Sony MDS-JE530 service manual Section Electrical Parts List, 69

Page 57
SECTION 8

NOTE:

•Due to standardization, replacements in the parts list may be different from the parts speci- fied in the diagrams or the components used on the set.

•-XX and -X mean standardized parts, so they may have some difference from the original one.

•RESISTORS

All resistors are in ohms. METAL: Metal-film resistor.

METAL OXIDE: Metal oxide-film resistor.

F:nonflammable

•Abbreviation

AED : North European model

CND : Canadian model

SP : Singapore model

SECTION 8

ELECTRICAL PARTS LIST

•Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when order- ing these items.

•SEMICONDUCTORS

In each case, u: µ, for example:

uA. . : µA. . uPA. . : µPA. .

uPB. . : µPB. . uPC. . : µPC. .

uPD. . : µPD. .

•CAPACITORS uF: µF

•COILS

uH: µH

BD

The components identified by mark !or dotted line with mark

!are critical for safety.

Replace only with part number specified.

Les composants identifiés par une marque !sont critiquens pour la sécurité.

Ne les remplacer que par une pièce portant le numéro spécifié.

When indicating parts by reference number, please include the board.

Ref. No.

Part No.

Description

 

 

Remark

 

A-4724-637-A

BD BOARD, COMPLETE

 

 

 

 

*******************

 

 

 

 

< CAPACITOR >

 

 

 

C101

1-125-822-11

TANTALUM

10uF

20%

10V

C102

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C103

1-125-822-11

TANTALUM

10uF

20%

10V

C104

1-125-822-11

TANTALUM

10uF

20%

10V

C105

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C106

1-163-275-11

CERAMIC CHIP

0.001uF

5%

50V

C107

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C108

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C109

1-163-037-11

CERAMIC CHIP

0.022uF

10%

25V

C111

1-164-344-11

CERAMIC CHIP

0.068uF

10%

25V

C112

1-163-017-00

CERAMIC CHIP

0.0047uF

5%

50V

C113

1-109-982-11

CERAMIC CHIP

1uF

10%

10V

C115

1-164-489-11

CERAMIC CHIP

0.22uF

10%

16V

C116

1-163-037-11

CERAMIC CHIP

0.022uF

10%

25V

C117

1-163-809-11

CERAMIC CHIP

0.047uF

10%

25V

C118

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C119

1-125-822-11

TANTALUM

10uF

20%

10V

C121

1-125-822-11

TANTALUM

10uF

20%

10V

C122

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C123

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C124

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C127

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C128

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C129

1-107-823-11

CERAMIC CHIP

0.47uF

10%

16V

C130

1-163-251-11

CERAMIC CHIP

100PF

5%

50V

C131

1-163-023-00

CERAMIC CHIP

0.015uF

5%

50V

C132

1-107-823-11

CERAMIC CHIP

0.47uF

10%

16V

C133

1-163-017-00

CERAMIC CHIP

0.0047uF

5%

50V

C134

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C135

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C136

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C142

1-163-251-11

CERAMIC CHIP

100PF

5%

50V

C143

1-163-251-11

CERAMIC CHIP

100PF

5%

50V

C144

1-163-251-11

CERAMIC CHIP

100PF

5%

50V

C146

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C151

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C152

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C153

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C156

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C158

1-163-019-00

CERAMIC CHIP

0.0068uF

10%

50V

Ref. No.

Part No.

Description

 

 

Remark

C160

1-104-601-11

ELECT CHIP

10uF

20%

10V

C161

1-104-601-11

ELECT CHIP

10uF

20%

10V

C163

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C164

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C167

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C168

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C169

1-125-822-11

TANTALUM

10uF

20%

10V

C171

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C181

1-104-913-11

TANTALUM CHIP

10uF

20%

16V

C183

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C184

1-117-970-11

ELECT CHIP

22uF

20%

10V

C185

1-164-611-11

CERAMIC CHIP

0.001uF

10%

500V

C187

1-104-913-11

TANTALUM CHIP

10uF

20%

16V

C188

1-163-021-11

CERAMIC CHIP

0.01uF

10%

50V

C189

1-163-989-11

CERAMIC CHIP

0.033uF

10%

25V

C190

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C191

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C196

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C197

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

 

 

< CONNECTOR >

 

 

 

CN101

1-569-479-21

CONNECTOR, FPC 21P

 

 

CN102

1-784-833-21

CONNECTOR, FFC(LIF(NON-ZIF)) 21P

 

CN103

1-784-834-21

CONNECTOR, FFC(LIF(NON-ZIF)) 23P

 

CN104

1-770-687-11

CONNECTOR, FFC/FPC 4P

 

 

CN110

1-695-440-21 PIN, CONNECTOR (PC BOARD) 6P

 

 

 

< DIODE >

 

 

 

D101

8-719-988-61

DIODE

1SS355TE-17

 

 

D181

8-719-046-86

DIODE

F1J6TP

 

 

 

D183

8-719-046-86

DIODE

F1J6TP

 

 

 

 

 

< IC/TRANSISTOR >

 

 

IC101

8-752-080-95

IC

CXA2523AR

 

 

 

IC103

8-729-903-10

TRANSISTOR FMW1

 

 

IC121

8-752-390-16

IC

CXD2656R

 

 

 

IC123

8-759-096-87

IC

TC7WU04FU (TE12R)

 

 

IC124

8-759-334-38

IC MSM51V4400-70TS-K

 

 

IC152

8-759-430-25

IC

BH6511FS-E2

 

 

 

IC171

8-759-487-04

IC

BR24C02F-E2

 

 

 

IC181

8-759-481-17

IC

MC74ACT08DTR2

 

 

IC192

8-759-460-72

IC

BA033FP-E2

 

 

 

– 69 –

Page 56 Page 58
Image 57
Page 56 Page 58
Contents SERVICE MANUAL SPECIFICATIONSSupplied accessories MDS-JE530– 2 – SELF-DIAGNOSISFUNCTIONTable of Error Codes Items of Error History Mode Items and Contents– 3 – Selecting the Test Mode6.DIAGRAMS TABLE OF CONTENTSDISASSEMBLY ELECTRICAL ADJUSTMENTSNotes on chip component replacement Flexible Circuit Board Repairing– 5 – ADVARSELJIG FOR CHECKING BD BOARD WAVEFORM – 6 –– 7 – Record PrecedureDisplay Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSRETRY CAUSE DISPLAY MODE – 9 –Precedure Fig. 1 Reading the Test Mode Display– 10 – Hexadecimal nBinary Conversion TableReading the Display – 11 – SECTION GENERALLOCATION OF CONTROLS This section is extracted from instruction manualPage – 13 – SECTION DISASSEMBLYCASE FRONT PANEL SECTION– 14 – MAIN BOARDMECHANISM DECK SECTTION MDM-5D – 15 – SLIDER CAMBASE UNIT MBU-5D,BD BOARD SW BOARD, LOADING MOTOR M103 – 16 –2. SETTING THE TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODESECTION TEST MODE – 17 –5. SELECTING THE TEST MODE – 18 –– 19 – 5-1.Operating the Continuous Playback Mode5-3. Non-VolatileMemory Mode EEP MODE – 20 – 6. FUNCTIONS OF OTHER BUTTONS7. TEST MODE DISPLAYS MEANINGS OF OTHER DISPLAYS – 21 –SECTION ELECTRICAL ADJUSTMENTS 1.PARTS REPLACEMENT AND ADJUSTMENT– 22 – 4. PRECAUTIONS FOR ADJUSTMENTS 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSIONLaser power meter – 23 –6-2.Laser Power Check Checking ProcedureSpecification – 24 –CD Error Rate Check 6-5.C PLAY Checking MO Error Rate Check– 25 – 6-4.Focus Bias Check9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE10. LASER POWER ADJUSTMENT Setting Procedure– 27 – 11. TRAVERSE ADJUSTMENTSpecification Adjusting Procedure12.FOCUS BIAS ADJUSTMENT – 28 –Adjusting Procedure 15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13.ERROR RATE CHECK13-1.CD Error Rate Check 13-2.MO Error Rate Check– 30 – Adjustment Location– BD BOARDSide A – – BD BOARDSide B –6-1.BLOCK DIAGRAM – MD SERVO Section – MDS-JE530 SECTION DIAGRAMS– 31 – – 32 –MDS-JE530 6-2.BLOCK DIAGRAM – MAIN Section –– 33 – – 34 –– 35 – Note on Printed Wiring BoardNote on Schematic Diagram • Circuit Boards Location – 36 –– 38 – 6-4.PRINTED WIRING BOARD – BD Board –•See page 36 for Circuit Boards Location •Semiconductor Location– 39 – – 40 –MDS-JE530 – 41 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 42 – MDS-JE5306-8.PRINTED WIRING BOARD – SW Board – 6-7.SCHEMATIC DIAGRAM – SW Board –– 43 – – 44 –– 45 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 46 – page 36 for Circuit Boards Location– 48 – – 47 –MDS-JE530 Page Page 41 Page– 49 – – 50 –MDS-JE530 – 52 – – 51 –MDS-JE530 • Semiconductor Location– 54 – – 53 –MDS-JE530 Page 47 Page– 55 – •IC Block Diagrams – BD Board –– 56 – IC101IC310 – 57 –M5293L IC4316-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – SECTION EXPLODED VIEWS – 65 –1CHASSIS SECTION 66 61 61 2FRONT PANEL SECTION 61 64 61 63 6151 53 59 54 523MECHANISM SECTION MDM-5D 213 207 – 67 –202 201 223 2074BASE UNIT SECTION MBU-5D 252 – 68 –263 270 254 253– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAYKEY SW – 71 –DISPLAY MAIN – 72 –KEY SW MAIN – 73 –MAIN – 74 –POWER SW – 75 –MAIN – 76 – MDS-JE530Sony Corporation 9-928-824-11
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