HP BladeSystem Enclosure technologies manual Appendix A. Acronyms in text

Page 22
Appendix A. Acronyms in text

Appendix A. Acronyms in text

The following acronyms are used in the text of this document.

Table A-1. Acronyms

Acronym

Acronym expansion

 

 

AC

Alternating current

 

 

BTU

British thermal unit

 

 

CFM

Cubic feet per minute

 

 

CLI

Command line interface

 

 

DC

Direct current

 

 

DDR

Double data rate

 

 

FC

Fibre Channel

 

 

IB

InfiniBand

 

 

iLO

Integrated Lights Out

 

 

iSCSI

Internet Small Computer System Interface

 

 

KVM

Keyboard, video, mouse

 

 

LAN

Local area network

 

 

LED

Light emitting diode

 

 

NIC

Network interface card

 

 

OA

Onboard Administrator

 

 

PARSEC

Parallel, redundant, scalable enclosure cooling

 

 

PCIe

PCI Express

 

 

PDU

Power distribution unit

 

 

PSU

Power supply unit

 

 

SAN

Storage area network

 

 

SAS

Serial attached SCSI

 

 

U

Unit of measurement for rack-mount equipment (1U is 1.75

 

inches or 4.44cm)

 

 

UID

Unit identification

 

 

UPS

Uninterruptible power supply

 

 

VA

Volt-ampere

 

 

W

Watt

 

 

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Contents HP BladeSystem c3000 Enclosure technologies technology briefAbstract Overview of HP BladeSystem c3000 EnclosurePage HP Thermal Logic technologies Active Cool fans HP PARSEC architecture Figure 4. HP BladeSystem c3000 self-sealing enclosureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Interconnect options and infrastructure Figure 9. Diagram of the HP BladeSystem c3000 signal midplaneFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Onboard Administrator Enclosure-based DVD ROMPage Insight Display Web GUI Command-line interfaceOnboard Administrator cabling Enclosure link cablingRecommendations SummaryAppendix A. Acronyms in text The following acronyms are used in the text of this documentAppendix B. Fan, power supply, and device bay population guidelines Power supply bays used Table B-1. Power supply placementNumber of power supplies All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page For additional information, refer to the resources listed below For more informationCall to action Send comments about this paper to TechCom@HP.com