Figure 2. HP BladeSystem c3000 Enclosure – rear view
HP Thermal Logic technologies
HP BladeSystem c-Class products have been designed with a variety of HP Thermal Logic technologies―a set of technologies integrated across server blades, enclosures, and interconnect modules―all of which combined provide significant power and cooling benefits in comparison to traditional rack and tower based servers. HP BladeSystem products reduce overall demand for power and cooling by as much as 40 percent compared to standard rack and tower based servers. Thermal Logic is the term that HP uses to define the mechanical design features, built-in intelligence, and control capabilities throughout the BladeSystem c-Class. Thermal Logic technologies enable IT administrators to make the most of the power and thermal environments. They provide an instant view of power usage and temperature at the server, enclosure, or rack level. Thermal Logic technologies automatically adjust power and thermal controls to minimize power and cooling usage while maintaining adequate cooling for all devices and ensuring high availability.
HP Thermal Logic technologies include the following elements and capabilities:
•Active Cool fans
•Parallel Redundant Scalable Enclosure Cooling (PARSEC) design
•Instant power and thermal monitoring
•Pooled power for a variety of power redundancy modes
•Dynamic Power Saver mode
•Power Regulator
•Power workload balancing
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