Sony MDS-JE530 service manual 35, Note on Printed Wiring Board, Note on Schematic Diagram

Page 33

Note on Printed Wiring Board:

6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

•p : parts mounted on the conductor side.

•¨ : Through hole.

•b : Pattern from the side which enables seeing.

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Side B)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Side A)	the parts face are indicated.

•Indication of transistor.

Q

B C E

These are omitted.

• Abbreviation

CND	: Canadian model
SP	: Singapore model

Note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•¢ : internal component.

•C : panel designation.

Note:	Note:
The components identi-	Les composants identifiés par
fied by mark !or dotted	une marque !sont critiques
line with mark !are criti-	pour la sécurité.
cal for safety.	Ne les remplacer que par une
Replace only with part	piéce portant le numéro
number specified.	spécifié.

•U : B+ Line.

•V : B– Line.

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PLAY (ANALOG OUT)

p : PLAY (DIGITAL OUT)

j : REC (ANALOG IN)

l : REC (DIGITAL IN)

•Abbreviation

CND : Canadian model

SP : Singapore model

– 35 –

Image 33

Contents SERVICE MANUAL SPECIFICATIONSSupplied accessories MDS-JE530– 2 – SELF-DIAGNOSISFUNCTIONTable of Error Codes Items of Error History Mode Items and Contents– 3 – Selecting the Test Mode6.DIAGRAMS TABLE OF CONTENTSDISASSEMBLY ELECTRICAL ADJUSTMENTSNotes on chip component replacement Flexible Circuit Board Repairing– 5 – ADVARSELJIG FOR CHECKING BD BOARD WAVEFORM – 6 –– 7 – Record PrecedureDisplay Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSRETRY CAUSE DISPLAY MODE – 9 –Precedure Fig. 1 Reading the Test Mode Display– 10 – Hexadecimal nBinary Conversion TableReading the Display – 11 – SECTION GENERALLOCATION OF CONTROLS This section is extracted from instruction manualPage – 13 – SECTION DISASSEMBLYCASE FRONT PANEL SECTION– 14 – MAIN BOARDMECHANISM DECK SECTTION MDM-5D – 15 – SLIDER CAMBASE UNIT MBU-5D,BD BOARD SW BOARD, LOADING MOTOR M103 – 16 –2. SETTING THE TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODESECTION TEST MODE – 17 –5. SELECTING THE TEST MODE – 18 –– 19 – 5-1.Operating the Continuous Playback Mode5-3. Non-VolatileMemory Mode EEP MODE – 20 – 6. FUNCTIONS OF OTHER BUTTONS7. TEST MODE DISPLAYS MEANINGS OF OTHER DISPLAYS – 21 –SECTION ELECTRICAL ADJUSTMENTS 1.PARTS REPLACEMENT AND ADJUSTMENT– 22 – 4. PRECAUTIONS FOR ADJUSTMENTS 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSIONLaser power meter – 23 –6-2.Laser Power Check Checking ProcedureSpecification – 24 –CD Error Rate Check 6-5.C PLAY Checking MO Error Rate Check– 25 – 6-4.Focus Bias Check9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE10. LASER POWER ADJUSTMENT Setting Procedure– 27 – 11. TRAVERSE ADJUSTMENTSpecification Adjusting Procedure12.FOCUS BIAS ADJUSTMENT – 28 –Adjusting Procedure 15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13.ERROR RATE CHECK13-1.CD Error Rate Check 13-2.MO Error Rate Check– 30 – Adjustment Location– BD BOARDSide A – – BD BOARDSide B –6-1.BLOCK DIAGRAM – MD SERVO Section – MDS-JE530 SECTION DIAGRAMS– 31 – – 32 –MDS-JE530 6-2.BLOCK DIAGRAM – MAIN Section –– 33 – – 34 –– 35 – Note on Printed Wiring BoardNote on Schematic Diagram • Circuit Boards Location – 36 –– 38 – 6-4.PRINTED WIRING BOARD – BD Board –•See page 36 for Circuit Boards Location •Semiconductor Location– 39 – – 40 –MDS-JE530 – 41 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 42 – MDS-JE5306-8.PRINTED WIRING BOARD – SW Board – 6-7.SCHEMATIC DIAGRAM – SW Board –– 43 – – 44 –– 45 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 46 – page 36 for Circuit Boards Location– 48 – – 47 –MDS-JE530 Page Page 41 Page– 49 – – 50 –MDS-JE530 – 52 – – 51 –MDS-JE530 • Semiconductor Location– 54 – – 53 –MDS-JE530 Page 47 Page– 55 – •IC Block Diagrams – BD Board –– 56 – IC101IC310 – 57 –M5293L IC4316-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – SECTION EXPLODED VIEWS – 65 –1CHASSIS SECTION 66 61 61 2FRONT PANEL SECTION 61 64 61 63 6151 53 59 54 523MECHANISM SECTION MDM-5D 213 207 – 67 –202 201 223 2074BASE UNIT SECTION MBU-5D 252 – 68 –263 270 254 253– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAYKEY SW – 71 –DISPLAY MAIN – 72 –KEY SW MAIN – 73 –MAIN – 74 –POWER SW – 75 –MAIN – 76 – MDS-JE530Sony Corporation 9-928-824-11

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