•Output Power—The amount of power in Watts that the subsystem is producing.
•Power Consumed—The current power consumed by the subsystem.
•Good Power Supplies—The number of power supplies that are currently operating in the subsystem.
•Wanted Power Supplies—The needed number of power supplies plus the redundant number of power supplies in the subsystem.
•Needed Power Supplies—The number of power supplies needed for the subsystem to work properly.
Thermal Information
The Thermal Information data table contains:
•Redundancy—The status of thermal subsystem redundancy: either in a redundant configuration, not in a redundant configuration, or status unknown.
•Ambient Temperature—The temperature inside the enclosure.
•Good Fans—The number of fans currently operating in the enclosure.
•Wanted Fans—The needed number of fans plus the redundant number of fans.
•Needed Fans—Number of fans required for the subsystem not to overheat.
Fan Information
The Fan Information table contains, for each fan bay:
•Bay—The location of the fan.
•Status—The current status of the fan.
•Name—The HP product name of the fan.
•Speed—Fan speed for thermal management of server.
•Power—The amount of power currently being consumed by the fan.
•Part Number—The HP fan part number.
•Spare Part Number—The HP fan spare part number.
Power Supplies
The Power Supplies table contains, for each power supply bay:
•Bay—The location of the power supply.
•Status—The current status of the power supply.
•Name—The HP product name of the power supply.
•Power—The amount of power currently supplied and the total amount of power that can be supplied.
•Serial Number—The HP serial number for the power supply.
•Part Number—The HP part number for the power supply.
•Spare Part Number—The HP spare part number for the power supply.
Interconnect trays
The Interconnect Trays table contains, for each interconnect bay:
•Bay—The number of the bay containing the interconnect tray.
•Status—The current status of the enclosure tray.
•Name—The HP product name of the interconnect module.
•Power—The amount of power currently being used by the interconnect module.