Sony MDS-JE530 service manual Advarsel, Varning, Varoitus, Flexible Circuit Board Repairing

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ADVARSEL!

CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer.

Discard used batteries according to the manufacturer’s instruc- tions.

ADVARSEL!

Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Eksplosjonsfare ved feilaktig skifte av batteri.

Benytt samme batteritype eller en tilsvarende type

anbefalt av apparatfabrikanten.

Brukte batterier kasseres i henhold til fabrikantens

instruksjoner.

VARNING

Explosionsfara vid felaktigt batteribyte.

Använd samma batterityp eller en likvärdig typ som rekommenderas av apparattillverkaren.

Kassera använt batteri enligt gällande föreskrifter.

VAROITUS

Paristo voi räjähtää, jos se on virheellisesti asennettu.

Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

Laser component in this product is capable of emitting radia- tion exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !

SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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Contents SERVICE MANUAL SPECIFICATIONSSupplied accessories MDS-JE530– 2 – SELF-DIAGNOSISFUNCTIONTable of Error Codes Items of Error History Mode Items and Contents– 3 – Selecting the Test Mode6.DIAGRAMS TABLE OF CONTENTSDISASSEMBLY ELECTRICAL ADJUSTMENTSNotes on chip component replacement Flexible Circuit Board Repairing– 5 – ADVARSELJIG FOR CHECKING BD BOARD WAVEFORM – 6 –Display Precedure – 7 –Record Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTSRETRY CAUSE DISPLAY MODE – 9 –Precedure Fig. 1 Reading the Test Mode DisplayReading the Display – 10 –Hexadecimal nBinary Conversion Table – 11 – SECTION GENERALLOCATION OF CONTROLS This section is extracted from instruction manualPage – 13 – SECTION DISASSEMBLYCASE FRONT PANEL SECTIONMECHANISM DECK SECTTION MDM-5D – 14 –MAIN BOARD BASE UNIT MBU-5D,BD BOARD – 15 –SLIDER CAM SW BOARD, LOADING MOTOR M103 – 16 –2. SETTING THE TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODESECTION TEST MODE – 17 –5. SELECTING THE TEST MODE – 18 –5-3. Non-VolatileMemory Mode EEP MODE – 19 –5-1.Operating the Continuous Playback Mode 7. TEST MODE DISPLAYS – 20 –6. FUNCTIONS OF OTHER BUTTONS MEANINGS OF OTHER DISPLAYS – 21 –– 22 – SECTION ELECTRICAL ADJUSTMENTS1.PARTS REPLACEMENT AND ADJUSTMENT 4. PRECAUTIONS FOR ADJUSTMENTS 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSIONLaser power meter – 23 –6-2.Laser Power Check Checking ProcedureSpecification – 24 –CD Error Rate Check 6-5.C PLAY Checking MO Error Rate Check– 25 – 6-4.Focus Bias Check9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE10. LASER POWER ADJUSTMENT Setting Procedure– 27 – 11. TRAVERSE ADJUSTMENTSpecification Adjusting ProcedureAdjusting Procedure 12.FOCUS BIAS ADJUSTMENT– 28 – 15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13.ERROR RATE CHECK13-1.CD Error Rate Check 13-2.MO Error Rate Check– 30 – Adjustment Location– BD BOARDSide A – – BD BOARDSide B –6-1.BLOCK DIAGRAM – MD SERVO Section – MDS-JE530 SECTION DIAGRAMS– 31 – – 32 –MDS-JE530 6-2.BLOCK DIAGRAM – MAIN Section –– 33 – – 34 –Note on Schematic Diagram – 35 –Note on Printed Wiring Board • Circuit Boards Location – 36 –– 38 – 6-4.PRINTED WIRING BOARD – BD Board –•See page 36 for Circuit Boards Location •Semiconductor LocationMDS-JE530 – 39 –– 40 – – 41 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 42 – MDS-JE5306-8.PRINTED WIRING BOARD – SW Board – 6-7.SCHEMATIC DIAGRAM – SW Board –– 43 – – 44 –– 45 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 46 – page 36 for Circuit Boards Location– 48 – – 47 –MDS-JE530 Page Page 41 PageMDS-JE530 – 49 –– 50 – – 52 – – 51 –MDS-JE530 • Semiconductor Location– 54 – – 53 –MDS-JE530 Page 47 Page– 55 – •IC Block Diagrams – BD Board –– 56 – IC101IC310 – 57 –M5293L IC4316-14.IC PIN FUNCTION DESCRIPTION – 58 –•BD BOARD IC121 CXD2656R – 59 –– 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 –– 63 – – 64 – 1CHASSIS SECTION SECTION EXPLODED VIEWS– 65 – 66 61 61 2FRONT PANEL SECTION 61 64 61 63 6151 53 59 54 523MECHANISM SECTION MDM-5D 213 207 – 67 –202 201 223 2074BASE UNIT SECTION MBU-5D 252 – 68 –263 270 254 253– 69 – SECTION ELECTRICAL PARTS LIST– 70 – DISPLAYDISPLAY KEY SW– 71 – KEY SW MAIN– 72 – MAIN – 73 –MAIN – 74 –MAIN POWER SW– 75 – – 76 – MDS-JE530Sony Corporation 9-928-824-11
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