Sony MZ-N10 On power sources, Polarity of the plug, Flexible Circuit Board Repairing

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MZ-N10

Ver 1.2 2003.02

Dimensions

Approx. 78.5 ⋅￿73.3 ⋅￿13.8 mm (w/h/d)

(31/8 ⋅￿3 ⋅￿9/16 in.) (excluding projecting parts and controls)

Mass

Approx. 84 g (3 oz) (including the built-in rechargeable battery)

1)The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line (analog) cable.

2)The i/LINE OUT jack connects either headphones/earphones or a line cable.

3)Measured in accordance with JEITA.

4)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.

5)When using a 100% fully charged built-inlithiun-ionrechargeable battery.

6)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan).

Supplied accessories

AC power adaptor (1) USB cradle (1)

Headphones/earphones with a remote control (1) Dedicated USB cable (1)

Dry battery case (1) Optical cable (1)

CD-ROM (SonicStage Ver. 1.5) (1)*

Carrying pouch/carrying case with a belt clip (except USA model) (1) Recordable MD (USA and Canada models only) (1)

Do not play a CD-ROM on an audio CD player.

US and foreign patents licensed from Dolby Laboratories.

Design and specifications are subject to change without notice.

SonicStage, OpenMG and the OpenMG logo, MagicGate, Memory Stick and the MagicGate Memory Stick logo, Memory Stick and the Memory Stick logo, Net MD and the Net MD logo are trademarks of Sony Corporation.

Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and /or other countries.

IBM and PC/AT are registered trademarks of International Business Machines Corporation.

Macintosh is a trademark of Apple Computer, Inc. in the United States and/ or other countries.

MMX and Pentium are trademarks or registered trademarks of Intel Corporation.

All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders.

™ and ® marks are omitted in this manual.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

On power sources

Use house current, nikel metal hydride rechargeable battery, LR6 (SG) battery, or car battery.

For use in your house: For the supplied battery charging stand, use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction

Polarity of the plug

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Flexible Circuit Board Repairing

Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C .

Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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Contents MZ-N10 ATRAC3 LP2/LP4Polarity of the plug On power sourcesFlexible Circuit Board Repairing Table of Contents Section Servicing Notes System requirementsRecorder Headphones/earphones with a remote control Section GeneralSection Disassembly Equipment can be removed using the following procedureBottom Panel Section, Jog Dial Section Upper Panel SectionMain Board Section MD Mechanism Deck MT-MZN10-181, Set ChassisOP Service Assy ABX-1R Gear SA, Gear SBHolder Assy Operation in Setting the Test Mode Section Test ModeSetting Method of Test Mode Releasing the Test ModeTransition method in manual mode Configuration of Test ModeManual Mode A n u a l011 0 6 3 B 0 011 C 6 8 S 0F F J 0 011 0 5 9 a 0R r C L R Reset the Error Display CodeL r O K ? 000 FF 000 P * * R000 000 rFF000 JOG+OK RMC OK000 JOG+ 000 JOGResOK? ResetResNV CC 021 Res742 VC1 H Power Supply Manual Adjustment741 VC1 L 743 VC2 Lo749 REG3 H 747 REG3L1748 REG3L2 Vrec LChgV L Vrec H754 3.3upc ChgV HTP1907 REG3 TP1909 REG1 Assy Power Supply Adjustment Auto Item FeedConfiguration of power supply adjustment auto item feed ADJ OKHrefPw @ LaserLrefPw @ WrPwLo @881 ###S Configuration of overall adjustment modeAdjusted values modifying procedure 882 ###SCD OK Assy11000 *** NG MO OKMO overall adjustment items 043 Res Resume clear setting methodResume ResClrPre-check Rewriting the Patch Data at Replacement of Main BoardPreparation Rewriting the patch dataMZ-N10 Confirmation of contents of the patch data rewrited Removing the set Rewriting the NV values How to get the application NVWriter for NV values rewritingRewriting the NV values MZ-N10 MZ-N10 MZ-N10 043 Remaining charging time Number of times of fully chargingSection Diagrams Block DiagramWaveforms 4Vp-pPrinted Wiring Board Main Board Side a Uses unleaded solder Semiconductor LocationMain Board Side B Uses unleaded solder Main BoardSchematic Diagrams Main Board 1/4 See page 38 for Waveforms C513 270 ∝H TC7SZ126AFE IC Block Diagrams IC302 AN17020A-VBIC502 XC62HR2202MR IC503 XC62HR2502MR IC862 R2061K01-E2 IC951 SC901582EPR2 IC Pin Function Description Xskh SensFmck XsklJoga FfclrXcsnv JogbSI3 UosciUosco SO3DVSS0 XrasXCS DVSS1Msak FVDD0FVSS0 Section Exploded Views KNOB, Balance White . . . REDBottom Panel Section US,CND,HK,KR,TW,E18,CHChassis Section 111 112 106 105 104 103MD Mechanism Deck Section MT-MZN10-181 152 153 151Main Electrical Parts List SectionMain CAP,CHIP Ceramic Resistor Switch 504 503 501 502505 507Memo Revision History Date Description of Revision