Sony MDS-JE530 service manual 58, Ic Pin Function Description

Page 46
6-14. IC PIN FUNCTION DESCRIPTION

6-14. IC PIN FUNCTION DESCRIPTION

•BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP)

Pin No.

Pin Name

I/O

 

Description

 

 

 

 

 

 

1

 

I

I

I-V converted RF signal I input from the optical pick-up block detector

 

 

 

 

 

 

2

 

J

I

I-V converted RF signal J input from the optical pick-up block detector

 

 

 

 

 

 

3

 

VC

O

Middle point voltage (+1.65V) generation output terminal

 

 

 

 

 

 

4 to 9

 

A to F

I

Signal input from the optical pick-up detector

 

 

 

 

 

 

10

 

PD

I

Light amount monitor input from the optical pick-up block laser diode

11

 

APC

O

Laser amplifier output terminal to the automatic power control circuit

12

 

APCREF

I

Reference voltage input terminal for setting laser power

13

 

GND

—

Ground terminal

 

 

 

 

 

 

 

14

 

TEMPI

I

Connected to the temperature sensor

 

 

 

 

 

 

15

 

TEMPR

O

Output terminal for a temperature sensor reference voltage

 

 

 

 

 

 

16

 

SWDT

I

Writing serial data input from the CXD2656R (IC121)

 

 

 

 

 

 

17

 

SCLK

I

Serial data transfer clock signal input from the CXD2656R (IC121)

 

 

 

 

 

 

18

 

XLAT

I

Serial data latch pulse signal input from the CXD2656R (IC121)

 

 

 

 

 

 

19

 

XSTBY

I

Standby signal input terminal “L”: standby (fixed at “H” in this set)

 

 

 

 

 

 

20

 

F0CNT

I

Center frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input

 

from the CXD2656R (IC121)

 

 

 

 

 

 

 

 

 

 

 

 

21

 

VREF

O

Reference voltage output terminal Not used (open)

 

 

 

 

 

22

 

EQADJ

I

Center frequency setting terminal for the internal circuit (EQ)

 

 

 

 

 

23

 

3TADJ

I

Center frequency setting terminal for the internal circuit (BPF3T)

24

 

VCC

—

Power supply terminal (+3.3V)

 

25

 

WBLADJ

I

Center frequency setting terminal for the internal circuit (BPF22)

 

 

 

 

 

26

 

TE

O

Tracking error signal output to the CXD2656R (IC121)

 

 

 

 

 

27

 

CSLED

I

Connected to the external capacitor for low-pass filter of the sled error signal

 

 

 

 

 

28

 

SE

O

Sled error signal output to the CXD2656R (IC121)

 

 

 

 

 

 

29

 

ADFM

O

FM signal output of the ADIP

 

30

 

ADIN

I

Receives a ADIP FM signal in AC coupling

31

 

ADAGC

I

Connected to the external capacitor for ADIP AGC

 

 

 

 

 

32

 

ADFG

O

ADIP duplex signal (22.05 kHz ± 1 kHz) output to the CXD2656R (IC121)

 

 

 

 

 

33

 

AUX

O

Auxiliary signal (I3 signal/temperature signal) output to the CXD2656R (IC121)

 

 

 

 

 

34

 

FE

O

Focus error signal output to the CXD2656R (IC121)

 

 

 

 

 

35

 

ABCD

O

Light amount signal (ABCD) output to the CXD2656R (IC121)

36

 

BOTM

O

Light amount signal (RF/ABCD) bottom hold output to the CXD2656R (IC121)

37

 

PEAK

O

Light amount signal (RF/ABCD) peak hold output to the CXD2656R (IC121)

 

 

 

 

 

38

 

RF

O

Playback EFM RF signal output to the CXD2656R (IC121)

 

 

 

 

 

39

 

RFAGC

I

Connected to the external capacitor for RF auto gain control circuit

 

 

 

 

 

40

 

AGCI

I

Receives a RF signal in AC coupling

 

 

 

 

 

 

41

 

COMPO

O

User comparator output terminal

Not used (open)

42

 

COMPP

I

User comparator input terminal

Not used (fixed at “L”)

43

 

ADDC

I

Connected to the external capacitor for cutting the low band of the ADIP amplifier

 

 

 

 

 

44

 

OPO

O

User operational amplifier output terminal Not used (open)

45

 

OPN

I

User operational amplifier inversion input terminal Not used (fixed at “L”)

 

 

 

 

 

 

46

 

RFO

O

RF signal output terminal

 

 

 

 

 

 

47

 

MORFI

I

Receives a MO RF signal in AC coupling

48

 

MORFO

O

MO RF signal output terminal

 

– 58 –

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Page 45 Page 47
Contents Supplied accessories SPECIFICATIONSSERVICE MANUAL MDS-JE530SELF-DIAGNOSISFUNCTION – 2 –– 3 – Items of Error History Mode Items and ContentsTable of Error Codes Selecting the Test ModeDISASSEMBLY TABLE OF CONTENTS6.DIAGRAMS ELECTRICAL ADJUSTMENTS– 5 – Flexible Circuit Board RepairingNotes on chip component replacement ADVARSEL– 6 – JIG FOR CHECKING BD BOARD WAVEFORMRecord Precedure – 7 –Display Precedure CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS – 8 –Precedure – 9 –RETRY CAUSE DISPLAY MODE Fig. 1 Reading the Test Mode DisplayHexadecimal nBinary Conversion Table – 10 –Reading the Display LOCATION OF CONTROLS SECTION GENERAL– 11 – This section is extracted from instruction manualPage CASE SECTION DISASSEMBLY– 13 – FRONT PANEL SECTIONMAIN BOARD – 14 –MECHANISM DECK SECTTION MDM-5D SLIDER CAM – 15 –BASE UNIT MBU-5D,BD BOARD – 16 – SW BOARD, LOADING MOTOR M103SECTION TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODE2. SETTING THE TEST MODE – 17 –– 18 – 5. SELECTING THE TEST MODE5-1.Operating the Continuous Playback Mode – 19 –5-3. Non-VolatileMemory Mode EEP MODE 6. FUNCTIONS OF OTHER BUTTONS – 20 –7. TEST MODE DISPLAYS – 21 – MEANINGS OF OTHER DISPLAYS1.PARTS REPLACEMENT AND ADJUSTMENT SECTION ELECTRICAL ADJUSTMENTS– 22 – Laser power meter 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION4. PRECAUTIONS FOR ADJUSTMENTS – 23 –Specification Checking Procedure6-2.Laser Power Check – 24 –– 25 – 6-5.C PLAY Checking MO Error Rate CheckCD Error Rate Check 6-4.Focus Bias Check10. LASER POWER ADJUSTMENT 7. INITIAL SETTING OF ADJUSTMENT VALUE9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT Setting ProcedureSpecification 11. TRAVERSE ADJUSTMENT– 27 – Adjusting Procedure– 28 – 12.FOCUS BIAS ADJUSTMENTAdjusting Procedure 13-1.CD Error Rate Check 13.ERROR RATE CHECK15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13-2.MO Error Rate Check– BD BOARDSide A – Adjustment Location– 30 – – BD BOARDSide B –– 31 – MDS-JE530 SECTION DIAGRAMS6-1.BLOCK DIAGRAM – MD SERVO Section – – 32 –– 33 – 6-2.BLOCK DIAGRAM – MAIN Section –MDS-JE530 – 34 –Note on Printed Wiring Board – 35 –Note on Schematic Diagram – 36 – • Circuit Boards Location•See page 36 for Circuit Boards Location 6-4.PRINTED WIRING BOARD – BD Board –– 38 – •Semiconductor Location– 40 – – 39 –MDS-JE530 – 42 – 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 41 – MDS-JE530– 43 – 6-7.SCHEMATIC DIAGRAM – SW Board –6-8.PRINTED WIRING BOARD – SW Board – – 44 –– 46 – 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 45 – page 36 for Circuit Boards LocationMDS-JE530 – 47 –– 48 – Page Page 41 Page– 50 – – 49 –MDS-JE530 MDS-JE530 – 51 –– 52 – • Semiconductor LocationMDS-JE530 – 53 –– 54 – Page 47 Page– 56 – •IC Block Diagrams – BD Board –– 55 – IC101M5293L – 57 –IC310 IC431– 58 – 6-14.IC PIN FUNCTION DESCRIPTION– 59 – •BD BOARD IC121 CXD2656R– 60 – – 61 – – 62 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER– 63 – – 64 – – 65 – SECTION EXPLODED VIEWS1CHASSIS SECTION 51 53 2FRONT PANEL SECTION 61 64 61 63 6166 61 61 59 54 52202 201 – 67 –3MECHANISM SECTION MDM-5D 213 207 223 207263 270 – 68 –4BASE UNIT SECTION MBU-5D 252 254 253SECTION ELECTRICAL PARTS LIST – 69 –DISPLAY – 70 –– 71 – KEY SWDISPLAY – 72 – MAINKEY SW – 73 – MAIN– 74 – MAIN– 75 – POWER SWMAIN Sony Corporation MDS-JE530– 76 – 9-928-824-11
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