Motorola DR 3000 service manual Repair Procedures and Techniques General

Disassembly/Reassembly Procedures: Repair Procedures and Techniques — General 5-3

5.4Repair Procedures and Techniques — General

NOTE Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit boards — examples shown below) were developed and assembled using environmen- tally preferred components and solder assembly techniques to comply with the Euro- pean Union’s Restriction of Hazardous Substances (ROHS) Directive 2002/95/EC and Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. To maintain product compliance and reliability, use only the Motorola specified parts in this manual.

Any rework or repair on Environmentally Preferred Products must be done using the appropriate lead-free solder wire and lead-free solder paste as stated in the following table:

Table 5-1. Lead Free Solder Wire Part Number List

Motorola	Alloy	Flux Type	Flux Content	Melting	Supplier Part	Diameter	Weight
Part Number			by Weight	Point	number
1088929Y01	95.5Sn/3.8Ag/0.7Cu	RMA Version	2.7-3.2%	217C	52171	0.015”	1lb spool
1088929Y02	95.5Sn/3.8Ag/0.7Cu	RMA Version	2.7-3.2%	217C	52170	0.010”	0.5lb spool
1088929Y03	95.5Sn/3.8Ag/0.7Cu	RMA Version	2.7-3.2%	217C	52173	0.032”	1lb spool

Table 5-2. Lead Free Solder Paste Part Number List

Motorola Part	Manufacturer Part	Viscosity	Type	Composition & Percent Metal	Liquid
Number	Number				Temperature
1085674C03	NC-SMQ230	900-1000KCPs	Type 3	(95.5%Sn-3.8%Ag-0.7%Cu)	217°C
		Brookfield (5rpm)	(-325/+500)	89.3%

Parts Replacement and Substitution

When damaged parts are replaced, identical parts should be used. If the identical replacement part is not locally available, check the parts list for the proper Motorola part number and order the part from the nearest Motorola Radio Products and Solutions Organization listed in Appendix A of this manual.

Rigid Circuit Boards

This repeater uses bonded, multi-layer, printed circuit boards. Since the inner layers are not accessible, some special considerations are required when soldering and unsoldering components. The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise care to avoid pulling the plated circuit out of the hole.

When soldering near connector:

•Avoid accidentally getting solder in the connector.

•Be careful not to form solder bridges between the connector pins.

•Examine your work closely for shorts due to solder bridges.

6866576D03-A February 21, 2007