Samsung’s advanced manufacturing technology is evident in this module, which employs 20nm process technology to produce high-density chips. This not only contributes to lower power consumption but also results in a smaller physical footprint, allowing for increased memory density in compact devices.

In terms of compatibility, the M471B1G73AH0 is designed to support a wide range of platforms. It adheres to the standard SO-DIMM form factor, making it compatible with most laptops and all-in-one systems. This versatility allows users to easily upgrade their existing systems for enhanced performance.

Additionally, the module includes features such as ECC (Error-Correcting Code) capabilities for certain variants, which helps in identifying and correcting memory errors, thereby increasing system reliability—an essential aspect for critical applications.

In conclusion, the Samsung M471B1G73AH0 is a robust DDR4 memory solution that delivers solid performance and reliability. With its 8GB capacity, 2400 MHz frequency, and energy-efficient design, it is suitable for a wide range of computing needs, making it a popular choice among users looking to upgrade their systems for improved efficiency and responsiveness.