Sony MZ-N10 service manual Waveforms, 4Vp-p

Page 38

MZ-N10

 

 

 

 

 

 

 

 

 

 

 

 

 

Ver 1.2 2003.02

 

 

 

 

 

 

 

 

 

 

 

 

 

6-2. Note for Printed Wiring Board and Schematic Diagrams

 

• Waveforms

 

 

 

 

 

 

Note on Printed Wiring Board:

 

Note on Schematic Diagram:

 

1 IC801 2 (OSCO)

4 IC501 rd (TE)(SL501)

7 IC901 yd (CLK)

 

0 IC301 8 (BCLK)(REC)

X : parts extracted from the component side.

All capacitors are in µF unless otherwise noted. pF: µµF

(at the point of R806)

 

 

2.4Vp-p

 

 

Y : parts extracted from the conductor side.

 

50 WV or less are not indicated except for electrolytics

 

 

 

 

 

 

 

 

 

 

 

 

: Pattern from the side which enables seeing.

 

and tantalums.

 

 

 

 

 

 

 

 

(The other layers' patterns are not indicated.)

All resistors are in and 1/4 W or less unless otherwise

 

 

 

 

 

 

 

 

 

 

 

 

specified.

 

 

 

910mVp-p

 

 

 

 

 

Caution:

 

 

%

: indicates tolerance.

 

44.3ns

1.6Vp-p

 

 

 

2.5Vp-p

 

 

 

 

 

5.67s

 

354ns

 

Pattern face side:

Parts on the pattern face side seen from

f

: internal component.

 

 

 

 

 

 

500mV/DIV, 20ns/DIV

 

500mV/DIV, 1ms/DIV

1V/DIV, 2s/DIV

 

1V/DIV, 100ns/DIV

 

 

(Side B)

the pattern face are indicated.

C : panel designation.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parts face side:

Parts on the parts face side seen from

 

Note:

 

Note:

2 IC801 <z,/ (UOSCO)

5 IC501 rs (FE)(SL502)

8 IC862 8 (OSCOUT)

qa IC301 q; (LRCK)(REC)

 

(Side A)

the parts face are indicated.

 

 

(USB VBUS=5V)

 

 

 

 

 

 

 

 

 

 

 

The components identified by

Les composants identifiés par

 

 

 

 

 

 

 

 

 

 

 

(at the point of R823)

 

 

 

 

 

MAIN board is four-layer printed board.

 

mark 0 or dotted line with mark

une marque 0 sont critiques

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0 are critical for safety.

pour la sécurité.

 

 

 

 

 

 

 

 

However, the patterns of layers 2 and 3 have not been

 

 

 

 

 

 

 

 

 

 

Replace only with part number

Ne les remplacer que par une

 

 

 

 

 

 

 

 

included in this diagrams.

 

 

 

 

 

 

 

 

 

 

 

 

specified.

pièce portant le numéro spécifié.

 

 

240mVp-p

30.5s

1.1Vp-p

2.5Vp-p

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20.8ns

 

 

 

 

22.7 s

 

* Replacement of IC501,IC801 on MAIN board requires a

 

 

 

 

3.2Vp-p

 

 

 

 

 

 

special tool.

 

 

A : B+ Line.

 

1V/DIV, 10ns/DIV

 

500mV/DIV, 1ms/DIV

500mV/DIV, 10s/DIV

 

1V/DIV, 10s/DIV

 

 

 

 

surface

Total current is measured with MD installed.

3 IC501 9 (RFO)(TP1529)

6 IC601 qk (CLK)

9 IC301 9 (MCLK)

 

 

 

• Lead Layouts

 

Power voltage is dc 6 V and fed with regulated dc power

 

 

 

 

 

 

 

2.4Vp-p

 

 

 

 

 

 

 

 

 

supply from TP1976(+),TP1953(-) on MAIN board.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+side :TP1976(CN952 q;pin)

 

 

 

 

 

 

 

 

 

 

 

 

 

-side

:TP1953(CN952 1pin)

 

 

 

 

 

 

 

 

 

 

 

 

Voltages and waveforms are dc with respect to ground in

 

 

 

 

 

 

 

 

 

 

 

 

playback mode(servo on).

 

 

 

5.67s

 

 

 

 

 

 

 

 

 

no mark : PLAYBACK(SERVO ON)

 

1.3Vp-p

88.6ns

2.6Vp-p

 

 

 

 

 

 

 

: Impossible to measure

500mV/DIV, 200ns/DIV

1V/DIV, 2s/DIV

1V/DIV, 40ns/DIV

 

 

 

Lead layout of conventional IC

CSP (chip size package)

• Voltages are taken with a VOM (Input impedance 10 M).

 

 

 

 

 

 

 

 

Voltage variations may be noted due to normal produc-

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tion tolerances.

 

 

 

 

 

 

 

 

Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

Circled numbers refer to waveforms.

Signal path.

J : PLAYBACK

c : DIGITAL IN

F : ANALOG IN

f : RECORD

N : USB

*Replacement of IC501,IC801 on MAIN board requires a special tool.

The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

When IC851 is damaged, replace the MAIN board.

38 38

Image 38
Contents MZ-N10 ATRAC3 LP2/LP4Polarity of the plug On power sourcesFlexible Circuit Board Repairing Table of Contents Section Servicing Notes System requirementsRecorder Headphones/earphones with a remote control Section GeneralSection Disassembly Equipment can be removed using the following procedureBottom Panel Section, Jog Dial Section Upper Panel SectionMain Board Section MD Mechanism Deck MT-MZN10-181, Set ChassisOP Service Assy ABX-1R Gear SA, Gear SBHolder Assy Operation in Setting the Test Mode Section Test ModeSetting Method of Test Mode Releasing the Test ModeTransition method in manual mode Configuration of Test ModeManual Mode A n u a l011 0 6 3 B 0 011 C 6 8 S 0F F J 0 011 0 5 9 a 0R r C L R Reset the Error Display CodeL r O K ? 000 FF 000 P * * R000 000 rFF000 JOG+OK RMC OK000 JOG+ 000 JOGResOK? ResetResNV CC 021 Res742 VC1 H Power Supply Manual Adjustment741 VC1 L 743 VC2 Lo749 REG3 H 747 REG3L1748 REG3L2 Vrec LChgV L Vrec H754 3.3upc ChgV HTP1907 REG3 TP1909 REG1 Assy Power Supply Adjustment Auto Item FeedConfiguration of power supply adjustment auto item feed ADJ OKHrefPw @ LaserLrefPw @ WrPwLo @881 ###S Configuration of overall adjustment modeAdjusted values modifying procedure 882 ###SCD OK Assy11000 *** NG MO OKMO overall adjustment items 043 Res Resume clear setting methodResume ResClrPre-check Rewriting the Patch Data at Replacement of Main BoardPreparation Rewriting the patch dataMZ-N10 Confirmation of contents of the patch data rewrited Removing the set Rewriting the NV values How to get the application NVWriter for NV values rewritingRewriting the NV values MZ-N10 MZ-N10 MZ-N10 043 Remaining charging time Number of times of fully chargingSection Diagrams Block DiagramWaveforms 4Vp-pPrinted Wiring Board Main Board Side a Uses unleaded solder Semiconductor LocationMain Board Side B Uses unleaded solder Main BoardSchematic Diagrams Main Board 1/4 See page 38 for Waveforms C513 270 ∝H TC7SZ126AFE IC Block Diagrams IC302 AN17020A-VBIC502 XC62HR2202MR IC503 XC62HR2502MR IC862 R2061K01-E2 IC951 SC901582EPR2 IC Pin Function Description Xskh SensFmck XsklJoga FfclrXcsnv JogbSI3 UosciUosco SO3DVSS0 XrasXCS DVSS1Msak FVDD0FVSS0 Section Exploded Views KNOB, Balance White . . . REDBottom Panel Section US,CND,HK,KR,TW,E18,CHChassis Section 111 112 106 105 104 103MD Mechanism Deck Section MT-MZN10-181 152 153 151Main Electrical Parts List SectionMain CAP,CHIP Ceramic Resistor Switch 504 503 501 502505 507Memo Revision History Date Description of Revision