Sony MDS-JE530 service manual 41, 42, SCHEMATIC DIAGRAM – BD Board 2/2 – See•

Page 37
6-6. SCHEMATIC DIAGRAM – BD Board (2/2) – See•

MDS-JE530

6-6. SCHEMATIC DIAGRAM – BD Board (2/2) – See

page 43 for Waveforms. See page 55 for IC Block Diagrams.

 

 

 

 

(Page 39)

(Page 39)

(Page 39)

(Page 40)

(Page 40)

(Page 40)

(Page 40)

(Page 48)

(Page 47)

Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : STOP

( ) : PLAY

<> : REC

: Impossible to measure

The components identified by mark !or dotted line with mark !are critical for safety.

Replace only with part number specified.

Les composants identifiés par une marque !sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

– 41 –

– 42 –

Image 37
Contents SERVICE MANUAL SPECIFICATIONSSupplied accessories MDS-JE530– 2 – SELF-DIAGNOSISFUNCTIONTable of Error Codes Items of Error History Mode Items and Contents– 3 – Selecting the Test Mode6.DIAGRAMS TABLE OF CONTENTSDISASSEMBLY ELECTRICAL ADJUSTMENTSNotes on chip component replacement Flexible Circuit Board Repairing– 5 – ADVARSELJIG FOR CHECKING BD BOARD WAVEFORM – 6 –Record Precedure – 7 –Display Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSRETRY CAUSE DISPLAY MODE – 9 –Precedure Fig. 1 Reading the Test Mode DisplayHexadecimal nBinary Conversion Table – 10 –Reading the Display – 11 – SECTION GENERALLOCATION OF CONTROLS This section is extracted from instruction manualPage – 13 – SECTION DISASSEMBLYCASE FRONT PANEL SECTIONMAIN BOARD – 14 –MECHANISM DECK SECTTION MDM-5D SLIDER CAM – 15 –BASE UNIT MBU-5D,BD BOARD SW BOARD, LOADING MOTOR M103 – 16 –2. SETTING THE TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODESECTION TEST MODE – 17 –5. SELECTING THE TEST MODE – 18 –5-1.Operating the Continuous Playback Mode – 19 –5-3. Non-VolatileMemory Mode EEP MODE 6. FUNCTIONS OF OTHER BUTTONS – 20 –7. TEST MODE DISPLAYS MEANINGS OF OTHER DISPLAYS – 21 –1.PARTS REPLACEMENT AND ADJUSTMENT SECTION ELECTRICAL ADJUSTMENTS– 22 – 4. PRECAUTIONS FOR ADJUSTMENTS 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSIONLaser power meter – 23 –6-2.Laser Power Check Checking ProcedureSpecification – 24 –CD Error Rate Check 6-5.C PLAY Checking MO Error Rate Check– 25 – 6-4.Focus Bias Check9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE10. LASER POWER ADJUSTMENT Setting Procedure– 27 – 11. TRAVERSE ADJUSTMENTSpecification Adjusting Procedure– 28 – 12.FOCUS BIAS ADJUSTMENTAdjusting Procedure 15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13.ERROR RATE CHECK13-1.CD Error Rate Check 13-2.MO Error Rate Check– 30 – Adjustment Location– BD BOARDSide A – – BD BOARDSide B –6-1.BLOCK DIAGRAM – MD SERVO Section – MDS-JE530 SECTION DIAGRAMS– 31 – – 32 –MDS-JE530 6-2.BLOCK DIAGRAM – MAIN Section –– 33 – – 34 –Note on Printed Wiring Board – 35 –Note on Schematic Diagram • Circuit Boards Location – 36 –– 38 – 6-4.PRINTED WIRING BOARD – BD Board –•See page 36 for Circuit Boards Location •Semiconductor Location– 40 – – 39 –MDS-JE530 – 41 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 42 – MDS-JE5306-8.PRINTED WIRING BOARD – SW Board – 6-7.SCHEMATIC DIAGRAM – SW Board –– 43 – – 44 –– 45 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 46 – page 36 for Circuit Boards Location– 48 – – 47 –MDS-JE530 Page Page 41 Page– 50 – – 49 –MDS-JE530 – 52 – – 51 –MDS-JE530 • Semiconductor Location– 54 – – 53 –MDS-JE530 Page 47 Page– 55 – •IC Block Diagrams – BD Board –– 56 – IC101IC310 – 57 –M5293L IC4316-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – – 65 – SECTION EXPLODED VIEWS1CHASSIS SECTION 66 61 61 2FRONT PANEL SECTION 61 64 61 63 6151 53 59 54 523MECHANISM SECTION MDM-5D 213 207 – 67 –202 201 223 2074BASE UNIT SECTION MBU-5D 252 – 68 –263 270 254 253– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAY– 71 – KEY SWDISPLAY – 72 – MAINKEY SW MAIN – 73 –MAIN – 74 –– 75 – POWER SWMAIN – 76 – MDS-JE530Sony Corporation 9-928-824-11
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