Sony MDS-JE530 service manual Specifications, Service Manual, Mini Disc Deck, E Model, Outputs

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MDS-JE530

MDS-JE530

SERVICE MANUAL

US Model

Canadian Model

AEP Model

UK Model

E Model

Photo: Black model

U.S. and foreign patents licensed form Dolby Laboratories Licensing Corporation.

Model Name Using Similar Mechanism	MDS-JE520

MD Mechanism Type	MDM-5D

Optical Pick-up Type	KMS-260B/J1N

SPECIFICATIONS

System	MiniDisc digital audio system	Outputs
Disc	MiniDisc	PHONES	Jack type: stereo phone
Laser	Semiconductor laser (λ = 780 nm)		Rated output: 28 mW
	Emission duration: continuous		Load impedance: 32 ohms
Laser output	Less than 44.6 µW*	LINE (ANALOG) OUT	Jack type: phono
	* This output is the value measured		Rated output: 2 Vrms (at 50 kilohms)
	at a distance of 200 mm from the		Load impedance: Over 10 kilohms
	objective lens surface on the Optical	DIGITAL OPTICAL OUT Connector type: square optical
	Pick-up Block with 7 mm aperture.		Rated output: –18 dBm
Laser diode	Material: GaAlAs		Load impedance: 660 nm (optical
Revolutions (CLV)	400 rpm to 900 rpm		wave length)
Error correction	Advanced Cross Interleave Reed
	Solomon Code (ACIRC)	General
Sampling frequency	44.1 kHz	Power requirements
Coding	Adaptive Transform Acoustic Coding	North American model:	120 V AC, 60 Hz
	(ATRAC)	European model:	230 V AC, 50/60 Hz
Modulation system	EFM (Eight-to-Fourteen Modulation)	Other models:	110 – 120 V or 220 – 240 V AC, 50/60 Hz
Number of channels	2 stereo channels		Adjustable with voltage selector
Frequency response	5 to 20,000 Hz ±0.3 dB	Power consumption	16 W
Signal-to-noise ratio	Over 98 dB during playback	Dimension (approx.)	430 × 95 × 280 mm (w/h/d) incl.
Wow and flutter	Below measurable limit		projecting parts and controls
		Mass (approx.)	3.4 kg
Input
LINE (ANALOG) IN	Jack type: phono	Supplied accessories
	Impedance: 47 kilohms	• Audio connecting cords (2)
	Rated input: 500 mVrms	• Optical cable (1)
	Minimum input: 125 mVrms	• Remote commander (remote) RM-D29M (1)
DIGITAL OPTICAL IN	Connector type: square optical	• R6 (size-AA) batteries (2)
	Impedance: 600 nm (optical wave length)
DIGITAL COAXIAL IN	Jack type: phono
	Impedance: 75 ohms
	Rated input: 0.5 Vp-p, ±20%

MINI DISC DECK

MICROFILM

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Contents SERVICE MANUAL SPECIFICATIONSSupplied accessories MDS-JE530– 2 – SELF-DIAGNOSISFUNCTIONTable of Error Codes Items of Error History Mode Items and Contents– 3 – Selecting the Test Mode6.DIAGRAMS TABLE OF CONTENTSDISASSEMBLY ELECTRICAL ADJUSTMENTSNotes on chip component replacement Flexible Circuit Board Repairing– 5 – ADVARSELJIG FOR CHECKING BD BOARD WAVEFORM – 6 –Record Precedure – 7 –Display Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSRETRY CAUSE DISPLAY MODE – 9 –Precedure Fig. 1 Reading the Test Mode DisplayHexadecimal nBinary Conversion Table – 10 –Reading the Display – 11 – SECTION GENERALLOCATION OF CONTROLS This section is extracted from instruction manualPage – 13 – SECTION DISASSEMBLYCASE FRONT PANEL SECTIONMAIN BOARD – 14 –MECHANISM DECK SECTTION MDM-5D SLIDER CAM – 15 –BASE UNIT MBU-5D,BD BOARD SW BOARD, LOADING MOTOR M103 – 16 –2. SETTING THE TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODESECTION TEST MODE – 17 –5. SELECTING THE TEST MODE – 18 –5-1.Operating the Continuous Playback Mode – 19 –5-3. Non-VolatileMemory Mode EEP MODE 6. FUNCTIONS OF OTHER BUTTONS – 20 –7. TEST MODE DISPLAYS MEANINGS OF OTHER DISPLAYS – 21 –1.PARTS REPLACEMENT AND ADJUSTMENT SECTION ELECTRICAL ADJUSTMENTS– 22 – 4. PRECAUTIONS FOR ADJUSTMENTS 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSIONLaser power meter – 23 –6-2.Laser Power Check Checking ProcedureSpecification – 24 –CD Error Rate Check 6-5.C PLAY Checking MO Error Rate Check– 25 – 6-4.Focus Bias Check9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE10. LASER POWER ADJUSTMENT Setting Procedure– 27 – 11. TRAVERSE ADJUSTMENTSpecification Adjusting Procedure– 28 – 12.FOCUS BIAS ADJUSTMENTAdjusting Procedure 15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13.ERROR RATE CHECK13-1.CD Error Rate Check 13-2.MO Error Rate Check– 30 – Adjustment Location– BD BOARDSide A – – BD BOARDSide B –6-1.BLOCK DIAGRAM – MD SERVO Section – MDS-JE530 SECTION DIAGRAMS– 31 – – 32 –MDS-JE530 6-2.BLOCK DIAGRAM – MAIN Section –– 33 – – 34 –Note on Printed Wiring Board – 35 –Note on Schematic Diagram • Circuit Boards Location – 36 –– 38 – 6-4.PRINTED WIRING BOARD – BD Board –•See page 36 for Circuit Boards Location •Semiconductor Location– 40 – – 39 –MDS-JE530 – 41 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 42 – MDS-JE5306-8.PRINTED WIRING BOARD – SW Board – 6-7.SCHEMATIC DIAGRAM – SW Board –– 43 – – 44 –– 45 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 46 – page 36 for Circuit Boards Location– 48 – – 47 –MDS-JE530 Page Page 41 Page– 50 – – 49 –MDS-JE530 – 52 – – 51 –MDS-JE530 • Semiconductor Location– 54 – – 53 –MDS-JE530 Page 47 Page– 55 – •IC Block Diagrams – BD Board –– 56 – IC101IC310 – 57 –M5293L IC4316-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – – 65 – SECTION EXPLODED VIEWS1CHASSIS SECTION 66 61 61 2FRONT PANEL SECTION 61 64 61 63 6151 53 59 54 523MECHANISM SECTION MDM-5D 213 207 – 67 –202 201 223 2074BASE UNIT SECTION MBU-5D 252 – 68 –263 270 254 253– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAY– 71 – KEY SWDISPLAY – 72 – MAINKEY SW MAIN – 73 –MAIN – 74 –– 75 – POWER SWMAIN – 76 – MDS-JE530Sony Corporation 9-928-824-11

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