HP BladeSystem Enclosure technologies manual Mezzanine 1 and Interconnect Bay

Contents technology brief HP BladeSystem c3000 Enclosure technologiesOverview of HP BladeSystem c3000 Enclosure AbstractPage HP Thermal Logic technologies Active Cool fans Figure 4. HP BladeSystem c3000 self-sealing enclosure HP PARSEC architectureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Interconnect options and infrastructureFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Enclosure-based DVD ROM Onboard AdministratorPage Insight Display Enclosure link cabling Command-line interfaceOnboard Administrator cabling Web GUISummary RecommendationsThe following acronyms are used in the text of this document Appendix A. Acronyms in textAppendix B. Fan, power supply, and device bay population guidelines All power supply bays filled Table B-1. Power supply placementNumber of power supplies Power supply bays usedPage 8 half-height server blades with both full-height dividers installed Page Send comments about this paper to TechCom@HP.com For more informationCall to action For additional information, refer to the resources listed below