Sony MDS-JE530 23, Precautions For Checking Laser Diode Emission, Precautions For Adjustments

Page 23
2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION

2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before con- necting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

 

laser tap

Optical pick-up flexible board

4. PRECAUTIONS FOR ADJUSTMENTS

1.When replacing the following parts, perform the adjustments and checks with Âin the order shown in the following table.

 

Optical

 

 

 

BD Board

 

 

Pick-up

IC171

D101

 

IC101, IC121

IC192

 

 

 

 

 

 

 

 

1. Initial setting of

Â

 

Â

G

 

Â

G

adjustment value

 

 

 

 

 

 

 

 

 

 

2. Recording of IOP

 

 

 

 

 

 

 

information

Â

 

Â

G

 

G

G

(Value written in

 

 

the pick-up)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Temperature

 

 

 

 

 

 

 

compensation

G

Â

Â

 

G

G

offset adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4. Laser power

Â

 

Â

G

 

Â

Â

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5. Traverse

Â

 

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6. Focus bias

Â

 

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7. Error rate check

Â

 

Â

G

 

Â

G

 

 

 

 

 

 

 

 

8. Auto gain output

Â

 

Â

G

 

Â

G

level adjustment

 

 

 

 

 

 

 

2.Set the test mode when performing adjustments. After completing the adjustments, exit the test mode. Perform the adjustments and checks in “group S” of the test mode.

3.Perform the adjustments to be needed in the order shown.

4.Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1

(Parts No. 4-963-646-01)

•TEST DISK (MDW-74/AU-1) (Parts No. 8-892-341-41)

•Laser power meter LPM-8001 (Parts No. J-2501-046-A) or MD Laser power meter 8010S (Parts No. J-2501-145-A)

•Oscilloscope (Measure after performing CAL of prove)

•Digital voltmeter

•Thermometer

•Jig for checking BD board waveform

(Parts No. : J-2501-149-A)

5.When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscil- loscope.

(VC and ground will become short-circuited)

6.Using the above jig enables the waveform to be checked with- out the need to solder.

(Refer to Servicing Notes on page 6)

7.As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Laser power meter

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (J-2501- 145-A) instead of the conventional laser power meter is conve- nient.

It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of the pick-up.

5.CREATING CONTINUOUSLY-RECORDED DISC

* This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc.

1.Insert a disc (blank disc) commercially available.

2.Turn the [ÊÊÊÊÊÊÊÊAMSÊÊÊÊÊÊÊÊ]- ± knob and display “CREC MODE”. (C31)

3.Press the [YES] button again to display “CREC MID”. Display “CREC (0300)” and start to recording.

4.Complete recording within 5 minutes.

5.Press the [MENU/NO] button and stop recording .

6.Press the [ÊÊÊÊÊEJECT]¤ button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note :

• Be careful not to apply vibration during continuous recording.

– 23 –

Page 22 Page 24
Image 23
Page 22 Page 24
Contents MDS-JE530 SPECIFICATIONSSERVICE MANUAL Supplied accessories– 2 – SELF-DIAGNOSISFUNCTIONSelecting the Test Mode Items of Error History Mode Items and ContentsTable of Error Codes – 3 –ELECTRICAL ADJUSTMENTS TABLE OF CONTENTS6.DIAGRAMS DISASSEMBLYADVARSEL Flexible Circuit Board RepairingNotes on chip component replacement – 5 –JIG FOR CHECKING BD BOARD WAVEFORM – 6 –Display Precedure – 7 –Record Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSFig. 1 Reading the Test Mode Display – 9 –RETRY CAUSE DISPLAY MODE PrecedureReading the Display – 10 –Hexadecimal nBinary Conversion Table This section is extracted from instruction manual SECTION GENERAL– 11 – LOCATION OF CONTROLSPage FRONT PANEL SECTION SECTION DISASSEMBLY– 13 – CASEMECHANISM DECK SECTTION MDM-5D – 14 –MAIN BOARD BASE UNIT MBU-5D,BD BOARD – 15 –SLIDER CAM SW BOARD, LOADING MOTOR M103 – 16 –– 17 – 1. PRECAUTIONS FOR USE OF TEST MODE2. SETTING THE TEST MODE SECTION TEST MODE5. SELECTING THE TEST MODE – 18 –5-3. Non-VolatileMemory Mode EEP MODE – 19 –5-1.Operating the Continuous Playback Mode 7. TEST MODE DISPLAYS – 20 –6. FUNCTIONS OF OTHER BUTTONS MEANINGS OF OTHER DISPLAYS – 21 –– 22 – SECTION ELECTRICAL ADJUSTMENTS1.PARTS REPLACEMENT AND ADJUSTMENT – 23 – 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION4. PRECAUTIONS FOR ADJUSTMENTS Laser power meter– 24 – Checking Procedure6-2.Laser Power Check Specification6-4.Focus Bias Check 6-5.C PLAY Checking MO Error Rate CheckCD Error Rate Check – 25 –Setting Procedure 7. INITIAL SETTING OF ADJUSTMENT VALUE9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 10. LASER POWER ADJUSTMENTAdjusting Procedure 11. TRAVERSE ADJUSTMENT– 27 – SpecificationAdjusting Procedure 12.FOCUS BIAS ADJUSTMENT– 28 – 13-2.MO Error Rate Check 13.ERROR RATE CHECK15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13-1.CD Error Rate Check– BD BOARDSide B – Adjustment Location– 30 – – BD BOARDSide A –– 32 – MDS-JE530 SECTION DIAGRAMS6-1.BLOCK DIAGRAM – MD SERVO Section – – 31 –– 34 – 6-2.BLOCK DIAGRAM – MAIN Section –MDS-JE530 – 33 –Note on Schematic Diagram – 35 –Note on Printed Wiring Board • Circuit Boards Location – 36 –•Semiconductor Location 6-4.PRINTED WIRING BOARD – BD Board –– 38 – •See page 36 for Circuit Boards LocationMDS-JE530 – 39 –– 40 – MDS-JE530 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 41 – – 42 –– 44 – 6-7.SCHEMATIC DIAGRAM – SW Board –6-8.PRINTED WIRING BOARD – SW Board – – 43 –page 36 for Circuit Boards Location 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 45 – – 46 –Page Page 41 Page – 47 –– 48 – MDS-JE530MDS-JE530 – 49 –– 50 – • Semiconductor Location – 51 –– 52 – MDS-JE530Page 47 Page – 53 –– 54 – MDS-JE530IC101 •IC Block Diagrams – BD Board –– 55 – – 56 –IC431 – 57 –IC310 M5293L6-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – 1CHASSIS SECTION SECTION EXPLODED VIEWS– 65 – 59 54 52 2FRONT PANEL SECTION 61 64 61 63 6166 61 61 51 53223 207 – 67 –3MECHANISM SECTION MDM-5D 213 207 202 201254 253 – 68 –4BASE UNIT SECTION MBU-5D 252 263 270– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAYDISPLAY KEY SW– 71 – KEY SW MAIN– 72 – MAIN – 73 –MAIN – 74 –MAIN POWER SW– 75 – 9-928-824-11 MDS-JE530– 76 – Sony Corporation
Related manuals
Manual 160 pages 14.46 Kb
Top Page Image Contents