HP BladeSystem Enclosure technologies manual Connecting with no power redundancy configured

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Connecting with no power redundancy configured

Connecting with no power redundancy configured

If no power redundancy is configured, the total power available is defined as the power available from all power supplies installed (six power supplies installed = up to 7200W). Any power supply or AC line failure may cause the system to power off.

The Onboard Administrator manages power allocation rules of various components and can limit overall power capacity for the enclosure. More information on power management is available in the technology brief entitled “Managing the HP BladeSystem c-Class,” which is available at this URL: www.hp.com/servers/technology.

Dynamic Power Saver mode

Dynamic Power Saver mode provides power load shifting for maximum efficiency and reliability. Dynamic Power Saver technology, first introduced with the BladeSystem p-Class1U power enclosure, maximizes power supply efficiency to provide real customer power savings that result in capital savings. Power supply efficiency is simply a measure of AC watts input in versus DC watts out: At 50 percent efficiency, 2000W in would equal 1000W out. The difference is wasted energy, which generates unnecessary heat.

Dynamic Power Saver mode is active by default since it saves power in the majority of situations. When enabled, Dynamic Power Saver mode saves power by running the required power supplies at a higher rate of utilization and putting unneeded power supplies in a standby mode. Dynamic Power Saver uses the fact that most power supplies will operate less efficiently when lightly loaded and more efficiently when heavily loaded. A typical power supply running at 20 percent load could have an efficiency rating as low as 60 percent. However, at 50 percent load it could be up to 90 percent efficient, providing a significant savings in power consumption.

Dynamic Power Saver is enabled by the Onboard Administrator module. When this feature is enabled, the total enclosure power consumption is monitored in real-time and automatically adjusted with changes in demand.

NOTE

In redundant environments, a minimum of two power supplies are always active, and the maximum load that can be reached on any power supply is 50 percent. Once the 50 percent load is reached, another two power supplies are activated to ensure that redundancy is maintained at all times.

Power Regulator

HP’s ProLiant Power Regulator provides iLO-controlled speed stepping for Intel x86 processors. The Power Regulator feature improves server energy efficiency by giving processors full power for applications when they need it and reducing power when they do not. This power management feature enables ProLiant servers with policy-based power management to control processor power states. Power Regulator can be configured for continuous, static low power mode or for Dynamic Power Savings mode in which power is automatically adjusted to match processor demand. Additional information on the HP Power Regulator is provided in the paper titled “Power Regulator for ProLiant servers,” available at www.hp.com/servers/power-regulator.

Power Capping for each server blade

Using updated iLO 2 firmware (version 1.30) and updated System ROM/BIOS (dated May 1, 2007), HP BladeSystem c-Class server blades now have the ability to limit the amount of power consumed. Customers can set a limit in watts or BTUs per hour. The purpose of this limit is to constrain the amount of power consumed, which reduces the heat output into the data center. The iLO 2 firmware monitors

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Contents technology brief HP BladeSystem c3000 Enclosure technologiesOverview of HP BladeSystem c3000 Enclosure AbstractPage HP Thermal Logic technologies Active Cool fans Figure 4. HP BladeSystem c3000 self-sealing enclosure HP PARSEC architectureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Interconnect options and infrastructureFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Enclosure-based DVD ROM Onboard AdministratorPage Insight Display Enclosure link cabling Command-line interfaceOnboard Administrator cabling Web GUISummary RecommendationsThe following acronyms are used in the text of this document Appendix A. Acronyms in textAppendix B. Fan, power supply, and device bay population guidelines All power supply bays filled Table B-1. Power supply placementNumber of power supplies Power supply bays usedPage 8 half-height server blades with both full-height dividers installed Page Send comments about this paper to TechCom@HP.com For more informationCall to action For additional information, refer to the resources listed below